公开(公告)号：US20090095511A1

公开(公告)日：2009-04-16

申请号：US12173371

申请日：2008-07-15

Applicant: Kenji IIDA ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

Inventor： Kenji IIDA ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K9/00 ,  H05K3/38 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/2072 ,  Y10T29/49155

Abstract: The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.

Abstract translation: 即使基部构件和电缆层的热膨胀系数明显不同，电路板也能够将基座构件上的电缆层紧密接合。 电路板包括：基座部件; 并且所述电缆层被层压在所述基底构件上，所述锚固图案是形成在所述基底构件的表面上的导电层。

公开(公告)号：US20090094825A1

公开(公告)日：2009-04-16

申请号：US12175732

申请日：2008-07-18

Applicant: Yasutomo MAEHARA ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

Inventor： Yasutomo MAEHARA ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC: H05K3/02

CPC classification number: H05K3/427 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0347 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  H05K2203/135 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.

Abstract translation: 制造基板的方法包括以下步骤：在基底构件中形成通孔; 电镀所述基底构件以便用镀层涂覆所述通孔的内表面; 在基底上施加光刻胶; 对光致抗蚀剂进行光学曝光和显影，以形成至少覆盖通孔的平面区域的抗蚀剂图案; 以及蚀刻形成在所述基底构件的表面上的导电层。 形成抗蚀剂图形，以将导电层暴露出距通孔边缘规定距离的区域，并且规定的长度比蚀刻导电层的侧面的距离长 步。

公开(公告)号：US20090061182A1

公开(公告)日：2009-03-05

申请号：US11911555

申请日：2006-05-01

Applicant: Yoshimasa Chikama

Inventor： Yoshimasa Chikama

IPC: B32B7/02 ,  B29C35/08

CPC classification number: H01L23/145 ,  G02F1/133305 ,  G02F2201/50 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0366 ,  H05K3/0055 ,  H05K2201/0129 ,  H05K2201/09581 ,  Y10T428/10 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A plastic substrate includes resin and glass fibers. In an end surface of the substrate, interfaces between the glass fibers and the resin are covered with a solidified melt of the glass fibers.

Abstract translation: 塑料基板包括树脂和玻璃纤维。 在基板的端面中，玻璃纤维和树脂之间的界面用玻璃纤维的固化熔体覆盖。

公开(公告)号：US20080261396A1

公开(公告)日：2008-10-23

申请号：US12061768

申请日：2008-04-03

Applicant: Takaharu YAMANO

Inventor： Takaharu YAMANO

IPC: H01L21/4763 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4605 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/1105 ,  H05K2203/1383 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A disclosed substrate is composed of a base member having a through-hole, a penetrating via provided in the through-hole, and a wiring connected to the penetrating via. The penetrating via includes a penetrating part having two ends on both sides of the base member, which is provided in the through-hole, a first protrusion protruding from the base member, which is formed on a first end of the penetrating part so as to be connected to the wiring, and a second protrusion protruding from the base member, which is formed on a second end of the penetrating part. The first protrusion and second protrusion are wider than a diameter of the through-hole.

Abstract translation: 所公开的基板由具有通孔的基部构件，设置在通孔中的贯通孔以及与贯通孔连接的配线构成。 贯通孔包括贯通部，该贯通部在基部构件的两侧设置有设置在贯通孔中的两端，从基体突出的第一突起，该第一突起形成在贯通部的第一端上，从而 连接到布线，以及形成在穿透部的第二端上的从基部构件突出的第二突起。 第一突起和第二突起比通孔的直径宽。

公开(公告)号：US07297878B2

公开(公告)日：2007-11-20

申请号：US10499978

申请日：2003-12-22

Applicant: Hiroshi Kushitani ,  Ichiro Kameyama

Inventor： Hiroshi Kushitani ,  Ichiro Kameyama

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01P1/047 ,  H01F27/34 ,  H01L2223/6616 ,  H01L2223/6622 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0029 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0187 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/107 ,  Y10T29/435 ,  Y10T29/4902

Abstract: The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object thereof is to downsize the high frequency laminated component. To achieve the object, according to the high frequency laminated component of the present invention, dielectric layer (4) whose dielectric constant is lower than that of other areas is formed around via-hole electrode (3) in a dielectric. By forming dielectric layer (4) having a low dielectric constant, electric interference between via-hole electrode (3) and circuit electrode (22) is restrained, so that the circuit electrode and the via-hole electrode can be formed more closely each other compared with a conventional one. As a result, the high frequency laminated component can be downsized.

Abstract translation: 本发明涉及用于无线通信装置等高频装置的高频层叠部件及其制造方法。 其目的是减小高频层压部件的尺寸。 为了实现该目的，根据本发明的高频层叠部件，在电介质中的通孔电极（3）的周围形成介电常数低于其他面积的介质层（4）。 通过形成具有低介电常数的介电层（4），可以抑制通孔电极（3）和电路电极（22）之间的电气干扰，使得电路电极和通孔电极可以彼此更紧密地形成 与传统的相比。 结果，可以使高频层叠部件小型化。

公开(公告)号：US20070240901A1

公开(公告)日：2007-10-18

申请号：US11812124

申请日：2007-06-15

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07246435B2

公开(公告)日：2007-07-24

申请号：US11138467

申请日：2005-05-27

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H01K3/10

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07100275B2

公开(公告)日：2006-09-05

申请号：US10893938

申请日：2004-07-20

Applicant: Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

Inventor： Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

IPC: H05K3/36

CPC classification number: H05K3/4069 ,  H05K3/0023 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.

Abstract translation: 制造多层布线板的方法包括以下步骤：对感光树脂进行曝光和显影处理以形成具有预定尺寸和形状的孔; 在形成有孔的绝缘层上沉积和形成固化树脂，以便掩埋孔，进行热处理以在绝缘层的表面上形成固化树脂的固化薄膜; 从而除去固化树脂以留下固化的薄膜，以通过固化的薄膜获得具有减小的开口尺寸的通孔。

公开(公告)号：US20060185141A1

公开(公告)日：2006-08-24

申请号：US11410984

申请日：2006-04-26

Applicant: Toshiaki Mori ,  Kazunori Nakamura ,  Satoru Kuramochi ,  Miyuki Akazawa ,  Koichi Nakayama

Inventor： Toshiaki Mori ,  Kazunori Nakamura ,  Satoru Kuramochi ,  Miyuki Akazawa ,  Koichi Nakayama

IPC: H01G7/00 ,  H01K3/10

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/162 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/388 ,  H05K3/4061 ,  H05K3/4069 ,  H05K3/4076 ,  H05K3/426 ,  H05K3/4605 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/09763 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/1338 ,  H05K2203/1581 ,  Y10T29/43 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

公开(公告)号：US07084350B2

公开(公告)日：2006-08-01

申请号：US10492695

申请日：2002-09-30

Applicant: Claudio De La Prieta ,  Andreas Hachtel ,  Thomas Schulte ,  Uwe Glanz ,  Erhard Hirth

Inventor： Claudio De La Prieta ,  Andreas Hachtel ,  Thomas Schulte ,  Uwe Glanz ,  Erhard Hirth

IPC: H01B17/58

CPC classification number: B32B18/00 ,  B32B2315/02 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/80 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09581 ,  H05K2203/033

Abstract: A green ceramic insert having a green ceramic body provided with a recess extending through the ceramic body is provided, the recess being filled with a paste which may be converted into an electrical plated hole. A ceramic insert made from a sintered green ceramic insert of this type is also described. In addition, a ceramic green body or a green body composite is provided, which has at least one recess in some areas, into which one of the described green ceramic inserts is inserted. The ceramic insert may be integrally joined to the laminated composite, a conductive paste converted by sintering into a printed conductor being routed on the laminated composite in a manner electrically insulated from it, and electroconductively connecting the top of the laminated composite to its bottom via the electrical plated hole.

Abstract translation: 提供了具有延伸穿过陶瓷体的凹部的具有生坯陶瓷体的绿色陶瓷插入件，该凹部填充有可以转化为电镀孔的浆料。 还描述了由这种类型的烧结的生坯陶瓷插入物制成的陶瓷插入件。 此外，提供陶瓷生坯或生坯复合体，其在一些区域中具有至少一个凹部，所述生坯陶瓷插入件中的一个插入其中。 陶瓷插入件可以整体地接合到层压复合材料上，通过烧结转化成印刷导体的导电膏以层压复合材料的方式与其电绝缘的方式布线，并且经由该层压复合材料的顶部经由 电镀孔。