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    A SIGNAL TRANSITION COMPONENT
    161.
    发明公开
    A SIGNAL TRANSITION COMPONENT 审中-公开
    信号转换组件

    公开(公告)号：EP3195703A1

    公开(公告)日：2017-07-26

    申请号：EP14758557.4

    申请日：2014-09-02

    Applicant: Telefonaktiebolaget LM Ericsson (publ)

    Inventor： LIGANDER, Per ,  LARSSON, Ingolf ,  BERGSTEN, Tomas ,  NYSTRÖM, Olle ,  WESTIN, Torbjörn

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0242 ,  H01P5/085 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/184 ,  H05K3/4038 ,  H05K3/42 ,  H05K2201/0784 ,  H05K2201/10583

    Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.

    Abstract translation: 本发明涉及具有第一信号导体侧（2）和第二信号导体侧（3）的微波信号转换部件（1）。 信号转换部件（1）被布置用于将微波信号从第一信号导体侧（2）传送到第二信号导体侧（3）。 传递部件（1）包括至少一个至少部分地沿周向延伸的导电框架（4），至少部分地定位在所述导电框架（4）内的介电填充物（5），至少一个填充孔（6; （6; 6a，6b），所述导电连接（7; 7a，7b）至少部分地位于所述填充孔（6; 6a，6b）内， 图6b）。 本发明还涉及一种根据上述的用于制造微波信号转变部件的方法。

    CAPACITOR HOLDER AND CAPACITOR HOLDING STRUCTURE
    162.
    发明公开
    CAPACITOR HOLDER AND CAPACITOR HOLDING STRUCTURE 审中-公开
    KONDENSATORHALTER UND KONDENSATORHALTESTRUKTUR

    公开(公告)号：EP2919565A1

    公开(公告)日：2015-09-16

    申请号：EP13852709.8

    申请日：2013-10-29

    Applicant: Kitagawa Industries Co., Ltd.

    Inventor： NAKAMURA, Tatsuya

    IPC: H05K1/18 ,  H01G2/06

    CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10583 ,  H05K2201/10606

    Abstract: A capacitor holder comprises: a holding portion made of a resin to have a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface while elastically deforming the resin; a fixed portion formed of the resin integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor formed of the resin as a part of the fixed portion and configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.

    Abstract translation: 电容器保持器包括：由树脂制成的具有圆柱形内壁表面的保持部分，所述内壁表面的至少外周部分是敞开的，所述保持部分构造成将通过所述开口插入的电容器保持在内部 的内壁表面，同时使树脂弹性变形; 由所述树脂与所述保持部一体形成并与所述保持部的开口相对定位的固定部; 一对嵌合槽，形成在所述固定部分的一对相对于所述保持部分相对的端面处，所述嵌合槽被构造成与所述印刷电路板的端部边缘适配地接合以沿着所述印刷电路板的表面延伸 电路板; 以及由作为固定部分的一部分的树脂形成的接近抑制器，并且被构造成抑制形成有嵌合槽的固定部分的彼此接近的部分。

    Electronic apparatus
    164.
    发明公开
    Electronic apparatus 有权
    电子设备

    公开(公告)号：EP1883282A2

    公开(公告)日：2008-01-30

    申请号：EP07014532.1

    申请日：2007-07-24

    Applicant: Denso Corporation

    Inventor： Kawabata, Akira ,  Fukaya, Yuichiro

    IPC: H05K3/30 ,  H05K5/02

    CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

    Abstract: An electronic apparatus include a housing a circuit board held in the housing , and large electronic components held in the housing and electrically coupled to the circuit board . The housing has a mounting surface and the electronic apparatus is mounted to an object at the mounting surface , The large electronic components are arranged in a three-dimensional manner with respect to the mounting surface in such a manner that at least one of the large electronic components overlaps at least one of the large electronic components in a direction toward the mounting surface ,

    Abstract translation: 一种电子设备包括壳体，保持在壳体中的电路板以及保持在壳体中并电耦合到电路板的大型电子部件。 壳体具有安装表面，并且电子设备在安装表面处被安装到物体上。大型电子部件相对于安装表面以三维方式布置，使得至少一个大型电子设备 部件在朝向安装表面的方向上与至少一个大型电子部件重叠，

    Mounting substrate and microphone mounted thereon
    166.
    发明公开
    Mounting substrate and microphone mounted thereon 有权
    将基板和麦克风安装在其上

    公开(公告)号：EP1742507A2

    公开(公告)日：2007-01-10

    申请号：EP06014139.7

    申请日：2006-07-07

    Applicant: HOSIDEN CORPORATION

    Inventor： Izuchi, Toshiro c/o Hosiden Kyushu Corp. ,  Ono, Kazuo c/o Hosiden Kyushu Corp. ,  Nakanishi, Kensuke c/o Hosiden Kyushu Corp. ,  Onishi, Hiroaki c/o Hosiden Kyushu Corp.

    IPC: H04R19/00

    CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

    Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate.
    A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below. That is, the electrode formed on the mounting substrate includes a central electrode part that faces the central terminal, a plurality of outer electrode parts that face part of the peripheral terminal, and a linkage electrode part that interconnects the outer electrode parts. The solder part is formed on each of the central electrode part and the outer electrode parts. The gas-escape groove is configured to allow the gas inside the peripheral terminal to escape to the outside.

    Abstract translation: 为了提供需要减少焊料量并降低电子元件内部上焊料的热效应的安装基板，以及将安装在基板上的麦克风。 根据本发明的安装基板包括：形成在形成在安装基板上的电极的一部分上的焊料部分; 抗蚀剂膜，其形成为防止焊料部分的焊料流出预定范围; 以及由不存在电极和抗蚀剂膜构成的气体逸出槽，并允许在焊接期间产生的气体逸出。 在具有中央端子和周边端子的部件安装在安装基板上的情况下，安装基板的每个部分具有下述特征。 即，形成在安装基板上的电极包括面对中心端子的中心电极部分，面对外围端子的一部分的多个外部电极部分以及将外部电极部分互连的连接电极部分。 焊料部分形成在中心电极部分和外部电极部分中的每一个上。 排气槽构造成允许外围端子内的气体逸出到外部。

    Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei einer T-förmigen oder L-förmigen Leiterplattenkonfiguration
    167.
    发明公开
    Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei einer T-förmigen oder L-förmigen Leiterplattenkonfiguration 审中-公开
    在T形或L形电路板结构中制造导电连接的方法

    公开(公告)号：EP1624736A2

    公开(公告)日：2006-02-08

    申请号：EP05106647.0

    申请日：2005-07-20

    Applicant: SIEMENS AKTIENGESELLSCHAFT

    Inventor： Eßmann, Klaus ,  Gelbhaar, Ulrich ,  Hentschel, Matthias

    IPC: H05K1/14

    CPC classification number: H05K3/366 ,  H05K3/3442 ,  H05K2201/10583

    Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei T-förmigen oder L-förmigen Leiterplattenkonfiguration mit mindestens zwei rechtwinklig aufeinander stehenden Leiterplatten (4, 5). Eine hohe Packungsdichte elektronischer Bauelemente auf den Leiterplatten (4, 5) wird dadurch erreicht, dass in dem Winkelbereich zwischen den beiden Leiterplatten (4, 5) MELF (Metal Electro-de Face)-Connectoren (1) eingelötet werden, deren Metallkappen (3) jeweils mittels winkelförmig angeordneter Lötpads (6) beide Leiterplatten (4, 5) kontaktieren.

    Abstract translation: 本发明涉及一种用于制造具有T形或L形的电路板结构具有至少两个互相垂直的印刷电路板的导电连接的处理（4，5）。 在电路板上的电子元件的高填充密度（4,5）在两个电路板之间的角度范围得以实现（4，5）MELF（金属电解面）-Connectoren（1）被焊接，所述金属盖（3 ）通过两个电路板（4,5）的角度设置的焊盘（6）彼此接触。

    Fuse holder component
    168.
    发明公开
    Fuse holder component 有权
    Sicherungshalterelement

    公开(公告)号：EP1513179A1

    公开(公告)日：2005-03-09

    申请号：EP03023293.8

    申请日：2003-10-15

    Applicant: KYOSHIN KOGYO CO., LTD

    Inventor： Kitajima, Yoshikazu, Kawagoe Plant ,  Nishimura, Iwao, Goshogawara Plant ,  Ito, Koji, Goshogawara Plant

    IPC: H01H85/20

    CPC classification number: H01R43/205 ,  H01H85/202 ,  H01H2085/2085 ,  H01R4/4809 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/1084 ,  Y02P70/611

    Abstract: A fuse holder component (1) includes a bottom plate (11) fixed to a printed board, and first and second side plates (12,13) whose main body portions individually extend from side edges of the bottom plate (11). The second side plate includes a suction portion (13e) extending through an extension portion from the main body portion and provided with a suction surface (13f) to which a suction nozzle of a mounter is accessible. A pair of fuse holder components, surface-mounted on the printed board by using the mounter, constitute a fuse holder that stably holds a glass-tube fuse.

    Abstract translation: 熔断器保持器部件（1）包括固定到印刷电路板的底板（11）和主体部分分别从底板（11）的侧边缘延伸的第一和第二侧板（12,13）。 第二侧板包括从主体部分延伸穿过延伸部分并且设置有吸附表面（13f）的抽吸部分（13f），安装器的吸嘴可接近该吸力表面。 通过使用安装器表面安装在印刷电路板上的一对保险丝座组件构成了可以稳定地保持玻璃管保险丝的保险丝座。

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