公开(公告)号：EP2099269A1

公开(公告)日：2009-09-09

申请号：EP09001910.0

申请日：2009-02-11

Applicant: Joinset Co. Ltd.

Inventor： Kim, Sun-ki ,  Cho, Sung-Ho ,  Cheon, Han-Jin ,  Yeo, Hwan-Min

IPC: H05K3/40 ,  H05K9/00

CPC classification number: H05K3/4015 ,  H01R12/57 ,  H01R12/714 ,  H01R13/24 ,  H05K3/222 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/083

Abstract: Provided is a solderable elastic electric contact terminal. The solderable elastic electric contact terminal includes a tube-shaped insulating elastic core, an insulating non-foam rubber coating layer adhered to the insulating elastic core to surround the insulating elastic core, and a heat-resistant polymer film having one surface adhered to the insulating non-foam rubber coating layer to surround the insulating non-foam rubber coating layer, and another surface integrally provided with a metal layer.

Abstract translation: 提供了可焊接的弹性电接触端子。 可焊接弹性电接触端子包括管状绝缘弹性芯，粘附到绝缘弹性芯上以包围绝缘弹性芯的绝缘非泡沫橡胶涂层，以及耐热聚合物膜，其一个表面粘附到绝缘 非泡沫橡胶涂层包围绝缘的非泡沫橡胶涂层，以及一体地设置有金属层的另一表面。

公开(公告)号：EP1973119A2

公开(公告)日：2008-09-24

申请号：EP07291508.5

申请日：2007-12-12

Applicant: Toray Saehan Inc.

Inventor： Sim, Chang-Hoon ,  Jun, Hae-Sang ,  Moon, Ki-Jeong

IPC: H01B1/22

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/083 ,  H05K2203/104

Abstract: The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.

Abstract translation: 本发明涉及用于粘附IC的各向异性导电膜，例如LCD显示器等。导电膜的特征在于包括热固性粘合剂，超顺磁性金属氧化物纳米颗粒和导电颗粒，超顺磁性金属氧化物纳米 颗粒和导电颗粒分散在热固性组合物中。 通过本发明的这样的结构，通过高频率实现低温固化是有利的，并且可以通过粘附IC（例如LCD显示器）中的磁场来控制颗粒的位置，使得高连接可靠性 实现了细间距连接电极。

公开(公告)号：EP1963455A1

公开(公告)日：2008-09-03

申请号：EP06820829.7

申请日：2006-08-10

Applicant: Electrovac AG

Inventor： TANG, Xinhe ,  TSE, Ka, Chun ,  HAMMEL, Ernst ,  TANG, Ben, Zhong

IPC: C09J163/00 ,  B32B7/12 ,  B32B27/20

CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/40 ,  B32B2255/26 ,  B32B2262/02 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2307/208 ,  B32B2307/302 ,  B82Y10/00 ,  B82Y30/00 ,  C08K7/02 ,  C08K2201/011 ,  C09J11/00 ,  H01L23/373 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249942 ,  Y10T428/31515 ,  H01L2924/00

Abstract: Disclosed is a multilayer material in which at least two components are joined to each other via an adhesive bond. Said adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

公开(公告)号：EP1051265A4

公开(公告)日：2004-04-07

申请号：EP99905459

申请日：1999-01-29

Applicant: HENKEL LOCTITE CORP

Inventor： MCARDLE CIARAN B ,  BARNES RORY B

IPC: B05D5/12 ,  B05D3/06 ,  B05D3/14 ,  B05D7/00 ,  B05D7/04 ,  C08F2/46 ,  C08F2/48 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F1/00 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/32

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

公开(公告)号：EP1156711A1

公开(公告)日：2001-11-21

申请号：EP01102293.6

申请日：2001-02-01

Applicant: Koppe, Franz

Inventor： Koppe, Franz

IPC: H05K9/00

CPC classification number: H05K9/0083 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0233 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/083 ,  H05K2201/086 ,  H01L2924/00

Abstract: Die Erfindung betrifft eine Verguss- oder Einbettmasse für elektronische Bauelemente zur Abschirmung von elektromagnetischer Strahlung. Die Vergussmasse besteht aus einer polymerem Matrix, die 5 bis 95 Gew.-% elektrisch nicht leitende, magnetische Partikel mit einer mittleren Partikelgröße im Bereich von 1 bis 250 µm enthält.

Abstract translation: 铸造或包埋在聚合物基质包含5-95％（重量）非导电具有上的1-250微米米平均粒径磁性颗粒组成besteht。 优选的特点：该矩阵包含软磁性粒子。 该组合物的厚度为0.1-50毫米。

公开(公告)号：EP0952761A1

公开(公告)日：1999-10-27

申请号：EP97924293.0

申请日：1997-05-30

Applicant: ROHM CO., LTD.

Inventor： NAKAMURA, Satoshi, Rohm Co., Ltd.

IPC: H05K3/34

CPC classification number: H05K3/3405 ,  H01R12/52 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09909 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  H05K2203/104 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: There are provided a coating step for coating solder paste (3) onto the circuit board (1), a superimposing step for superimposing a connecting end (4a) of a terminal (4) also having a non-connecting end (4b) on the regions coated with solder paste (3), and a heating step for heating and melting the solder paste (3) in order to solder the connecting end (4a) onto the circuit board (1). A further step for coating adhesive material (6) onto the circuit board (1) is provided, and in the aforementioned superimposing step, the connecting end (4a) is brought into contact with the regions coated with the adhesive material (6). In the aforementioned heating step, the solder paste (3) is heated and caused to melt whilst the connecting end (4a) is in a bonded state with respect to the circuit board (1) by means of the adhesive material (6).

Abstract translation: 本发明提供在电路板上涂布焊膏（3）的涂布工序（1），对于一个终端的叠加的连接端（4a）的一个重叠工序（4），因此具有在非连接端（4b）的 为了焊接的连接端（4a）的在电路板上涂上焊膏（3），和用于加热的加热工序和熔化焊料膏（3）区域（1）。 用于在电路板（1）涂覆胶粘材料（6）的另一步骤被提供，并且在上述叠加步骤中，将连接端（4a）的被带入与涂有粘接材料的区域（6）接触。 在上述加热步骤中，焊膏（3）被加热以熔化并引起而连接端（4a）的通过粘接材料的装置处于接合状态相对于所述电路板（1）（6）。

公开(公告)号：EP0757407A1

公开(公告)日：1997-02-05

申请号：EP96305657.7

申请日：1996-07-31

Applicant: LOCTITE (IRELAND) LIMITED

Inventor： McArdle, Ciaran Bernard ,  Burke, Joseph

IPC: H01R4/04 ,  H01F1/44

CPC classification number: H05K3/323 ,  H01F41/16 ,  H01R4/04 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/90 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/257

Abstract: An anisotropically-conductive film or a substrate having a surface coated with an anisotropically-conductive coating, said film or coating being formed by solidifying a composition comprising

(i) a solidifiable ferrofluid composition, the ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-magnetic carrier, and
(ii) a plurality of electrically-conductive particles, dispersed in the ferrofluid,

   the electrically-conductive particles having been arrayed in a non-random pattern by application of a substantially uniform magnetic field to the composition in a liquid state and having been locked in position by solidification of the composition.
The composition is solidified in an A-stage, usually involving a primary cure. In end-use application of the film or coating, the composition usually undergoes a B-stage or secondary cure. The film or coated substrate is an article of manufacture for bonding conductors in the electronics industry.

Abstract translation: 各向异性导电膜或具有涂覆有各向异性导电涂层的表面的基底，所述膜或涂层通过固化组合物形成，所述组合物包含（i）可固化的铁磁性液体组合物，所述铁磁流体包含非铁性磁性颗粒的胶态悬浮液， 磁性载体，和（ii）分散在铁磁流体中的多个导电颗粒，导电颗粒以非随机图案排列，通过向液体状态的组合物施加基本上均匀的磁场 并通过组合物的固化被锁定在适当的位置。 组合物在A阶段中固化，通常涉及初级固化。 在膜或涂层的最终应用中，组合物通常经历B阶段或二次固化。 膜或涂覆的基底是用于在电子工业中接合导体的制品。

公开(公告)号：EP0687137A2

公开(公告)日：1995-12-13

申请号：EP95303635.7

申请日：1995-05-30

Applicant: AT&T Corp.

Inventor： Jin, Sungho ,  McCormack, Mark Thomas

IPC: H05K3/34 ,  B23K35/02

CPC classification number: B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613 ,  H01L2924/00

Abstract: Electronic devices having at least two components (53,55) with mating contact pads (52,54) are provided with high-aspect-ratio solder joints between the mating pads. These joints are formed by placing a composite solder medium (51) containing solder wires (56) in an electrically insulating matrix (57) such that at least two solder wires (56) are in contact with the mating pads (52,54), and fusing the wires (56) to the pads. The insulating matrix (57) with remainder of solder wires (56) is then optionally removed from between the said at least two components (53,55). The composite solder medium (51) is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract translation: 具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与其直径的长宽比的高纵横比。 或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁性地对准到横向于绝缘矩阵的列并且充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

公开(公告)号：EP0206620B1

公开(公告)日：1992-08-26

申请号：EP86304394.9

申请日：1986-06-09

Applicant: METCAL INC.

Inventor： Krumme, John F. ,  Cowell, Mark J.

IPC: H02G5/02 ,  H01R43/02

CPC classification number: H02G5/02 ,  H01R43/02 ,  H01R43/0242 ,  H05K1/0212 ,  H05K1/0242 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/083 ,  H05K2201/10272 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1115

Abstract: A self-heating and self-soldering bus bar for use in many applications. The pins of the bus bar are quickly and directly heated to a predetermined autoregulated temperature without significantly raising the temperature of the body of the bus. Thusly a bus bar may be mounted while maintaining thermal balance and mechanical integrity of all work pieces. The present invention avoids the problems normally associated with excess thermal expansion experienced when a bus bar is heated incidental to the heating of its contact points. A majority of this incidental heating is eliminated by direct quick heating of the mounting pins.

公开(公告)号：EP0402546A3

公开(公告)日：1991-12-18

申请号：EP89306621.7

申请日：1989-06-29

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David

IPC: H05K3/12 ,  H05K1/09 ,  H01B1/22 ,  C09D11/00 ,  C09D11/10

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.