公开(公告)号：US20160329273A1

公开(公告)日：2016-11-10

申请号：US15214532

申请日：2016-07-20

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Takamasa Takano

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15786 ,  H01L2924/1579 ,  H05K1/113 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09436 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/1178 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49165 ,  H01L2224/05647 ,  H01L2924/01024 ,  H01L2924/01079

Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

公开(公告)号：US09451711B2

公开(公告)日：2016-09-20

申请号：US14169314

申请日：2014-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Toshiaki Hibino

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46 ,  H05K3/10

CPC classification number: H05K3/429 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/108 ,  H05K2203/1476

Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。

公开(公告)号：US09205698B2

公开(公告)日：2015-12-08

申请号：US14481572

申请日：2014-09-09

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Kohei Horiuchi

IPC: B44C1/22

CPC classification number: B44C1/228 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/54 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0029 ,  H05K2201/09836 ,  H05K2201/10204 ,  H05K2203/163 ,  H01L2924/00

Abstract: A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle α (−90°

Abstract translation: 一种方法，包括：在虚拟衬底相对于激光器沿着平行于所述虚拟衬底的表面的方向相对于激光器移动的状态下，通过在所述虚设衬底的表面辐射激光而在包括表面的虚设衬底中形成通孔 虚拟基板，b）确定通孔相对于垂直于虚设基板的表面的线的角度α（-90°<α<+ 90°），以及c）在绝缘基板中形成通孔 与步骤a）相同的条件，除了以角度＆bgr辐射激光; 相对于垂直于绝缘基板的表面的线。 角度＆bgr 被设定为相对于垂直于绝缘基板的表面的线的角度α线对称，并且满足＆bgr =α的关系。

公开(公告)号：US20150216055A1

公开(公告)日：2015-07-30

申请号：US14683185

申请日：2015-04-10

Applicant: IBIDEN CO., LTD.

Inventor： Tomoyuki IKEDA

IPC: H05K3/00 ,  H05K3/42 ,  C25D5/02

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A method for manufacturing a printed wiring board including providing a starting material including an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface of the insulating resin substrate such that a first opening portion having an opening on the first surface is formed, irradiating laser upon the second surface of the insulating resin substrate such that a second opening portion having an opening on the second surface and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming a first conductor on the first surface of the insulating resin substrate, forming a second conductor on the second surface of the insulating resin substrate, and forming a through hole conductor structure in the penetrating-hole to electrically connecting the first conductor and the second conductor.

Abstract translation: 一种制造印刷线路板的方法，包括提供包括具有第一和第二表面的绝缘树脂基板的起始材料，激光照射在绝缘树脂基板的第一表面上，使得形成在第一表面上具有开口的第一开口部分 在绝缘性树脂基板的第二面上照射激光，形成在第二面上具有与第一开口部连通的第二开口部，形成具有第一开口部和第二开口部的贯通孔， 在所述绝缘树脂基板的第一表面上形成第一导体，在所述绝缘树脂基板的第二表面上形成第二导体，并且在所述贯穿孔中形成通孔导体结构，以将所述第一导体和所述第二导体 。

公开(公告)号：US08890000B2

公开(公告)日：2014-11-18

申请号：US13422884

申请日：2012-03-16

Applicant: Tomoyuki Ikeda

Inventor： Tomoyuki Ikeda

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

公开(公告)号：US08836204B2

公开(公告)日：2014-09-16

申请号：US13643955

申请日：2011-04-27

Applicant: Akihito Kagotani ,  Makoto Arisawa ,  Hideki Kamada

Inventor： Akihito Kagotani ,  Makoto Arisawa ,  Hideki Kamada

IPC: H05B33/06 ,  H05B33/04 ,  H05B33/02 ,  H01L51/52 ,  B32B17/10 ,  F21V29/00 ,  F21Y105/00

CPC classification number: H05B33/06 ,  B32B17/10036 ,  B32B17/10541 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/20 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/529 ,  H01L2251/5361 ,  H05B33/02 ,  H05B33/04 ,  H05K1/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/09836 ,  H05K2201/10128

Abstract: Disclosed is an organic EL illumination device—which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)—wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.

Abstract translation: 公开了一种有机EL照明装置，其设置有：玻璃基板（10）上的有机EL元件（13）。 以及用于向上述玻璃基板（10）上的上述有机EL元件（13）均匀地供给电流的多个阳极端子电极（11）和阴极端子电极（12），在有机EL照明装置中设置有布线 具有与上述阳极端子电极（11）的位置对应的阳极配线（1a）的电路的电路板（1）和与上述阴极端子的位置对应的阴极配线（1b）的电路 形成电极（12）。

公开(公告)号：US20140254120A1

公开(公告)日：2014-09-11

申请号：US14282693

申请日：2014-05-20

Applicant: FUJIKURA LTD.

Inventor： Satoshi YAMAMOTO ,  Hiroyuki HIRANO ,  Takanao SUZUKI

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0094 ,  H01L21/486 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15184 ,  H05K1/113 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10545 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

Abstract translation: 本发明提供一种器件封装结构，其特征在于，包括：内插基板，具有基板和形成在从第一主面朝向第二主面的贯穿基板的多个通孔内形成的多个通孔布线，所述第一主面 作为基板的一个主表面，第二主表面是其另一个主表面; 第一装置，其包括多个电极，并且被布置成使得这些电极面对第一主表面; 以及第二装置，其包括多个电极，其布置与第一装置的每个电极的布置不同，并且被布置成使得这些电极面对第二主表面。

公开(公告)号：US20140185259A1

公开(公告)日：2014-07-03

申请号：US14097251

申请日：2013-12-05

Applicant: ZHEN DING TECHNOLOGY CO., LTD.

Inventor： YONG HA WOO ,  E-TUNG CHOU ,  WEN-LUN LO

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/09

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/09 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/181 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0379 ,  H05K2201/09836 ,  H05K2201/10674 ,  H05K2203/0384 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract translation: 封装基板包括电路板，多个第一导电柱和多个第二导电柱。 电路板包括形成在第一基底的第一表面上的第一基底和第一导电图案层。 第一导电柱从第一导电图案层延伸并电连接到第一导电图案层。 第二导电柱从第一导电图案层延伸并与之电连接。 每个第二导电柱的高度大于每个第一导电柱的高度。

公开(公告)号：US20120152607A1

公开(公告)日：2012-06-21

申请号：US12979340

申请日：2010-12-28

Applicant: YUNG-CHIEH CHEN ,  SHOU-KUO HSU

Inventor： YUNG-CHIEH CHEN ,  SHOU-KUO HSU

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0245 ,  H05K2201/09836

Abstract: A printed circuit board (PCB) includes first and second signal layers. First and second pairs of signal transmission lines are respectively laid out on the first and second signal layers. The first pair of signal transmission lines includes first positive and negative differential signal transmission lines. The second pair of signal transmission lines includes second positive and negative differential signal transmission lines. The first positive differential signal transmission line is electrically connected to the second negative differential signal transmission line by a first vertical interconnect access (via). The first negative differential signal transmission line is electrically connected to the second positive differential signal transmission line by a second via. An angle between a centerline of each of the first via and second via and a surface of the PCB is an acute angle.

Abstract translation: 印刷电路板（PCB）包括第一和第二信号层。 第一和第二对信号传输线分别布置在第一和第二信号层上。 第一对信号传输线包括第一正和负差分信号传输线。 第二对信号传输线包括第二正和负差分信号传输线。 第一正差分信号传输线通过第一垂直互连接入（via）与第二负差分信号传输线电连接。 第一负差分信号传输线通过第二通孔电连接到第二正差分信号传输线。 第一通孔和第二通孔中的每一个的中心线与PCB的表面之间的角度是锐角。

公开(公告)号：US07915537B1

公开(公告)日：2011-03-29

申请号：US11550753

申请日：2006-10-18

Applicant: Edward Herbert

Inventor： Edward Herbert

IPC: H05K1/03

CPC classification number: H05K1/03 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/09118 ,  H05K2201/09636 ,  H05K2201/09836 ,  H05K2201/10378 ,  Y10T29/49126

Abstract: An interposer is made of nested drawn copper shells with insulation between them. The shells are etched using methods of ordinary printed wiring fabrication, but being three dimensional, straight runs from the die to the motherboard can be made optimally short and wide without passing through any vias. Some shells can extend upward for top connections, and vias and crossing landlines can be used as required in the areas away from the die.

Abstract translation: 插入件由嵌套的拉制铜壳制成，它们之间具有绝缘。 使用普通印刷布线制造的方法蚀刻外壳，但是可以在不通过任何通孔的情况下将从模具到主板的三维直线运行最佳地缩短和宽。 一些壳体可以向上延伸用于顶部连接，并且可以根据需要在远离模具的区域中使用通孔和交叉座标线。