ELECTRICAL CONNECTION STRUCTURE
    188.
    发明公开
    ELECTRICAL CONNECTION STRUCTURE 有权
    ELEKTRISCHE VERBINDUNGSSTRUKTUR

    公开(公告)号:EP2117082A1

    公开(公告)日:2009-11-11

    申请号:EP06822495.5

    申请日:2006-10-27

    Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection is inserted in the through-hole, through the small aperture, and mechanically contacts the pad.

    Abstract translation: 一种电连接结构,其允许降低高度并易于拆卸,其中第一连接构件包括柔性基底,该柔性基底包括柔性绝缘膜,至少一个导电垫在至少一个侧面上形成,导电电路图案从 衬垫,在衬垫内的平面位置处形成通过其厚度的通孔,以及形成在衬垫内的平面位置并与通孔连通的小孔,第二连接构件包括形成在 至少一个侧面,并与形成在第二连接构件内部或第二连接构件上的导电电路图形电连接,其中电连接形成为使得导电突起通过小孔插入到通孔中,并机械地 联系垫

    Method for making three-dimensional liquid crystal polymer multilayer circuit boards
    190.
    发明公开
    Method for making three-dimensional liquid crystal polymer multilayer circuit boards 有权
    Verfahren zur Herstellung dreidimensionalerFlüssigkristallpolymer-Mehrschichtleiterplatten

    公开(公告)号:EP2081418A2

    公开(公告)日:2009-07-22

    申请号:EP09000584.4

    申请日:2009-01-16

    Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

    Abstract translation: 一种制造非平面三维(3D)多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物(LCP)层的堆叠布置,其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠布置以将堆叠布置形成为非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起,从而形成非平面3D 多层电路板。

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