公开(公告)号：EP2173147A4

公开(公告)日：2012-10-31

申请号：EP07790805

申请日：2007-07-13

Applicant: IBIDEN CO LTD

Inventor： TAKAHASHI MICHIMASA ,  AOYAMA MASAKAZU

IPC: H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2203/1536

公开(公告)号：EP1988759A4

公开(公告)日：2012-10-31

申请号：EP06712994

申请日：2006-02-03

Applicant: PANASONIC CORP

Inventor： MUKAE HIDETSUGU ,  SUZUKI HIROYUKI

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0278

公开(公告)号：EP2081204B1

公开(公告)日：2012-08-01

申请号：EP09000587.7

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Jaynes, Paul Brain ,  Marvin, Philip Anthony

IPC: H01H13/704 ,  H05K3/00 ,  H01H13/705 ,  H01H13/06

CPC classification number: H01H13/704 ,  H01H11/00 ,  H05K1/0284 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/49107 ,  Y10T29/4913

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

公开(公告)号：EP2117082A4

公开(公告)日：2012-05-16

申请号：EP06822495

申请日：2006-10-27

Applicant: ASAHI DENKA KENKYUSHO CO LTD

Inventor： MIZOGUCHI MASANORI

IPC: H05K1/14 ,  H01R12/52 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

公开(公告)号：EP2425688A1

公开(公告)日：2012-03-07

申请号：EP10719587.7

申请日：2010-04-24

Applicant: Austria Technologie&Systemtechnik Ag

Inventor： KASPER, Alexander

IPC: H05K1/02 ,  H01L33/60 ,  F21K99/00

CPC classification number: H05K1/02 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/013 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a circuit board having a light source for illumination purposes, having at least one LED electrically conductively connected to conductors of the circuit board, and the light thereof being converted into directed light by means of at least one mirror disposed on the circuit board, characterized in that the mirror is designed as a reflective coating printed onto the circuit board.

公开(公告)号：EP2342957A1

公开(公告)日：2011-07-13

申请号：EP09793336.0

申请日：2009-10-07

Applicant: Molex Incorporated

Inventor： PANELLA, Augusto P. ,  BAINES, Elliot A. ,  LIN, Jeng-De

IPC: H05K1/14 ,  H01R24/00

CPC classification number: H04Q1/136 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).

公开(公告)号：EP1480291B1

公开(公告)日：2010-02-10

申请号：EP04011712.9

申请日：2004-05-18

Applicant: Muck, Siegfried

Inventor： Muck, Siegfried ,  König, Sibyll ,  Kleikemper, Vera

IPC: H01R12/04

CPC classification number: H01R12/62 ,  H01R43/0221 ,  H01R43/0263 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/091 ,  H05K2201/09172 ,  H05K2203/167

公开(公告)号：EP2117082A1

公开(公告)日：2009-11-11

申请号：EP06822495.5

申请日：2006-10-27

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/04 ,  H01R12/32 ,  H05K1/14

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection is inserted in the through-hole, through the small aperture, and mechanically contacts the pad.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在至少一个侧面上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，并与形成在第二连接构件内部或第二连接构件上的导电电路图形电连接，其中电连接形成为使得导电突起通过小孔插入到通孔中，并机械地 联系垫

公开(公告)号：EP2100327A1

公开(公告)日：2009-09-16

申请号：EP06829212.7

申请日：2006-11-24

Applicant: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V.

Inventor： MARENCO, Norman

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L21/56 ,  H01L23/49855 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K3/12 ,  H05K3/326 ,  H05K3/386 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The invention relates to an electronic, in particular microelectronic, functional group and to a method for its production. The method according to the invention includes the following steps: a) coating of a mount (5a) with a non-conductive adhesive (4a); b) application of a conductor structure (3) to a subarea of the adhesive layer (4a); c) arrangement of an electronic component (1) with at least one external electrical connecting contact (2) on the adhesive layer (4a) and on the conductor structure (3), with the at least one connecting contact (2) of the electronic component (1) being brought directly into contact with the conductor structure (3), and with a part of the outer casing of the component (1) being brought directly into contact with the adhesive layer (4a). The method according to the invention allows electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.

公开(公告)号：EP2081418A2

公开(公告)日：2009-07-22

申请号：EP09000584.4

申请日：2009-01-16

Applicant: Harris Corporation

Inventor： Rendek, Louis Joseph Jr. ,  Shacklette, Lawrence Wayne ,  Marvin, Philip Anthony

IPC: H05K1/00

CPC classification number: H05K3/0014 ,  H01H2219/01 ,  H05K1/0284 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

Abstract translation: 一种制造非平面三维（3D）多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物（LCP）层的堆叠布置，其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠布置以将堆叠布置形成为非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。