Abstract:
A circuit board interconnect system (30) includes a carrier board (32) with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins (34) extend through the carrier board (32) and are arranged in rows and columns to form a grid array. A first circuit board (10) such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e., the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls (38) are provided with each ball (38) being positioned on top of a corresponding pin (34) so that each solder ball (38) forms a solder connection between a pin (34) and a corresponding pad or trace. A second circuit board (12) such as a computer mother board has a pin connector (17) mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins (34). After reflow, the solder balls (38) wrap around the side walls of the heads of the pins and the side walls of the pads. The resulting generally spherical solder connections are therefore stronger than conventional elongated fillet connections.
Abstract:
A technique for use in manufacturing electronic assemblies involves forming a hole (170) in one side (128) of a circuit board (130) and only partially through the board. A pin (164, 166), such as an electrically conductive lead, is then inserted into the hole, and an adhesive material (176, 178) is used to bond the pin to the circuit board.
Abstract:
This invention concerns a device for mounting electrical and electronic components (17) on printed circuit boards or hybrids (7) with different thermal expansion characteristics. The component (17), for instance, out of high-alumina ceramics, has several connecting pins (11) as connecting and mounting elements. These pins are butt-soldered with a conductor path (5) of the component (17). Each connecting pin (11) has a number of recesses (15) in its upper part. The form and arrangement of these recesses (15) effects a certain freedom of movement in all directions for the upper end of the connecting pin (11). This permits compensation for differences in the thermal expansion between component (17) and circuit board (7) and deviations from standard dimensions of both parts resulting from the production. Thus, the connecting pins (11) can be directly soldered into plated throughholes (10) in the circuit board (17).
Abstract:
Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (220) (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (210). A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (210). The elongate element (216) may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element (210) to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts.
Abstract:
Es wird ein Leistungswiderstand (1) mit mindestens einem elektrischen Anschluss (2.1, 2.2, 2.3), mit einem Trägersubstrat (3), das mindestens ein Widerstandselement (4.1, 4.2) aus einem Dickschichtmaterial und mindestens eine Kontaktelektrode (5.1, 5.2, 5.3) aufweist, an die das Widerstandselement (4.1, 4.2) elektrisch anschließt, mit wenigstens einem elektrischen Leiter (7.1, 7.2, 7.3), der mit der Kontaktelektrode (5.1, 5.2, 5.3) verlötet ist und eine elektrische Verbindung zwischen der Kontaktelektrode (5.1, 5.2, 5.3) und dem elektrischen Anschluss (2.1, 2.2, 2.3) herstellt, und mit einem, zumindest teilweise mit mindestens einer Vergussmasse (17) gefüllten Gehäuse (8), das Widerstandselement (4.1, 4.2) und Kontaktelektrode (5.1, 5.2, 5.3) vergossen aufnimmt, wobei der elektrische Leiter (7.1, 7.2, 7.3) durch die Vergussmasse (17) ragt. Um einen konstruktiv einfachen und leicht handhabbaren Leistungswiderstand (1) zu schaffen, wird vorgeschlagen, dass ein Stift, insbesondere ein Löt- oder Einpressstift, den elektrischen Leiter (7.1, 7.2, 7.3) ausbildet, welcher Stift (9.1, 9.2, 9.3) auf die Kontaktelektrode (5.1, 5.2, 5.3) aufgesetzt und mit dieser verlötet ist sowie den elektrischen Anschluss (2.1, 2.2, 2.3) des Leistungswiderstands (1) ausbildet.
Abstract:
According to various embodiments of the present disclosure, a metal unit 100 may include: a core metal layer 110 that is mainly composed of iron (Fe); and an outer layer 120 formed on at least one face 111, 112 of the core metal layer, and bonded to solder 10 so as to be attached to a printed circuit board 21. The metal unit and an electronic device including the same may be variously implemented according to embodiments.
Abstract:
An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.
Abstract:
An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.
Abstract:
The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.