公开(公告)号：US06628537B1

公开(公告)日：2003-09-30

申请号：US10197027

申请日：2002-07-16

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C502

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US5272597A

公开(公告)日：1993-12-21

申请号：US883360

申请日：1992-05-15

Applicant: Alfred G. Staples ,  Gerald E. Roberts

Inventor： Alfred G. Staples ,  Gerald E. Roberts

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K3/301 ,  H05K1/0243 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K3/3421

Abstract: A clip for surface-mounting a coupled-dual resonator crystal to a circuit board includes an elongated housing shaped complementary to the housing of the crystal and having an opening along a side for receiving the crystal. A tab spaces first and second shielding portions which overlie the end of the crystal housing. A first shield portion engages the middle ground terminal of the crystal shielding the input and output terminals, while the second shield extends from the first shield to overlie the output terminal, likewise shielding it from the input terminal. Distal portions of the input, output and common terminals, together with pads at the opposite end of the clip, mount the clip mechanically to the surface of a circuit board.

Abstract translation: 用于将耦合双谐振器晶体表面安装到电路板的夹子包括成形为与晶体壳体互补的细长壳体，并具有沿着用于接收晶体的一侧的开口。 凸片将第一和第二屏蔽部分覆盖在晶体壳体的端部上。 第一屏蔽部分接合屏蔽输入和输出端子的晶体的中间接地端子，而第二屏蔽件从第一屏蔽件延伸以覆盖输出端子，同样屏蔽输入端子。 输入，输出和公共端子的远端与夹子相对端的焊盘一起，将夹子机械地安​​装到电路板的表面。

公开(公告)号：US5116229A

公开(公告)日：1992-05-26

申请号：US628853

申请日：1990-12-17

Applicant: John M. Savage, Jr.

Inventor： John M. Savage, Jr.

IPC: F21K99/00 ,  H01L33/48 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  F21Y2101/00 ,  H01L2924/0002 ,  H01L33/483 ,  H01L33/486 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K3/3447

Abstract: An assembly including a circuit element having a base, and terminals projecting rearwardly from the base, the combination with the element comprising a body defining a forwardly opening recess receiving the base of the element for retention in the recess; the body having a laterally extending rear wall defining through openings for passing the rearwardly projecting terminals; and terminal retention flanges integral with the body and extending rearwardly of the rear wall for retaining the terminals in pre-determined bent conditions, rearwardly of the rear wall.

Abstract translation: 一种组件，其包括具有基座的电路元件和从基座向后突出的端子，该元件与元件的组合包括限定了用于保持在凹部中的元件的基部的向前开口凹部的主体; 所述主体具有横向延伸的后壁，所述后壁限定穿过所述向后突出的端子的开口; 和端子保持凸缘与主体成一体并从后壁向后延伸，用于将端子保持在预定的弯曲状态下，从后壁向后。

公开(公告)号：EP2757613A1

公开(公告)日：2014-07-23

申请号：EP13183848.4

申请日：2013-09-11

Applicant: Samsung SDI Co., Ltd.

Inventor： Yi, Sang-Il ,  Kang, Moon-Gil

IPC: H01M2/20 ,  H01M10/42 ,  H05K3/40 ,  H05K1/00 ,  G01R31/36

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: A rechargeable battery pack according to an exemplary embodiment of the present invention includes a plurality of unit cells (11, 12, 13, 14), connection tabs (30, 40) for electrically connecting the plurality of unit cells, connection plates (50, 70) combined with the connection tabs, and a protective circuit module (21) in which grooves (22, 23) with which the connection plates are combined are formed.

Abstract translation: 根据本发明的示例性实施例的可充电电池组包括多个单元电池（11,12,13,14），用于电连接所述多个单元电池的连接片（30,40），连接板（50， 70），以及保护电路模块（21），其中形成有连接板组合的凹槽（22,23）。

公开(公告)号：EP1470586B1

公开(公告)日：2014-01-15

申请号：EP02796613.4

申请日：2002-12-12

Applicant: ebm-papst St. Georgen GmbH & Co. KG

Inventor： HORNBERGER, Jörg ,  PFAFF, Andreas

IPC: H01L23/367 ,  H01L23/31 ,  H01L21/48

CPC classification number: H05K1/181 ,  H01L23/4334 ,  H01L23/49562 ,  H01L25/117 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00

公开(公告)号：EP1983810A3

公开(公告)日：2009-10-14

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

公开(公告)号：EP1995743A1

公开(公告)日：2008-11-26

申请号：EP07738354.5

申请日：2007-03-13

Applicant: Panasonic Corporation

Inventor： MORITA, Kazuki ,  INOUE, Tatehiko ,  KAWASAKI, Shusaku ,  KITAGAWA, Toshiyuki ,  NINOMIYA, Tooru

IPC: H01G9/26 ,  H01G2/04 ,  H01G2/06 ,  H01G4/224 ,  H01G9/00

CPC classification number: H01G2/06 ,  H01G2/106 ,  H01G2/12 ,  H01G9/008 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10962 ,  H05K2203/1361

Abstract: According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.

Abstract translation: 根据在电容器连接引脚沿垂直方向焊接电路基板之后在电路基板的两面形成防潮剂的结构和制造方法，并且将电容器电连接到与 在电路基板的上部空间处的电容器连接销的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率 并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

公开(公告)号：EP0331436B1

公开(公告)日：2004-12-29

申请号：EP89301985.1

申请日：1989-02-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Sugawara, Mitsuru ,  Yoshinaga, Akitoshi ,  Shimizu, Fumihiko ,  Takami, Masayuki

IPC: G02B6/42 ,  H01L33/00 ,  H05K3/32

CPC classification number: H01S5/026 ,  G02B6/42 ,  G02B6/4246 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/10287 ,  H05K2201/10462

公开(公告)号：EP1470586A2

公开(公告)日：2004-10-27

申请号：EP02796613.4

申请日：2002-12-12

Applicant: ebm-papst St. Georgen GmbH & Co. KG

Inventor： HORNBERGER, Jörg ,  PFAFF, Andreas

IPC: H01L23/367 ,  H01L23/31 ,  H01L21/48

CPC classification number: H05K1/181 ,  H01L23/4334 ,  H01L23/49562 ,  H01L25/117 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00

Abstract: The invention relates to a power semiconductor (1) which comprises a housing (2) with a first housing side (5) and an opposite second housing side (6). The first housing side (5) is provided with a cooling body (4) for removing dissipated heat. The second housing side (6) defines an alignment plane (12). The semiconductor (1) is further provided with connecting elements (3) that project from the housing (2) and that are bent in the direction towards the second housing side (6) in such a manner that they project beyond the alignment plane (12) of the second housing side (6). In their terminal regions (11), said connecting elements are adapted to receive SMD components of a printed board (13).

公开(公告)号：EP0522633A3

公开(公告)日：1993-07-07

申请号：EP92201948.4

申请日：1992-06-30

Applicant: Philips Electronics N.V.

Inventor： Bax, Fransiscus Wilhelmus Maria

IPC: H01R33/09

CPC classification number: H05K3/301 ,  H01R12/58 ,  H01R33/09 ,  H05K2201/10462 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2203/167 ,  Y10S362/80

Abstract: The elctric lamp having a cap (10) of synthetic resin is suitable for use on a printed circuit board (6). The cap (10) has resilient arms (15) extending alongside a plane (8) through the axis (2) of the lamp vessel (1). The holder portion (11) of the cap (3) holding the lamp vessel (1), and the arms (3) can clamp a p.c.b. (6) in between them. Means (19, 21) may be present to keep the lamp fixed in an opening (9) in p.c.b. (6) or at an edge thereof. The lamp requires little space on a p.c.b.