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公开(公告)号：WO2006121489A3
公开(公告)日：2008-01-03
申请号：PCT/US2006007193
申请日：2006-02-28
Applicant: STAKTEK GROUP LP , CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
Inventor： CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
IPC: G11C8/00
CPC classification number: H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境 。
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公开(公告)号：GB2452880B
公开(公告)日：2009-07-29
申请号：GB0822085
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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公开(公告)号：HK1077460A1
公开(公告)日：2006-02-10
申请号：HK05109243
申请日：2005-10-22
Applicant: STAKTEK GROUP LP
Inventor： CADY JAMES W , WILDER JAMES , ROPER DAVID L , WEHRLY JAMES DOUGLAS , DOWDEN JULIAN , BUCHLE JEFF
IPC: H01L20090101 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36
Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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公开(公告)号：GB0516622D0
公开(公告)日：2005-09-21
申请号：GB0516622
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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公开(公告)号：GB2417836B
公开(公告)日：2009-08-26
申请号：GB0516622
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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Patent Agency Ranking
公开(公告)号：GB0822085D0
公开(公告)日：2009-01-07
申请号：GB0822085
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.
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公开(公告)号：GB2417836A
公开(公告)日：2006-03-08
申请号：GB0516622
申请日：2005-08-12
Applicant: STAKTEK GROUP LP
Inventor： GOODWIN PAUL , CADY JAMES W , WEHRLY JAMES DOUGLAS
Abstract: A circuit module 10 comprises a rigid substrate 14 having laterally opposed sides S1, S2 and a flexible circuit 12 wrapped around one edge 16A of the substrate. The flexible circuit is attached to at least one of the sides of the substrate and has a plurality of contacts 20 in the vicinity of the edge 16A for connection to a circuit board socket. A plurality of memory CSPs 18 (chipscale packaged devices) are provided on at least one of the sides of the flexible circuit. Also claimed are modules having thermally conductive properties and various shaped substrates.
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公开(公告)号：GB2395367B
公开(公告)日：2005-05-25
申请号：GB0406140
申请日：2002-10-25
Applicant: STAKTEK GROUP LP
Inventor： CADY JAMES W , WILDER JAMES , ROPER DAVID L , WEHRLY JAMES DOUGLAS , DOWDEN JULIAN , BUCHLE JEFF
IPC: H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36 , H01L23/48 , H05K1/00
Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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公开(公告)号：GB0406140D0
公开(公告)日：2004-04-21
申请号：GB0406140
申请日：2002-10-25
Applicant: STAKTEK GROUP LP
IPC: H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36
Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and an application environment such as a printed wiring board (PWB). The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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公开(公告)号：WO2009039263A3
公开(公告)日：2009-10-15
申请号：PCT/US2008076839
申请日：2008-09-18
Applicant: STAKTEK GROUP LP , WOLFE MARK , WILDER JAMES , ROPER DAVID L
Inventor： WOLFE MARK , WILDER JAMES , ROPER DAVID L
CPC classification number: H05K1/183 , H05K1/0203 , H05K1/117 , H05K2201/09972 , H05K2201/10159 , H05K2201/1056 , H05K2203/1572 , Y10T29/49124
Abstract: A circuit module includes a printed circuit board (PCB) (12) having a first side (22), a second side (24), and a bottom perimeter edge (42). The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area (70) and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts (30) are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector.
Abstract translation: 电路模块包括具有第一侧面（22），第二侧面（24）和底部周边边缘（42）的印刷电路板（PCB）（12）。 PCB沿底部周边边缘呈现第一厚度。 第一侧包括凹入区域（70），并且在该凹入区域中，PCB具有小于第一厚度的第二厚度。 多个集成电路（IC）被固定到凹陷区域中的PCB。 多个模块触点（30）连接到IC并且沿着第一和第二侧中的至少一个设置，并且被配置为提供电路模块和边缘连接器之间的电连接。
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