公开(公告)号：KR100954879B1

公开(公告)日：2010-04-28

申请号：KR1020070124796

申请日：2007-12-04

Applicant: 삼성전기주식회사

Inventor： 조원우 ,  성재석 ,  정재엽 ,  양덕진 ,  김주형

IPC: H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q5/371 ,  H01Q9/42 ,  H05K1/16 ,  H05K2201/10098

Abstract: 안테나 내장형 인쇄회로기판이 개시된다. 그라운드와 제1 방사체가 형성되는 제1 단위기판; 상기 제1 단위기판에 적층되며, 상기 제1 방사체와 주파수 대역이 상이한 제2 방사체가 형성되는 제2 단위기판; 상기 그라운드와 연결되도록 상기 제1 단위기판에 형성되는 한 쌍의 스트립 선로; 상기 제1 방사체와 상기 제2 방사체를 연결하는 제1 비아(via); 일측이 상기 한 쌍의 스트립 선로와 각각 연결되는 한 쌍의 제2 비아; 및 상기 한 쌍의 제2 비아의 타측을 서로 연결하는 연결패턴을 포함하는 안테나 내장형 인쇄회로기판은, 다중 주파수 대역을 가지며 소형화가 가능하기에 소형화된 통신 기기에 적용될 수 있다.
안테나, 비아, PCB, 주파수

公开(公告)号：KR1020100029419A

公开(公告)日：2010-03-17

申请号：KR1020080088199

申请日：2008-09-08

Applicant: 삼성전기주식회사 ,  포항공과대학교 산학협력단

Inventor： 조원우 ,  김재희 ,  박위상 ,  양덕진 ,  김정수

IPC: H01Q1/24 ,  H01Q5/10 ,  H01Q1/46 ,  H01Q1/38 ,  H01Q9/42

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/46 ,  H01Q5/10 ,  H01Q9/42

Abstract: PURPOSE: A multi bandwidth antenna for a mobile phone is provided to be operated at a multi broadband by twisting a patterned antenna in a loop shape and connecting it to both sides of a printed circuit board. CONSTITUTION: A printed circuit board(110) forms a ground plane(150). A first antenna unit(120) comprises a radiation unit extended from the ground and connected to the ground plane and a feeding unit extended from an arbitrary point of the radiation unit. The first antenna unit is patterned in one side of the printed circuit board. A second antenna unit(130) is electrically connected to the first antenna unit and is patterned in the other side of the printed circuit board. The first and second antenna unit are electrically connected to each other through a via hole formed in the printed circuit board.

Abstract translation: 目的：提供一种用于移动电话的多带宽天线，通过将图案化天线扭曲成环形并将其连接到印刷电路板的两侧，在多宽带上操作。 构成：印刷电路板（110）形成接地平面（150）。 第一天线单元（120）包括从地面延伸并连接到接地平面的辐射单元和从辐射单元的任意点延伸的馈送单元。 第一天线单元在印刷电路板的一侧被图案化。 第二天线单元（130）电连接到第一天线单元，并且在印刷电路板的另一侧被图案化。 第一和第二天线单元通过形成在印刷电路板中的通孔彼此电连接。

公开(公告)号：KR1020100003990A

公开(公告)日：2010-01-12

申请号：KR1020080064070

申请日：2008-07-02

Applicant: 삼성전기주식회사

Inventor： 정명근 ,  정다희 ,  황윤석 ,  이성준 ,  정찬엽 ,  김근호 ,  양덕진

IPC: H05K3/40 ,  H05K3/18 ,  H05K3/42

CPC classification number: H05K3/188 ,  H05K1/0271 ,  H05K3/429 ,  H05K7/205

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve flexural rigidity and heat dissipation by selectively inserting a heat dissipation layer to a circuit board. CONSTITUTION: A circuit board(4) includes a plurality of insulation layers(3) and a heat dissipation layer(6). A circuit pattern is formed on a surface of the insulation layer. The heat dissipation layer is interposed between the insulation layers. The heat dissipation layer is made of aluminum and is electrically connected to a plating layer(12). A penetration hole(8) passes through one side and the other side of the circuit board. A seed layer(10) is formed in an inner wall of the penetration hole by the Cu direct plating. The plating layer is formed on the seed layer.

Abstract translation: 目的：提供一种印刷电路板及其制造方法，通过选择性地将散热层插入电路板来提高抗弯刚度和散热。 构成：电路板（4）包括多个绝缘层（3）和散热层（6）。 电路图案形成在绝缘层的表面上。 散热层介于绝缘层之间。 散热层由铝制成，与电镀层（12）电连接。 穿孔（8）穿过电路板的一侧和另一侧。 种子层（10）通过Cu直接电镀形成在穿透孔的内壁中。 在种子层上形成镀层。

公开(公告)号：KR1020100000261A

公开(公告)日：2010-01-06

申请号：KR1020080059691

申请日：2008-06-24

Applicant: 삼성전기주식회사

Inventor： 임경환 ,  고태호 ,  양덕진

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4046 ,  H05K1/116 ,  H05K3/4647 ,  H05K3/4679 ,  H05K2201/09454

Abstract: PURPOSE: A method for manufacturing a PCB is provided to reduce the number of manufacturing processes by forming an insulating layer without lamination. CONSTITUTION: A first circuit substrate with a first via land and a second circuit substrate with a second via land are provided(S100). The first via post is positioned on the first via land(S200). The second circuit substrate is aligned to contact the second via land with the first via post(S300). The first via land and the second via land are welded on the first via post(S400). Liquid insulating material is injected between the first circuit substrate and the second circuit substrate(S500).

Abstract translation: 目的：提供一种用于制造PCB的方法，以通过在没有层压的情况下形成绝缘层来减少制造工艺的数量。 提供了具有第一通孔焊盘的第一电路衬底和具有第二通孔焊盘的第二电路衬底（S100）。 第一通孔位于第一通孔焊盘上（S200）。 第二电路衬底被对准以使第二通孔焊盘与第一通孔接触（S300）。 第一通孔和第二通孔焊接在第一通孔上（S400）。 在第一电路基板和第二电路基板之间注入液体绝缘材料（S500）。

公开(公告)号：KR1020090102119A

公开(公告)日：2009-09-30

申请号：KR1020080027371

申请日：2008-03-25

Applicant: 삼성전기주식회사

Inventor： 박광수 ,  정명근 ,  양덕진 ,  변대정

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49156 ,  H01L2924/00

Abstract: PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to remove an insulating layer forming process, a via hole forming process and a conductive body forming process for fan out of the outer-most pad. CONSTITUTION: An embedded printed circuit board includes a member(10), a chip(20), a filler(25), and a connection layer(30). A cavity(15) is formed in a part of the member. A wiring layer(11) is formed in a part where the cavity of the member is not formed. A chip is inserted within the cavity. The chip includes pads(21). The filler is filled between the chip and the cavity. The filler fixes a chip. The connection layer is formed between the wiring layer and the pad. The connection layer connects the wiring layer with the pad.

Abstract translation: 目的：提供一种嵌入式印刷电路板及其制造方法，以从绝缘层中除去绝缘层形成工艺，通孔形成工艺和导电体形成工艺。 构成：嵌入式印刷电路板包括构件（10），芯片（20），填充物（25）和连接层（30）。 在该部件的一部分中形成有空腔（15）。 在未形成构件的空腔的部分中形成布线层（11）。 芯片插入腔内。 芯片包括焊盘（21）。 填料填充在芯片和空腔之间。 填料固定芯片。 连接层形成在布线层和焊盘之间。 连接层将布线层与焊盘连接。

公开(公告)号：KR1020090058662A

公开(公告)日：2009-06-10

申请号：KR1020070125355

申请日：2007-12-05

Applicant: 삼성전기주식회사

Inventor： 변대정 ,  박심환 ,  양덕진 ,  정명근

IPC: B23K26/00

Abstract: A laser processing device is provided to prevent a substrate from drooping and bending by the gravity of the substrate by giving the tension to the substrate fixed with a clamp. A laser processing device processing both side of a substrate at the same time comprises: a clamp(10) compressing an end part of a substrate and fixing the substrate; a laser generator(14) emitting the laser beam; a focusing part(12) focusing the laser beam to irradiate the laser beam to both sides of the substrate; and a movable part combined with the clamp to move the substrate.

Abstract translation: 提供一种激光加工装置，用于通过向固定有夹具的基板施加张力来防止基板由于基板的重力而下垂和弯曲。 同时处理基板两面的激光加工装置包括：压紧基板的端部并固定基板的夹具（10）; 发射激光束的激光发生器（14）; 聚焦部分（12）聚焦激光束以将激光束照射到基板的两侧; 以及与夹具结合以移动基板的可移动部分。

公开(公告)号：KR100882263B1

公开(公告)日：2009-02-06

申请号：KR1020070114523

申请日：2007-11-09

Applicant: 삼성전기주식회사

Inventor： 정다희 ,  양덕진 ,  구봉완 ,  황윤석 ,  김재연 ,  이성준

IPC: H05K3/42 ,  H05K3/18

CPC classification number: H05K3/005 ,  H05K3/0094 ,  H05K3/429

Abstract: A method for manufacturing PCB(Printed Circuit Board) is provided to implement the micro circuit pattern by using the existing facility and by forming the blind via hole and the through hole at different time. The reference mark is formed in the circuit board. The insulating layer is laminated on the circuit board (S100). The blind via hole is punched in the insulating layer (S200). For charging the blind via hole, the insulating layer is plated. The first plating layer is formed (S300). The first plating layer is half-etched (S400). Therefore, the thickness of the first plating layer is reduced. The through hole is punched (S500). The through hole passes through the insulating layer and the circuit board. In order to form the conductive layer on the inner surface of the through hole, the insulating layer is plated. Therefore, the second plating layer is formed. The circuit pattern is formed by the selective etching for the half-etched first plating layer and the second plating layer (S600).

Abstract translation: 提供了一种用于制造PCB（印刷电路板）的方法，通过使用现有的设备和通过在不同时间形成盲孔和通孔来实现微电路图案。 参考标记形成在电路板中。 绝缘层层压在电路板上（S100）。 盲孔通孔在绝缘层中冲压（S200）。 为了对盲孔通电，绝缘层被镀覆。 形成第一镀层（S300）。 半蚀刻第一镀层（S400）。 因此，第一镀层的厚度减小。 通孔穿孔（S500）。 通孔穿过绝缘层和电路板。 为了在通孔的内表面上形成导电层，绝缘层被镀覆。 因此，形成第二镀层。 通过对半蚀刻第一镀层和第二镀层的选择性蚀刻形成电路图案（S600）。

公开(公告)号：KR100757907B1

公开(公告)日：2007-09-11

申请号：KR1020060063634

申请日：2006-07-06

Applicant: 삼성전기주식회사

Inventor： 김근호 ,  양덕진 ,  김종국 ,  전일균 ,  이응석

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A PCB(Printed Circuit Board) and a method for manufacturing the same are provided to offer high radiative effect and bending stiffness by forming an inner layer or a ground layer with aluminum. A PCB includes an insulating substrate(50) and a radiative layer(40). The insulating substrate(50) has an insulating layer(30), a circuit pattern(15), and an interlayer conductive unit. The circuit pattern(15) is formed on one surface of the insulating layer(30). The interlayer conductive unit is coupled with the insulating layer(30) by penetrating the insulating layer(30) to be electrically connected to the circuit pattern(15). The radiative layer(40) is laminated on the other surface of the insulating layer(30). The interlayer conductive unit is a paste bump(20) hardened by being coupled with the circuit pattern(15). A plurality of insulating substrates(50) are laminated sequentially. The radiative layer(40) is laminated to be interposed between the insulating substrates(50).

Abstract translation: 提供PCB（印刷电路板）及其制造方法，通过用铝形成内层或接地层来提供高辐射效果和弯曲刚度。 PCB包括绝缘基板（50）和辐射层（40）。 绝缘基板（50）具有绝缘层（30），电路图案（15）和层间导电单元。 电路图案（15）形成在绝缘层（30）的一个表面上。 层间导电单元通过穿透绝缘层（30）与绝缘层（30）耦合以电连接到电路图案（15）。 辐射层（40）层叠在绝缘层（30）的另一个表面上。 层间导电单元是通过与电路图案（15）耦合而硬化的糊状凸块（20）。 依次层叠多个绝缘基板（50）。 辐射层（40）层叠以插入在绝缘基板（50）之间。

公开(公告)号：KR100754071B1

公开(公告)日：2007-08-31

申请号：KR1020060043887

申请日：2006-05-16

Applicant: 삼성전기주식회사

Inventor： 정재엽 ,  양덕진 ,  임경환 ,  김광윤 ,  고태호

IPC: H05K3/46

Abstract: A method for manufacturing a printed circuit board is provided to reduce a thickness of a circuit pattern by forming the circuit pattern using a conductive paste according to a roll coating process. A through-hole(212) is formed on a cured first insulation layer. A conductive agent is filled in the through-hole. A conductive paste(220) is attached to both sides of a first information material(210) by using a roll coating process, such that a circuit pattern is formed on a circuit layer. A second through-hole is formed on a cured second insulation layer. The conductive agent is filled in the second through-hole. The circuit layer and the insulation layer are alternatively laminated as a whole. The conductive agent, which is filled in the through-holes of the circuit layer and the insulation layer, is the conductive paste.

Abstract translation: 提供一种用于制造印刷电路板的方法，以通过根据辊涂工艺使用导电膏形成电路图案来减小电路图案的厚度。 通孔（212）形成在固化的第一绝缘层上。 导电剂填充在通孔中。 通过使用辊涂工艺将导电浆料（220）附着到第一信息材料（210）的两侧，使得电路图案形成在电路层上。 第二通孔形成在固化的第二绝缘层上。 导电剂填充在第二通孔中。 电路层和绝缘层作为整体交替层压。 填充在电路层的通孔和绝缘层中的导电剂是导电膏。

公开(公告)号：KR100733248B1

公开(公告)日：2007-06-27

申请号：KR1020050081739

申请日：2005-09-02

Applicant: 삼성전기주식회사

Inventor： 김근호 ,  양덕진 ,  임경환 ,  김기홍

IPC: H05K3/10

Abstract: 본 발명은 정전기 복사기의 원리를 인쇄회로기판의 회로 패턴에 응용하여, 종래의 동박적층판을 사용하지 않고 회로패턴을 형성할 수 있는 장치 및 이 장치를 이용한 인쇄회로기판 제조방법에 관한 것이다.
본 발명의 일 실시예에 따른 회로패턴 형성장치는, 아트워크 필름에 광을 조사하는 광원; 상기 아트워크 필름으로부터 반사되는 광에 의해 대전되는 전사부; 및 상기 전사부의 대전된 부분에 금속 분말을 공급하는 금속 분말 공급장치를 포함한다.
복사기, 인쇄회로기판, 대전, 금속 분말, 회로패턴