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公开(公告)号：KR101545019B1
公开(公告)日：2015-08-18
申请号：KR1020070089940
申请日：2007-09-05
Applicant: 삼성전자주식회사
CPC classification number: H05K1/0284 , H04M1/0249 , H05K3/185 , H05K2201/0999 , H05K2203/107
Abstract: 본발명은전자기기의외관케이스내에 LDS용수지를이중사출및 인서트사출에의해부착함과아울러회로구현을가능하도록구성한 LDS을이용한전자기기의제조방법및 그에의해제조된전자기기에관한것으로서, 이를위해 LDS를이용한전자기기에있어서, 상기전자기기는상, 하부외관케이스로이루어지고, 상기하부외관케이스내에 LDS용수지를이중사출및 인서트사출에의해부착시키며, 상기 LDS용수지에상기전자기기의부품들을순차적으로실장함과아울러소형화된인쇄회로기판을실장하고, 상기상, 하부외관케이스를체결함을특징으로하며, 이에따라, LDS용수지의강도를향상시킬수 있고, 전자기기의외관케이스의고유특성인표면품질과도장성을향상시킬수 있으며, 회로형성이필요한부분에만 LDS 용수지를사출가능하여원가를절감할수 있고, 전자기기의외관케이스내에 LDS용수지를부착함과아울러회로구현을가능하도록함으로써, 기존의인쇄회로기판상의부품들을외관케이스로이동하여인쇄회로기판를소형화하고, 이로인해제품을박형화및 소형화할수 있는이점이있다.
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公开(公告)号：KR101525158B1
公开(公告)日：2015-06-03
申请号：KR1020090021114
申请日：2009-03-12
Applicant: 삼성전자주식회사
Abstract: 본발명은몰딩이되어있는전자부품패키지를솔더링공정을하지않고인쇄회로기판에접착하는인쇄회로기판조립체및 그제조방법에관한것이다. 이를위해본 발명은이형이가능한필름또는플레이트상에회로소자를배치하고, 필름상에수지를도포하여회로소자를몰딩하며, 몰드로부터필름을제거하고, 필름이제거된몰드를접착제를사용하여인쇄회로기판에접착하므로얇은인쇄회로기판과접착하더라도휨에의한불량을최소화할수 있으며, 솔더링공정을하지않고몰딩된회로소자패키지를제작할수 있으므로공정및 비용을최소화할수 있다.
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公开(公告)号：KR101475080B1
公开(公告)日：2014-12-23
申请号：KR1020080069320
申请日：2008-07-16
Applicant: 삼성전자주식회사
Abstract: 본발명은인쇄회로기판조립체에있어서, 일면에다수의소자들이부착된필름에수지를도포하여상기소자들을몰딩시킨제1 기판조립체; 및적어도하나의필름층과, 상기필름층의일면또는양면에형성되는회로패턴층을포함하는제2 기판조립체를포함하고, 상기제1 기판조립체는상기필름을관통하게형성된비아홀과, 상기비아홀에각각형성된도금층을포함하며, 상기제1 기판조립체가상기제2 기판조립체에결합되면상기소자들은상기도금층을통해상기회로패턴층에접속되는인쇄회로기판조립체와그 제조방법을개시한다. 상기와같은인쇄회로기판조립체및 그제조방법은제조과정에서열적손상으로부터소자들을보호할수 있으며, 소자와기판또는필름과의박리현상을방지하여제품의신뢰성을향상시킬수 있게된다.
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公开(公告)号：KR1020120069015A
公开(公告)日：2012-06-28
申请号：KR1020100113481
申请日：2010-11-15
Applicant: 삼성전자주식회사
CPC classification number: H01R13/2442 , H01R33/7685
Abstract: PURPOSE: A circuit connection structure is provided to stably maintain an electronic connection state between electronic components. CONSTITUTION: A circuit board includes a connection terminal. A housing(20) supports the circuit board. A supporting unit(30) of an electric insulating material is formed in a circuit pattern. The supporting unit is coupled with the housing in order to contact the connection terminal. The supporting unit includes an elastic deforming unit.
Abstract translation: 目的：提供电路连接结构，以稳定地保持电子部件之间的电子连接状态。 构成：电路板包括连接端子。 壳体（20）支撑电路板。 以电路图案形成电绝缘材料的支撑单元（30）。 支撑单元与壳体联接以便与连接端子接触。 支撑单元包括弹性变形单元。
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公开(公告)号：KR1020090083536A
公开(公告)日：2009-08-04
申请号：KR1020080009384
申请日：2008-01-30
Applicant: 삼성전자주식회사
CPC classification number: H05K1/144 , H04M1/0277 , H05K1/0284 , H05K3/326 , H05K7/1417 , H05K2201/091 , H05K2201/0999
Abstract: A device of connecting electronic devices is provided to easily and electrically connect electronic devices having contact points without additional parts. The first circuit line(24) transmits an electric signal by connecting various electronic components installed in a printed circuit board(22). A case(26) protects various components having the printed circuit board. The second circuit line(28) is in a concave part of a case. Contact points(32,36) electrically connect the first and second circuit lines. A hook(40) is in the case for electrically connecting the first and second contacts.
Abstract translation: 提供连接电子装置的装置，以容易且电气地连接具有接触点的电子装置，而无需附加部件。 第一电路线（24）通过连接安装在印刷电路板（22）中的各种电子部件来发送电信号。 壳体（26）保护具有印刷电路板的各种部件。 第二电路线（28）是壳体的凹部。 接触点（32,36）电连接第一和第二电路线。 在电连接第一和第二触点的情况下，钩（40）。
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Patent Agency Ranking
公开(公告)号：KR1020090029355A
公开(公告)日：2009-03-23
申请号：KR1020070094519
申请日：2007-09-18
Applicant: 삼성전자주식회사
IPC: H05K5/00
CPC classification number: H05K5/003 , H05K5/0069 , H05K5/0247 , H05K5/03
Abstract: A case for the electronic device is provided to cut down the manufacturing cost by fixing directly the circuit line fixing the electronic component in the inner surface of the case to form the pattern. A plurality of circuit lines(11) is fixed to directly in the inner surface of the case(10). The connection unit(11a) is formed in the end of a plurality of circuit lines. The terminal of electronic component(12) is connected to the connection unit through the soldering. A plurality of fixed holes for fixing is formed in the circuit line. A plurality of fixed protrusion is protruded in the inner surface of the case. A plurality of support ribs is protruded to the upper in the inner surface of the case. The circuit line includes the conductive layer and insulating layer.
Abstract translation: 提供了一种用于电子设备的壳体，以通过将固定电子部件的电路线直接固定在壳体的内表面中来形成图案来降低制造成本。 多个电路线（11）直接固定在壳体（10）的内表面。 连接单元（11a）形成在多条电路线的端部。 电子部件（12）的端子通过焊接连接到连接单元。 在电路线上形成多个用于固定的固定孔。 多个固定突出部突出在壳体的内表面中。 多个支撑肋突出到壳体内表面的上部。 电路线包括导电层和绝缘层。
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公开(公告)号：KR101702837B1
公开(公告)日：2017-02-07
申请号：KR1020100070834
申请日：2010-07-22
Applicant: 삼성전자주식회사
CPC classification number: H05K3/0058 , B32B37/1207 , B32B37/185 , B32B38/145 , B32B2037/1223 , B32B2038/0092 , B32B2309/105 , B32B2457/14 , H05K2201/0999 , H05K2201/10098
Abstract: 필름형전자회로가부착되는전자제품의케이스구조물을개시한다. 전자제품의케이스구조물은전자제품의케이스와, 상기케이스에부착되고용융점이상의온도에서용융되어접착성을갖는제1필름과, 상기제1필름에일면이접하도록부착되는제2필름과, 상기제1필름에부착되고상기제1필름과상기제2필름사이에위치되는전자회로층을포함하고, 상기제1필름은상기케이스에열접착되는것을특징으로한다.
Abstract translation: 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。
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公开(公告)号：KR101608745B1
公开(公告)日：2016-04-05
申请号：KR1020090133496
申请日：2009-12-30
Applicant: 삼성전자주식회사
CPC classification number: H05K3/321 , H05K3/125 , H05K3/4664 , H05K2201/09436 , H05K2201/09881 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165
Abstract: 솔더를사용하지않고인쇄회로기판에부품을부착하는인쇄회로기판조립체제조방법을개시한다. 이를위해잉크젯프린팅방식으로도전체를포함하는제1잉크와절연체를포함하는제2잉크를도포하여인쇄회로기판을형성하고, 형성된인쇄회로기판위에부품의전극과도전층이접촉하도록부품을안착하고고온에서경화시킴으로써인쇄회로기판조립체를생성한다.
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公开(公告)号：KR101473493B1
公开(公告)日：2014-12-17
申请号：KR1020080067189
申请日：2008-07-10
Applicant: 삼성전자주식회사
Abstract: 본발명은부품실장케이스와회로기판간의상호접속장치에있어서, 상기케이스에소정의높이로일체로돌출되고, 그상면에회로패턴을형성하여상기회로기판과접속됨과아울러전기적으로연결되는적어도하나이상의접속부를포함함을특징으로하며, 이에따라, 기존의분리되던접속부를일체로형성하여제품의조립공정수 줄이고, 기존의조립후 발생되던공간이필요없어제품의두께및 크기를줄여소형화및 슬림화할수 있는이점이있다.
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公开(公告)号：KR1020120009872A
公开(公告)日：2012-02-02
申请号：KR1020100070834
申请日：2010-07-22
Applicant: 삼성전자주식회사
CPC classification number: H05K3/0058 , B32B37/1207 , B32B37/185 , B32B38/145 , B32B2037/1223 , B32B2038/0092 , B32B2309/105 , B32B2457/14 , H05K2201/0999 , H05K2201/10098 , H05K5/0247 , H01G9/2095 , H04B1/088 , H05K3/281 , Y10S526/935
Abstract: PURPOSE: A case structure of electronic products which include a film type electronic circuit and a manufacturing method thereof are provided to utilize space by directly arranging an antenna in a terminal case. CONSTITUTION: A case structure(1) includes a case(10) and a film type electronic circuit which is attached on the case. The film type electronic circuit is attached on the inner surface of the case. The case is comprised of a material which is able to be attached to the film type electronic circuit. The film type electronic circuit comprises all electronic circuits which is able to be formed into a film shape. The film type electronic circuit comprises an electronic circuit layer(22), a first film(21), and a second film(23) which protects the first film. The electronic circuit layer is able to be formed into an antenna of a mobile communication terminal. The first film insulates the electronic circuit layer from the outside.
Abstract translation: 目的：提供包括薄膜式电子电路及其制造方法的电子产品的壳体结构，以通过在端子壳体中直接布置天线来利用空间。 构成：壳体结构（1）包括壳体（10）和附接在壳体上的膜型电子电路。 胶片式电子电路安装在外壳的内表面上。 该壳体由能够附着于薄膜式电子电路的材料构成。 薄膜式电子电路包括能够形成为薄膜形状的所有电子电路。 膜型电子电路包括保护第一膜的电子电路层（22），第一膜（21）和第二膜（23）。 电子电路层能够形成为移动通信终端的天线。 第一个膜将电子电路层与外部绝缘。
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