Abstract:
The present invention relates to an electronic radiation personal dosimeter using an SiPM. The purpose is to provide an electronic radiation exposure personal dosimeter capable of reducing manufacturing costs by manufacturing it through a CMOS process by easily measuring radiation in a low dose environment. The invention includes a metal filter, an SiPM generating an electron-hole pair by radiation passing through the metal filter, moving an electron to a cathode side and moving a hole to an anode side using high voltage corresponding to reverse bias, and forming electron amplification, a pre-amplifier outputting a signal by a charge inputted from the amplification of the SiPM as an analog signal and amplifying it at the same time, an SCA outputting a digital pulse when an analog voltage signal inputted from the pre-amplifier has an amplitude between a low level discriminator and an upper level discriminator, a central processing part storing the number of digital pulses by receiving the pulses outputted from the SCA for a predetermined time and multiplying the number of the pulses by a personal dose value stored in the memory, and a read-only memory storing a personal dose value that radiation reaches per a digital pulse and delivering the value to the central processing part. [Reference numerals] (100) Display part; (20) Metal filter; (50) Pre-amplifier; (70) Central processing part; (80) Memory; (90) Read-only memory
Abstract:
PURPOSE: An image sensing device implementing a pixel with two different type transistors is provided to output an output signal of a photo diode to a comparator through two different type transistors, thereby reducing the number of column lines. CONSTITUTION: An image sensing device comprises a pixel (110) to output an output signal of a photo diode (PD) through first type transistors (MN1, MN2) and a second type transistor (MP); a comparator (121) to compare the output signal to a reference signal; and memories (123,124) to stores an output size based on a result of the comparison. The pixel is a heterogeneous 3-Tr pixel and constituted with the PD, two N-channel metal-oxide semiconductors (N-MOS), and one P-channel metal-oxide semiconductor (P-MOS). The 3-Tr pixel outputs the output signal of the PD through the two N-MOSs and the one P-MOS. [Reference numerals] (123) Memory 1; (124) Memory 2; (125) Counter
Abstract:
PURPOSE: A method for forming a trench guard ring of a silicon photomultiplier and the silicon photomultiplier are provided to prevent a dark count phenomenon by suppressing the current leakage between avalanche photodiodes. CONSTITUTION: A P-type epitaxial layer(120) is formed on a silicon substrate(110). A respective P-type conductive layer(130) is formed on the P-type epitaxial layer. An oxide film is formed on the P-type epitaxial layer. A silicon nitride film is formed on the oxide film. A photoresist is spread on the silicon nitride film.
Abstract:
PURPOSE: A silicon photomultiplier with a backward light-receiving structure, a manufacturing method thereof, and a radiation detector using the same are provided to enhance the light detection efficiency of a gamma-ray detector by increasing a fill factor by broadening an active area which reacts to incident visible light. CONSTITUTION: A third insulation layer(183) is formed at the upper part of a second insulation layer(182). An MIM(Metal-Insulator-Metal) capacitor(300) is formed in the third insulation layer. A second line electrode pattern(420) is formed at the upper part of the third insulation layer. The second line electrode pattern interlinks a quenching resistance(200) and the MIM capacitor which are formed in the upper part of a first insulation layer(181). The MIM capacitor absorbs a surplus voltage when avalanche breakdown occurs.
Abstract:
PURPOSE: A silicon photomultiplier with improved photo-detecting efficiency and gamma radiation detector comprising the same are provided to minimize light on a dead region of a visible light generated from a scintillator by multi layer polysilicon resistance. CONSTITUTION: In a device, a metal line(310) is formed in each micro cell(320). A polysilicon resistor(340) for quenching is connected to the metal line. A p+ conductive type is formed in the lowermost layer of the semiconductor substrate. The epitaxial layer of the p- conductive type is formed on the semiconductor substrate of the p+ conductive type. A p-region of the conductive type is doped in the epitaxial layer. The n+ domain of the conductive type is formed on the p region of the conductive type. An insulating layer is formed on the n+ domain of the conductive type and epitaxial layer.
Abstract:
영상의공간해상도증가장치및 방법이개시된다. 본발명은, 대상객체의이동전후에에너지노출(energy exposure)을달리하여획득한영상을토대로최종영상을획득한다. 본발명에따르면, 픽셀안에복수개의비교기를두지않아도, 즉비교기를증가하지않아도영상의공간해상도를증가시키며에너지정보를획득할수 있고, 비교기가증가되지않기때문에소모되는파워를줄일수 있으며, 디텍터픽셀면적의증가없이에너지정보를획득할수 있다.