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公开(公告)号：KR100964970B1
公开(公告)日：2010-06-21
申请号：KR1020070082558
申请日：2007-08-17
Applicant: 한국전자통신연구원
IPC: B81B7/00 , H01L21/304 , B81C1/00
CPC classification number: B81B3/001 , B81C2201/115
Abstract: 본 발명은 3 차원 멤즈 미세구조체를 구비하는 멤즈 소자가 구조체 기판 또는 건조판에 고착되는 것을 방지하는 장치에 관한 것으로, 더욱 상세하게는 미세구조체와 구조체 기판 사이에 존재하는 세척액을 제거하면서 발생하는 표면장력으로 미세구조체가 기판에 고착되는 현상을 방지하기 위해 건조판; 및 세척액 제거를 위해 상부에 위치하는 미세구조체로부터 흘러나오는 세척액이 배출되도록 상기 건조판 상부 면에 소정의 높이로 복수 개 형성되는 미세돌기를 포함하는 3 차원 멤즈 미세구조체의 고착방지를 위한 부양 장치에 관한 것이다.
멤즈(MEMS), 미세구조체, 세척액, 고착방지-
公开(公告)号：KR1020080052183A
公开(公告)日：2008-06-11
申请号：KR1020070043804
申请日：2007-05-04
Applicant: 한국전자통신연구원
IPC: G01P3/483 , G01P15/125
CPC classification number: G01P15/125 , G01P15/0802
Abstract: A capacitive accelerometer is provided to eliminate or reduce largely performance difference in a manufacturing process by keeping the gap between sensing electrodes very narrow. A sensing mass(210) is positioned apart from an upper surface of a substrate(200). The sensing mass includes a main body, a supporting spring, and a sensing electrode. A supporting plate(220) is formed to couple the sensing mass with the substrate. A reference electrode(232) is adjacent to the sensing electrode and is moved in a direction getting near to or a direction getting away from the sensing electrode. A driving unit(240) caused a movement of the reference electrode. A stopper(236) is formed to stop the movement of the reference electrode.
Abstract translation: 提供电容加速度计以通过保持感测电极之间的间隙非常窄而消除或降低制造过程中的很大程度的性能差异。 感测质量块（210）定位成离开衬底（200）的上表面。 感测质量包括主体，支撑弹簧和感测电极。 形成支撑板（220）以将传感块与衬底相耦合。 参考电极（232）与感测电极相邻，并且在接近或远离感测电极的方向上移动。 驱动单元（240）引起参考电极的移动。 形成止动件（236）以停止参考电极的移动。
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公开(公告)号：KR100467318B1
公开(公告)日：2005-01-24
申请号：KR1020020031288
申请日：2002-06-04
Applicant: 한국전자통신연구원
IPC: H01H59/00
CPC classification number: H01H59/0009 , H01H1/20 , H01H2001/0057
Abstract: A microelectromechanical device that transmits an electric signal using mechanical contact between conductors is provided. The microelectromechanical device has a conductive oxide layer on at least one of contacting surfaces of the conductors. The conductor may be a signal line or a contact pad. According to the microelectromechanical device, the signal line or the contact pad is coated with the conductive oxide layer, thereby preventing the occurrence of micro-welding problem due to resistive heat. As a result, a reliability and a power handling of a microelectromechanical device can be improved.
Abstract translation: 提供了使用导体之间的机械接触传输电信号的微机电装置。 微机电器件在导体的至少一个接触表面上具有导电氧化物层。 导体可以是信号线或接触垫。 根据微机电装置，信号线或接触垫涂覆有导电氧化物层，由此防止由于电阻热而发生微焊接问题。 结果，可以改善微机电装置的可靠性和功率处理。
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公开(公告)号：KR1020040038555A
公开(公告)日：2004-05-08
申请号：KR1020020067556
申请日：2002-11-01
Applicant: 한국전자통신연구원
IPC: H01L29/00
CPC classification number: H01P1/127
Abstract: PURPOSE: A high frequency device using an MEMS(Micro Electronic Mechanical System) technique is provided to be capable of reducing an operation voltage and improving operation speed. CONSTITUTION: A high frequency device using an MEMS technique is provided with a substrate(50) and the first electrode(51) loaded on the substrate for forming an actuator. At this time, the first electrode is partially connected with the substrate. The high frequency device further includes the second electrode(54) spaced apart from the main surface of the substrate and partially overlapped with the first electrode for forming the actuator. The contact point between the first and second electrode is formed by the electrostatic attractive force induced between the first electrode and the second electrode.
Abstract translation: 目的：提供使用MEMS（微电子机械系统）技术的高频器件，能够降低工作电压并提高操作速度。 构成：使用MEMS技术的高频器件设置有衬底（50）和负载在衬底上用于形成致动器的第一电极（51）。 此时，第一电极与衬底部分连接。 高频器件还包括与衬底的主表面间隔开并与用于形成致动器的第一电极部分重叠的第二电极（54）。 第一和第二电极之间的接触点由在第一电极和第二电极之间引起的静电引力形成。
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公开(公告)号：KR1020110130214A
公开(公告)日：2011-12-05
申请号：KR1020100049746
申请日：2010-05-27
Applicant: 한국전자통신연구원
IPC: H01L23/045 , H01L23/043 , H01L23/52
CPC classification number: H01L23/481 , H01L21/306 , H01L23/522
Abstract: PURPOSE: A manufacturing method of a semiconductor chip including a penetration electrode is provided to remove an edge of a first substrate without adding a resizing process by removing a recess region in forming a penetration hole. CONSTITUTION: In a manufacturing method of a semiconductor chip including a penetration electrode, a first substrate(100) has first and second sides which are faced with each other. The first side of the first substrate is selectively etched to form a recess region and a reserved penetration hole. A metal layer(160) is formed on one side of the second substrate(150). The metal layer of the second substrate and the first side of the first substrate are combined to form a combination structure. A penetration hole exposes the metal layer to the outside. A penetration electrode(140) filling a penetration hole is formed.
Abstract translation: 目的：提供一种包括穿透电极的半导体芯片的制造方法，以在形成贯通孔的同时，通过去除凹部区域而不添加尺寸调整处理来除去第一基板的边缘。 构成：在包括穿透电极的半导体芯片的制造方法中，第一基板（100）具有彼此面对的第一和第二侧面。 选择性地蚀刻第一衬底的第一侧以形成凹陷区域和预留的穿透孔。 金属层（160）形成在第二基板（150）的一侧上。 将第二基板的金属层和第一基板的第一面组合形成组合结构。 穿透孔将金属层暴露于外部。 形成了填充贯通孔的贯通电极（140）。
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Patent Agency Ranking
公开(公告)号：KR1020110070747A
公开(公告)日：2011-06-24
申请号：KR1020100060523
申请日：2010-06-25
Applicant: 한국전자통신연구원
Abstract: PURPOSE: A chemical sensor using nano metal particles and a method for manufacturing the same are provided to achieve small size and excellent sensitivity and durability of a chemical sensor. CONSTITUTION: A chemical sensor comprises metal nano particles(110), ligand organic single-molecules(130), substrate joint functional groups(140), a substrate(150), electrodes(160), and substrate functional groups(170). The ligand organic single-molecules are combined with the metal nano particles through metal joint functional group. The ubstrate joint functional groups are formed in the combined metal nano particles and ligand organic single-molecules. The electrodes are formed as an IDT(Interdigitate Structure) on the substrate. The substrate functional groups are formed between the electrodes on the substrate and covalently bond with the ubstrate joint functional groups.
Abstract translation: 目的：提供使用纳米金属颗粒的化学传感器及其制造方法，以实现化学传感器的小尺寸和优异的灵敏度和耐久性。 构成：化学传感器包括金属纳米颗粒（110），配体有机单分子（130），基底接合官能团（140），基底（150），电极（160）和底物官能团（170）。 配体有机单分子通过金属接头官能团与金属纳米颗粒结合。 组合的金属纳米颗粒和配体有机单分子中形成了基底结合官能团。 电极在基板上形成为IDT（叉指结构）。 衬底官能团形成在衬底上的电极之间并与基板接合官能团共价键合。
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公开(公告)号：KR1020110041179A
公开(公告)日：2011-04-21
申请号：KR1020090098237
申请日：2009-10-15
Applicant: 한국전자통신연구원
CPC classification number: H03H9/0557 , H01L2224/48091 , H01L2924/1461 , H03H9/0514 , H03H9/1014 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A package structure is provided to stack an FBAR(Film Bulk Acoustic Resonator) and an inductor to minimize a size change of a planar area, thereby miniaturizing a product. CONSTITUTION: A resonator(20) is formed on a substrate(10). A plurality of inductors(50) is stacked on a capping substrate(30). The inductors are electrically connected to contact pads(18) formed on both sides of the substrate through a first via contact(32). The contact pads are connected to a lower electrode(22) and an upper electrode(24) of the resonator. The lower electrode and the upper electrode are insulated from the substrate by an interlayer insulating film(12) formed on the substrate.
Abstract translation: 目的：提供封装结构以堆叠FBAR（Film Bulk Acoustic Resonator）和电感器，以最小化平面区域的尺寸变化，从而使产品小型化。 构成：在基板（10）上形成谐振器（20）。 多个电感器（50）堆叠在封盖基板（30）上。 电感器通过第一通孔触点（32）电连接到形成在基板的两侧上的接触焊盘（18）。 接触焊盘连接到谐振器的下电极（22）和上电极（24）。 下电极和上电极通过形成在基板上的层间绝缘膜（12）与基板绝缘。
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公开(公告)号：KR100964971B1
公开(公告)日：2010-06-21
申请号：KR1020070125467
申请日：2007-12-05
Applicant: 한국전자통신연구원
IPC: H01L29/84
CPC classification number: G01L9/0042 , Y10T29/42 , Y10T29/49
Abstract: 본 발명은 초소형 반도체식 압력센서 및 그 제조 방법에 관한 것으로서, 기판의 공동 형성 영역을 트랜치 식각하여 복수의 트랜치를 형성하고, 상기 복수의 트랜치를 열적 산화 공정을 통해 산화시켜, 캐비티 형성용 산화막을 형성한 후, 상기 캐비티 형성용 산화막 및 기판의 상부에 맴브레인 모재용 물질막을 형성하고, 상기 맴브레인 모재용 물질막에 복수의 식각홀을 형성하여, 상기 복수의 식각홀을 통해 상기 캐비티 형성용 산화막을 제거함에 의해, 상기 기판에 매몰된 공동을 형성하며, 상기 맴브레인 모재용 물질막의 상부에 맴브레인 보강층을 형성하여, 공동을 밀폐하는 맴브레인막을 형성하고, 상기 맴브레인막의 상부에 압저항형 소재로 이루어진 감지막을 형성함에 의해 구현된다.
MEMS, 압력 센서, 압저항형, CMOS, 공동, 맴브레인-
公开(公告)号：KR100934217B1
公开(公告)日：2009-12-29
申请号：KR1020070127880
申请日：2007-12-10
Applicant: 한국전자통신연구원
CPC classification number: G01H11/02
Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.
Abstract translation: 提供了一种基于有机硅微机械加工技术的用于测量振动的微机械传感器，其中具有弹性的导体与由于振动产生的力而移动的质量连接，并且通过使用由于该振动产生的感应电动力来测量振动 导体在磁场中移动。
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公开(公告)号：KR100899812B1
公开(公告)日：2009-05-27
申请号：KR1020070043804
申请日：2007-05-04
Applicant: 한국전자통신연구원
IPC: G01P3/483 , G01P15/125
CPC classification number: G01P15/125 , G01P15/0802
Abstract: 종래의 정전용량형 가속도계는 감지 전극과 기준 전극의 간격을 감소시키는 데 한계가 있으며, 복잡한 공정이 요구되며, 공정에 의해 발생하는 간극의 오차를 보정할 수 있는 방법이 별도로 필요한 단점이 있었다. 본 발명의 정전용량형 가속도계는 기준 전극과 감지 전극의 간격을 매우 좁게 유지할 수 있기 때문에 감지 성능이 매우 우수하고 간단한 공정으로 제조할 수 있을 뿐만 아니라, 공정에 의한 성능 편차를 없애거나 크게 줄일 수 있어 소자의 개별 보정이 불필요한 장점이 있다.
가속도계, 정전용량, 감지전극, 기준전극, 멈추개, 구동부
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