-
公开(公告)号：WO2021083608A1
公开(公告)日：2021-05-06
申请号：PCT/EP2020/077611
申请日：2020-10-01
Applicant: ASML NETHERLANDS B.V.
Inventor： ZHANG, Qiang , GUO, Yunbo , CAO, Yu , WANG, Jen-Shiang , LU, Yen-Wen , CHEN, Danwu , YANG, Pengcheng , LIANG, Haoyi , CHEN, Zhichao , PU, Lingling
IPC: G03F7/20
Abstract: A method for training a machine learning model to generate a predicted measured image includes obtaining (a) an input target image associated with a reference design pattern, and (b) a reference measured image associated with a specified design pattern printed on a substrate, wherein the input target image and the reference measured image are non-aligned images; and training, by a hardware computer system and using the input target image, the machine learning model to generate a predicted measured image.
-
公开(公告)号：WO2021037696A1
公开(公告)日：2021-03-04
申请号：PCT/EP2020/073446
申请日：2020-08-20
Applicant: ASML NETHERLANDS B.V.
Inventor： FANG, Wei , PU, Lingling
IPC: H01J37/24 , H01J37/28 , H01J37/304
Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include receiving records ((502), (506) of a performance metric for beams of the multi-beam system in an imaging process, each record associated with a beam. The method may also include determining whether an abnormality of a beam occurs based on a baseline value (504) determined using a portion (502) of the records. The method may further include providing an abnormality indication in response to the determination that the abnormality has occurred.
-
公开(公告)号：WO2020141092A1
公开(公告)日：2020-07-09
申请号：PCT/EP2019/086466
申请日：2019-12-19
Applicant: ASML NETHERLANDS B.V.
Inventor： PU, Lingling , FANG, Wei , CHEN, Zhong-wei
IPC: G03F7/20
Abstract: Systems and methods for in-die metrology using target design patterns are provided. These systems and methods include selecting a target design pattern based on design data representing the design of an integrated circuit, providing design data indicative of the target design pattern to enable design data derived from the target design pattern to be added to second design data, wherein the second design data is based on the first design data. Systems and methods can further include causing structures derived from the second design data to be printed on a wafer, inspecting the structures on the wafer using a charged-particle beam tool, and identifying metrology data or process defects based on the inspection. In some embodiments the systems and methods further include causing the charged-particle beam tool, the second design data, a scanner, or photolithography equipment to be adjusted based on the identified metrology data or process defects.
-
公开(公告)号：WO2020083612A1
公开(公告)日：2020-04-30
申请号：PCT/EP2019/076370
申请日：2019-09-30
Applicant: ASML NETHERLANDS B.V.
Inventor： FANG, Wei , PU, Lingling
Abstract: A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.
-
公开(公告)号：WO2022263104A1
公开(公告)日：2022-12-22
申请号：PCT/EP2022/063752
申请日：2022-05-20
Applicant: ASML NETHERLANDS B.V.
Inventor： PU, Lingling , LIN, Yuzhang , WANG, Teng , WANG, Bo , LA GRECA, Raphael, Eric , HUNSCHE, Stefan
Abstract: To monitor semiconductor manufacturing process variation, contours of identical pattern features are determined based on SEM images, and the contours are aggregated and statistically analyzed to determine the variation of the feature. Some of the contours are outliers, and the aggregation and averaging of the contours "hides" these outliers. The present disclosure describes filtering certain outlier contours before they are aggregated and statistically analyzed. The filtering can be performed at multiple levels, such as based on individual points on the contours in the set of inspection contours, or based on overall geometrical shapes of the contours in the set of inspection contours.
-
Patent Agency Ranking16.发明申请
公开(公告)号：WO2021160436A1
公开(公告)日：2021-08-19
申请号：PCT/EP2021/051897
申请日：2021-01-27
Applicant: ASML NETHERLANDS B.V.
Inventor： PU, Lingling , FANG, Wei
Abstract: An improved apparatus and method for extracting pattern contour information from an inspection image in a multiple charged-particle beam inspection system are disclosed. An improved method for extracting pattern contour information from an inspection image comprises identifying, from an inspection image obtained from a charged-particle beam inspection system, a first pattern and a second pattern that partially overlap in the inspection image. The method also comprises generating a first separation image by removing an image area corresponding to the second pattern from the inspection image. The first separation image includes the first pattern of which a first part is removed when removing the image area corresponding to the second pattern. The method also comprises updating the first separation image to include image data representing the removed first part of the first pattern based on a first reference image corresponding to the first pattern.
-
17.发明申请
公开(公告)号：WO2021123075A1
公开(公告)日：2021-06-24
申请号：PCT/EP2020/086903
申请日：2020-12-17
Applicant: ASML NETHERLANDS B.V.
Inventor： FANG, Wei , ZHOU, Zhengwei , PU, Lingling
IPC: H01J37/02 , H01J37/26 , H01J37/317 , H01J2237/0435 , H01J2237/2817 , H01J2237/31774 , H01J37/3177
Abstract: A system and method for defect inspection using voltage contrast in a charged particle system are provided. Some embodiments of the system and method include positioning the stage at a first position to enable a first beam of the plurality of beams to scan a first surface area of the wafer at a first time to generate a first image associated with the first surface area; positioning the stage at a second position to enable a second beam of the plurality of beams to scan the first surface area at a second time to generate a second image associated with the first surface area; and comparing the first image with the second image to enable detecting whether a defect is identified in the first surface area of the wafer.
-
公开(公告)号：WO2021028366A1
公开(公告)日：2021-02-18
申请号：PCT/EP2020/072332
申请日：2020-08-08
Applicant: ASML NETHERLANDS B.V.
Inventor： FANG, Wei , PU, Lingling , WANG, Bo , DONG, Zhonghua , WANG, Yongxin
IPC: H01J37/22
Abstract: An improved apparatus and method for enhancing an image, and more particularly an apparatus and method for enhancing an image through cross-talk cancellation in a multiple charged- particle beam inspection are disclosed. An improved method for enhancing an image includes acquiring a first image signal of a plurality of image signals from a detector of a multi-beam inspection system. The first image signal corresponds to a detected signal from a first region of the detector on which electrons of a first secondary electron beam and of a second secondary electron beam are incident. The method includes reducing, from the first image signal, cross-talk contamination originating from the second secondary electron beam using a relationship between the first image signal and beam intensities associated with the first secondary electron beam and the second secondary electron beam. The method further includes generating a first image corresponding to first secondary electron beam after reduction.
-
公开(公告)号：WO2020141072A1
公开(公告)日：2020-07-09
申请号：PCT/EP2019/085720
申请日：2019-12-17
Applicant: ASML NETHERLANDS B.V.
Inventor： ZHOU, Wentian , YU, Liangjiang , WANG, Teng , PU, Lingling , FANG, Wei
Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.
-
公开(公告)号：WO2020011580A1
公开(公告)日：2020-01-16
申请号：PCT/EP2019/067555
申请日：2019-07-01
Applicant: ASML NETHERLANDS B.V.
Inventor： FANG, Wei , PU, Lingling , HUISMAN, Thomas, Jarik , SMAKMAN, Erwin, Paul
Abstract: Systems and methods for image enhancement using a multi-beam device are disclosed. A method for enhancing an image includes acquiring a first scanning electron microscopy (SEM) image by use of an on-axis beam of the multi-beam device. The method further includes acquiring a second SEM image by use of an off-axis beam of the multi-beam device. The method further includes providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.026 seconds)
