公开(公告)号：EP1628344A2

公开(公告)日：2006-02-22

申请号：EP05076730.0

申请日：2005-07-27

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: B29C45/14655 ,  B29C45/7207 ,  H01L23/4334 ,  H01L23/473 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method of making a fluid cooled microelectronic package (10'/60') in which fluid is circulated through the package in fluid-carrying channels (40/64) defined at least in part by voids in an encapsulant (38) that surrounds the package components (12, 14, 16). Preferably, the encapsulant channels (40/64) are defined in part by heat producing components (12, 14, 16) of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels (40) are formed by insert-molding a form (24) in the encapsulant (38), and removing the form (24) following the molding process. Alternately, the encapsulant is formed in two or more pieces (38a, 38b) that are joined to form the package (60'), and the coolant channels (64) are defined by recesses (62) formed in at least one of the encapsulant pieces (38a, 38b).

Abstract translation: 一种制造流体冷却微电子封装的方法（10“/ 60”），其中流体通过封装在至少部分地由空隙在密封件（38）限定流体输送通道（40/64）循环没有包围 封装部件（12，14，16）。 优选地，密封剂通道（40/64）部分地由封装的发热元件（12，14，16）中所定义所以没有冷却流体直接接触的搜索组件。 冷却剂流体可以是导电的或其他非导电性取决于被冷却部件的类型。 冷却剂通道（40）通过嵌件成型在所述密封剂（38）的模具（24），并除去之后在模制过程中模具（24）形成。 可替换地，密封剂在两个或更多个部件形成（38A，38B）没有被接合，以形成在密封剂中的至少一种所形成的包装件（60“），以及冷却剂通道（64）由凹部（62）被定义 件（38A，38B）。

公开(公告)号：EP1523036A2

公开(公告)日：2005-04-13

申请号：EP04077669.2

申请日：2004-09-28

Applicant: Delphi Technologies, Inc.

Inventor： Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/367 ,  H01L25/065

CPC classification number: H01L23/42 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (18) and a semiconductor device (12) mounted to the substrate (18). The semiconductor device (12) has electrical circuitry a first surface, and a second surface oppositely disposed from the first surface. A thermally conductive heat sink (30) is assembled over the semiconductor device (12) such that a cavity (32) is formed between the semiconductor device (12) and the heat sink (30). A thermally conductive and electrically insulative material (36) is disposed in the cavity (32) between the semiconductor device (12) and the heat sink (30).

Abstract translation: 提供具有增强的散热的电子封装（10），其在相反的方向上呈现出双重传导热路（40,42）。 封装（10）包括衬底（18）和安装到衬底（18）的半导体器件（12）。 半导体器件（12）具有电路，第一表面和与第一表面相对设置的第二表面。 导热散热器（30）组装在半导体器件（12）上，使得在半导体器件（12）和散热器（30）之间形成空腔（32）。 导热和电绝缘材料（36）设置在半导体器件（12）和散热器（30）之间的空腔（32）中。

公开(公告)号：EP2244290A3

公开(公告)日：2013-01-16

申请号：EP10159242.6

申请日：2010-04-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chengalva, Suresh K. ,  Peugh, Darrel E.

IPC: H01L23/473 ,  H01L23/427

CPC classification number: H01L23/473 ,  F28F3/048 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating component (10) including a heat-generating device (12) such as a power semiconductor chip and mounting structure (14) is provided with coolant channels (18) having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels (18), and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels (18). The stair-stepped channels (18) are formed in the heat-generating device (12) and/or the mounting structure (14), and the stepped sidewalls (19a, 19b) may extend toward or away from the center of the channel (18).

公开(公告)号：EP1526571A3

公开(公告)日：2011-06-15

申请号：EP04077853.2

申请日：2004-10-14

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Myers, Bruce A.

IPC: H01L23/495 ,  H01L23/433

CPC classification number: H01L23/49568 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic package (10) and packaging method in which integral convective fins are formed of portions of a leadframe (14) from which electrical leads (18) are also formed. The leadframe (14) comprises a base (16) and first and second sets of leads (18,28) extending from the base (16). The first set of leads (18) is separated from the base (16) and from the second set of leads (28), such that each lead of the first set has an interior end adjacent but separate from the base (16), and each lead of the second set has an interior portion that remains attached to the base (16). A circuit device (12) is mounted to the base (16) and electrically connected to the interior ends of the first set of leads (18). The device (12), base (16), and interior ends and portions of the leads are then encased within a housing (26). Exterior ends of the leads remain outside the housing (26) as package (10) terminals and thermal dissipaters.

公开(公告)号：EP2244290A2

公开(公告)日：2010-10-27

申请号：EP10159242.6

申请日：2010-04-07

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Chengalva, Suresh K. ,  Peugh, Darrel E.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  F28F3/048 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating component (10) including a heat-generating device (12) such as a power semiconductor chip and mounting structure (14) is provided with coolant channels (18) having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels (18), and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels (18). The stair-stepped channels (18) are formed in the heat-generating device (12) and/or the mounting structure (14), and the stepped sidewalls (19a, 19b) may extend toward or away from the center of the channel (18).

Abstract translation: 包括诸如功率半导体芯片和安装结构（14）的发热设备（12）的散热部件（10）设置有具有阶梯式内部几何形状的冷却剂通道（18），其具有两个单独的增强的冷却性能 相和两相冷却模式，而不会过度限制冷却剂流动或显着增加制造成本。 阶梯式几何通过增加通道（18）的表面积来增强单相和两相冷却模式，并且通过提供多个高质量的气泡成核位点来进一步提高两相冷却模式，沿着长度方向 通道（18）。 阶梯式通道（18）形成在发热装置（12）和/或安装结构（14）中，阶梯状侧壁（19a，19b）可以朝向或远离通道的中心延伸 18）。

公开(公告)号：EP1956650A1

公开(公告)日：2008-08-13

申请号：EP08150885.5

申请日：2008-01-31

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Chengalva, Suresh K.

IPC: H01L23/473

CPC classification number: H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: An electronic device (10) is provided having a bimetallic fluid circulator (30) for circulating fluid coolant in relation to electrical circuitry (22) to provide enhanced heat exchange. The fluid circulator (30) includes a first thin sheet (32) exhibiting a first coefficient of thermal expansion (CTE) and the second thin sheet (34) dissimilar from the first thin sheet (32) and exhibiting a second CTE that is substantially different than the first CTE. The first and second thin sheets (32, 34) are bonded together. The first and second thin sheets (32, 34) expand and contract at different rates based on changes in temperature such that the first and second thin sheets (32, 34) change shape to create a fanning motion to circulate the fluid and thus cool the electrical device (22).

Abstract translation: 电子设备（10）具有双金属流体循环器（30），用于相对于电路（22）循环流体冷却剂以提供增强的热交换。 流体循环器（30）包括表现出第一热膨胀系数（CTE）的第一薄片（32）和与第一薄片（32）不同的第二薄片（34），并且呈现出基本不同的第二CTE 比第一个CTE。 第一和第二薄片（32,34）结合在一起。 第一和第二薄片（32,34）基于温度的变化以不同的速率膨胀和收缩，使得第一和第二薄片（32,34）改变形状以产生使流体循环的扇形运动，从而冷却 电气设备（22）。

公开(公告)号：EP1760721A2

公开(公告)日：2007-03-07

申请号：EP06076603.7

申请日：2006-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Wilson, Scott E. ,  Myers, Bruce A.

IPC: G11B33/14

CPC classification number: G11B17/028 ,  G11B17/0282 ,  G11B33/142

Abstract: The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.

Abstract translation: 本发明涉及诸如CD或DVD播放器和记录器之类的电子部件和其中的盘或盘的冷却。 具体来说，本发明涉及盘片播放或记录装置的内部冷却以及其内的盘或盘。

公开(公告)号：EP1734578A1

公开(公告)日：2006-12-20

申请号：EP06076155.8

申请日：2006-06-02

Applicant: Delphi Technologies, Inc.

Inventor： Brandenberg, Scott D. ,  Chengalva, Suresh K.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.

Abstract translation: 冷却的电子组件包括集成电路器件载体（例如印刷电路板），器件（例如倒装芯片），液体泵，成型材料，热交换器和盖。 该装置和液体泵电连接到集成电路装置载体。 模制材料被模制到装置，液体泵和集成电路装置载体上。 盖具有流体地连接到热交换器的冷却剂通道，其中盖附接到模制材料。 冷却剂通道和热交换器一起至少部分地限定了封闭的冷却剂回路。 液体泵可操作地连接到封闭的冷却剂回路。 一种用于冷却印刷电路板的方法包括将液体冷却剂放置在封闭的冷却剂回路中并通过印刷电路板电激活液体泵。

公开(公告)号：EP1703557A2

公开(公告)日：2006-09-20

申请号：EP06075528.7

申请日：2006-03-07

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Myers, Bruce A. ,  Walsh, Matthew R.

IPC: H01L23/427 ,  H01L23/373 ,  H01L23/367 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic assembly (100) with integral thermal transient suppression includes an integrated circuit (IC) chip (106) disposed within a cavity (103) of an IC device package (102). A transient thermal suppression material (TTSM) (110) is disposed in the cavity (103) in thermal contact with the IC chip (106). A heat sink (112) may also be provided in thermal contact with the chip (106). When present, the heat sink (112) serves as a cover of the packaged IC chip (106) and may include fins (112A,112B) extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM (110)).The TTSM (110) may be thought of as a phase change material that absorbs energy dissipated by the IC chip (106) in a phase change event.

Abstract translation: 具有整体热瞬变抑制的电子组件（100）包括设置在IC器件封装（102）的空腔（103）内的集成电路（IC）芯片（106）。 瞬时热抑制材料（TTSM）（110）设置在与IC芯片（106）热接触的空腔（103）中。 还可以提供与芯片（106）热接触的散热器（112）。 当存在时，散热器（112）用作封装的IC芯片（106）的盖子，并且可以包括从上表面（与空气接触）和下表面（与空气接触的热表面）延伸的翅片（112A，112B） TTSM（110）），TTSM（110）可以被认为是在相变事件中吸收由IC芯片（106）消耗的能量的相变材料。

公开(公告)号：EP1628345A2

公开(公告)日：2006-02-22

申请号：EP05076743.3

申请日：2005-07-28

Applicant: Delphi Technologies, Inc.

Inventor： Brandenbrug, Scott D. ,  Chengalva, Suresh K. ,  Degenkolb, Thomas A.

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semiconductor chips (12, 14, 16). The encapsulant (34) immobilizes the cooling tube (22) with respect to the semiconductor chips (12, 14, 16), and the cooling tube (22) and encapsulant (34) are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips (12, 14, 16).

Abstract translation: 封装的微电子封装包括直接耦合到一个或多个半导体芯片（12,14,16）的流体导电冷却管（22），其中密封剂（34）模制在半导体芯片（12,14,16）上，部分 靠近半导体芯片（12,14,16）的冷却管（22）。 密封剂（34）相对于半导体芯片（12,14,16）固定冷却管（22），并且冷却管（22）和密封剂（34）被设计成使其热膨胀系数相对较小 到半导体芯片（12,14,16）。