公开(公告)号：EP1703557A2

公开(公告)日：2006-09-20

申请号：EP06075528.7

申请日：2006-03-07

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Myers, Bruce A. ,  Walsh, Matthew R.

IPC: H01L23/427 ,  H01L23/373 ,  H01L23/367 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic assembly (100) with integral thermal transient suppression includes an integrated circuit (IC) chip (106) disposed within a cavity (103) of an IC device package (102). A transient thermal suppression material (TTSM) (110) is disposed in the cavity (103) in thermal contact with the IC chip (106). A heat sink (112) may also be provided in thermal contact with the chip (106). When present, the heat sink (112) serves as a cover of the packaged IC chip (106) and may include fins (112A,112B) extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM (110)).The TTSM (110) may be thought of as a phase change material that absorbs energy dissipated by the IC chip (106) in a phase change event.

Abstract translation: 具有整体热瞬变抑制的电子组件（100）包括设置在IC器件封装（102）的空腔（103）内的集成电路（IC）芯片（106）。 瞬时热抑制材料（TTSM）（110）设置在与IC芯片（106）热接触的空腔（103）中。 还可以提供与芯片（106）热接触的散热器（112）。 当存在时，散热器（112）用作封装的IC芯片（106）的盖子，并且可以包括从上表面（与空气接触）和下表面（与空气接触的热表面）延伸的翅片（112A，112B） TTSM（110）），TTSM（110）可以被认为是在相变事件中吸收由IC芯片（106）消耗的能量的相变材料。

公开(公告)号：EP2043150B1

公开(公告)日：2016-07-20

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66 ,  H01Q23/00 ,  H01P5/107

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

公开(公告)号：EP2043150A3

公开(公告)日：2011-11-02

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66 ,  H01Q23/00 ,  H01P5/107

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

Abstract: A microwave communication package (10) is constructed on an electrically conducting base plate (12) having a first side (14) defining a base plate cavity (16), with an antenna apparatus (40) mounted on an opposite, second side (18). A dielectric substrate (20) on the first side of the base plate covers the base plate cavity; and sealing apparatus (72) contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry (30, 32) mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines (54) communicating components (30) to one or more waveguides comprising openings (50) extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

公开(公告)号：EP1748518A3

公开(公告)日：2010-12-22

申请号：EP06076297.8

申请日：2006-06-26

Applicant: Delphi Technologies, Inc.

Inventor： Brandeburg, Scott D. ,  Degenkolb, Thomas A. ,  Walsh, Matthew R.

IPC: H01R12/04

CPC classification number: H01R43/0256 ,  H01R12/716 ,  H01R43/0249

Abstract: A surface mount connector (11) and assembly including the surface mount connector (10) is shown and described. The assembly comprises a substrate (13) and a connector (11) including a carrier (14), and at least one electrical connecting element (16) having first (22) and second ends (24), wherein at least a portion of the first end (22) extends through the carrier (14) to electrically adjoin and physically secure the connector (11) to the substrate (13). A reinforcement medium (36) is disposed about at least a portion of surface mount connector (11) and said substrate (13).

公开(公告)号：EP1740027A2

公开(公告)日：2007-01-03

申请号：EP06076193.9

申请日：2006-06-08

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Walsh, Matthew R. ,  Tsai, Jeenhuei S.

IPC: H05K3/28

CPC classification number: H01L23/4334 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14655 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A technique for manufacturing an electronic assembly (100) uses a mold (40) that has a first mold portion (44) and a second mold portion (42). The first mold portion (44) includes a plurality of spaced mold pins (46) extending from an inner surface. A cavity of the first and second mold portions (44,42) provides a mold cavity (11), when joined. A backplate (110) is also provided that includes a plurality of support pedestals (112) and an integrated heatsink (114) extending from a first side of the backplate (110). A substrate (102) includes a first side of an integrated circuit (IC) die (106A) mounted to a first side of the substrate (102). The backplate (110) and the substrate (102) are placed within the cavity of the second mold portion and the support pedestals (112) are in contact with the first side of the substrate (102). The first and second mold portions (44,42) are joined and the mold pins (46) contact a second surface of the substrate (102) during an overmolding process.

Abstract translation: 一种用于制造电子组件的技术使用具有第一模具部分（44）和第二模具部分（42）的模具（40）。 第一模具部分（44）包括从内表面延伸的多个间隔开的模具销（46）。 当连接时，第一和第二模具部分（44,42）的空腔提供模腔（111）。 还提供了一个背板（110），其包括多个支撑基座（112）和从背板（110）的第一侧延伸的集成散热器（114）。 衬底（102）包括安装到衬底（102）的第一侧的集成电路（IC）管芯（106A）的第一侧。 背板（110）和基板（102）被放置在第二模具部分的空腔内，并且支撑基座（112）与基板（102）的第一侧接触。 第一和第二模具部分（44,42）在重叠模制过程中接合并且模具销（46）接触基板（102）的第二表面。

公开(公告)号：EP1530234A2

公开(公告)日：2005-05-11

申请号：EP04077976.1

申请日：2004-10-29

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Oman, Todd P. ,  Walsh, Matthew R.

IPC: H01L23/36

CPC classification number: H01L23/5387 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A heat sinkable package that includes a power device package (200, 300, 400, 500) including an active side (A) and a non-active side (N) is disclosed. The non-active side (N) includes a heat sinkable surface positioned adjacent to a product case (C). Another embodiment of the invention is directed to a method for manufacturing a heat sinkable package. The method comprises the steps of placing at least one flip chip (204, 304) over a flexible circuit (208) within a mold tool; compensating for height variances of the flip chips (204, 204); and positioning an input/output on an active side (A) of the power device package (200, 300, 400, 500) opposite a non-active side (N) of the power device package.

Abstract translation: 公开了一种包括主动侧（A）和非活动侧（N）的功率器件封装（200,300,400,500）的散热封装。 非活性侧（N）包括邻近产品外壳（C）定位的散热表面。 本发明的另一实施例涉及一种用于制造可散热封装的方法。 该方法包括以下步骤：将至少一个倒装芯片（204,304）放置在模具工具内的柔性电路（208）上; 补偿倒装芯片（204,204）的高度方差; 以及将功率器件封装（200,300,400,500）上的与所述功率器件封装的非有源侧（N）相对的有源侧（A）上的输入/输出定位。

公开(公告)号：EP1460684A1

公开(公告)日：2004-09-22

申请号：EP04075615.7

申请日：2004-02-26

Applicant: Delphi Technologies, Inc.

Inventor： Workman, Derek B. ,  Stepniak, Frank ,  Chaudhuri, Arun K. ,  Walsh, Matthew R.

IPC: H01L21/58 ,  H01L21/56 ,  H01L21/60 ,  C08L63/00 ,  C08K5/54

CPC classification number: H01L24/29 ,  C08K5/54 ,  H01L21/563 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A no-flow underfill material (20) and process suitable for underfilling a bumped circuit component (10). The underfill material (20) initially comprises a dielectric polymer material (22) in which is dispersed a precursor capable of reacting to form an inorganic filler (24). The underfill process generally entails dispensing the underfill material (20) over terminals (18) on a substrate (16), and then placing the component (10) on the substrate (16) so that the underfill material (20) is penetrated by the bumps (12) on the component (10) and the bumps (12) contact the terminals (18) on the substrate (16). The bumps (12) are then reflowed to form solid electrical interconnects (26) that are encapsulated by the resulting underfill layer (28). The precursor may be reacted to form the inorganic filler (24) either during or after reflow.

Abstract translation: 无流动底部填充材料（20）和适合于填充凸起电路部件（10）的工艺。 底部填充材料（20）最初包含介电聚合物材料（22），其中分散有能够反应形成无机填料（24）的前体。 底部填充过程通常需要将底部填充材料（20）分配在基底（16）上的端子（18）上，然后将部件（10）放置在基底（16）上，使得底部填充材料（20）被 组件（10）上的凸块（12）和凸块（12）接触基板（16）上的端子（18）。 然后将凸起（12）回流以形成由所形成的底部填充层（28）封装的固体电互连（26）。 在回流期间或之后，可以将前体反应以形成无机填料（24）。

公开(公告)号：EP1333079A1

公开(公告)日：2003-08-06

申请号：EP03075164.8

申请日：2003-01-17

Applicant: Delphi Technologies, Inc.

Inventor： Chaudhuri, Arun K. ,  Stepniak, Frank ,  Walsh, Matthew R.

IPC: C09J9/02 ,  C09J163/00 ,  C08K3/08 ,  C08K9/02

CPC classification number: H05K3/321 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: A conductive adhesive material (12) characterized by metallurgical bonds (24) between electrically-conductive particles (20) dispersed in a polymer matrix (22) of the material (12). The polymer matrix (22) has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles (20). At least the outer surfaces of the particles (20) are formed of a fusible material, so that sufficiently heating the conductive adhesive material (12) will reduce metal oxides on the particles (20), and at least partially melt the fusible metal, enabling the particles (20) to metallurgically bond to each other and to metal surfaces (14,16,44,46,54,56) contacted by the adhesive material (12).

Abstract translation: 导电粘合剂材料（12），其特征在于分散在材料（12）的聚合物基体（22）中的导电颗粒（20）之间的冶金结合（24）。 聚合物基体（22）在加热时具有助熔能力，以减少颗粒（20）表面上的金属氧化物。 至少颗粒（20）的外表面由易熔材料形成，使得充分加热导电粘合剂材料（12）将减少颗粒（20）上的金属氧化物，并且至少部分地熔化可熔金属，使得能够 所述颗粒（20）彼此冶金地结合并与由所述粘合剂材料（12）接触的金属表面（14,16,44,46,54,56）。