Abstract:
According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition including (A) a compound represented by a general formula (1) below that generates an acid when exposed to actinic rays or radiation, and (B) a resin.
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein (B) the compound capable of generating an acid upon irradiation with an actinic ray or radiation is contained in an amount of 10 to 30 mass % based on the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method uses the composition.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method, a photosensitive or radiation-sensitive resin composition, a resist film and a compound, a method for manufacturing an electronic device, and an electronic device, which exhibit high roughness performance and defocusing performance in the formation of an ultrafine pattern (particularly a trench pattern or a hole pattern in a size of 50 nm or less), and excellent resolution and exposure latitude.SOLUTION: The pattern forming method includes steps of (1) forming a film comprising the following photosensitive or radiation-sensitive resin composition, (2) exposing the film, and (3) developing the film with an organic solvent-containing developer to form a negative pattern. The photosensitive or radiation-sensitive resin composition comprises a compound (A) expressed by general formula (I-1), a compound (B) which is different from the compound (A) and generates an acid by irradiation with actinic rays or radiation, and a resin (P) which does not react with an acid generated from the compound (A) but shows decrease in the solubility with an organic solvent-containing developer by an action of an acid from the compound (B). Also disclosed are the photosensitive or radiation-sensitive resin composition, a resist film, the compound (A), a method for manufacturing an electronic device, and an electronic device.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition having effect in improvement of a trailing shape of a resist pattern and capable of forming a pattern with good LER performance, and a pattern forming method using the composition.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition comprises: (A) resin increasing solubility of the resin in alkali developer by action of acid; and (B) a compound generating the acid by irradiation with an actinic ray or a radiation ray. The compound generating the acid by the irradiation with the actinic ray or the radiation ray is contained by an amount of 10 to 30 mass% on the basis of the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition. A pattern forming method uses the composition.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition allowing both suppression of pattern collapse and formation of a pattern being excellent in storage stability upon water intrusion and having an excellent shape.SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is characterized by containing (A) a resin comprising a repeating unit having a cyclic acid anhydride structure and a repeating unit generating an alkali-soluble group by decomposition with the action of an acid; (B) a compound generating an acid by irradiation with an actinic ray or radiation; and (C) a compound represented by any of the general formulas (C1-1) to (C1-4) and having a boiling point of 250°C or less at an atmospheric pressure of 1013 hPa.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method having excellent roughness performance such as line width roughness, uniformity in a local pattern dimension and exposure latitude and suppressing reduction in a film thickness, so-called film loss, in a pattern formed by exposure, and to provide an actinic ray-sensitive or radiation-sensitive resin composition and a resist film used for the method.SOLUTION: The pattern forming method includes the steps of: (1) forming a film of an actinic ray-sensitive or radiation-sensitive resin composition comprising resin (P) having a repeating unit (a) expressed by a general formula (I) and a compound (B) generating an organic acid upon irradiation with actinic rays or radiation; (2) exposing the film; and (3) developing the film by using a developing solution containing an organic solvent to form a negative pattern. In the general formula (I), Rrepresents a hydrogen atom or a methyl group; and R, R, and Reach independently represent a straight-chain or branched alkyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method which enables to form a pattern with few development defects, and an organic processing liquid used in the method.SOLUTION: The pattern forming method includes: (a) forming a film using a chemically amplified resist composition; (b) exposing the film; and (c) processing the exposed film using an organic processing liquid. The processing liquid contains an organic solvent having a standard boiling point of ≥175°C and a content rate of the solvent in the processing liquid is
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method, a chemically amplified resist composition and a resist film, with high resolution and excellent pattern shape, capable of reducing LWR.SOLUTION: A pattern forming method includes: (1) a step for forming a film from a chemically amplified resist composition containing (A) a resin in which polarity is increased and solubility in a developer containing an organic solvent is reduced by action of acid, (B) a compound that generates acid by irradiating active light or radiation, and (C) a solvent; (2) a step for exposing the film; and (3) a step for developing using the developer containing the organic solvent. The resin (A) has a structure in which polar groups are protected with a leaving group that leaves when decomposed by action of acid; and the leaving group includes a fluorine atom.