中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

18 records (took 0.022 seconds)

    Stacked or Rolled Film capacitor
    11.
    发明专利
    Stacked or Rolled Film capacitor 未知

    公开(公告)号：GB2455866A

    公开(公告)日：2009-06-24

    申请号：GB0822496

    申请日：2008-12-10

    Applicant: GEN ELECTRIC

    Inventor： DELGADO ELADIO CLEMENTE ,  ROOIJ MICHAEL ANDREW DE ,  IRWIN PATRICIA CHAPMAN ,  CAO YANG

    IPC: H01G4/245 ,  H01G4/232 ,  H01G4/30 ,  H01G4/32

    Abstract: A product and method of manufacture of a film capacitor 90 includes metallization 93, 96 that is sectionalized, patterned and configured to provide interconnections 100, 102 on only one face of a rolled or stacked film capacitor. The metalized process forms a dielectric film electrode structure. Alternatively, a method of rolling the dielectric structure to form a rolled capacitor or alternatively the rolled structure is sliced into numerous sections and the numerous sections stacked to form a stacked capacitor or simply a plurality of dielectric structures are stacked to form a stacked film capacitor.

    POWER CIRCUIT PACKAGE AND FABRICATION METHOD
    12.
    发明专利
    POWER CIRCUIT PACKAGE AND FABRICATION METHOD 未知

    公开(公告)号：CA2563480A1

    公开(公告)日：2007-04-26

    申请号：CA2563480

    申请日：2006-10-12

    Applicant: GEN ELECTRIC

    Inventor： BEAUPRE RICHARD ALFRED ,  DELGADO ELADIO CLEMENTE

    IPC: H01L23/00 ,  H01L23/02 ,  H01L23/48 ,  H01L23/488 ,  H01L23/52 ,  H01L25/00

    Abstract: A power circuit package (10) includes a base (12) including a substrate (14) , a plurality of interconnect circuit layers (16) over the substrate with each including a substrate insulating layer (18) patterned with substrate electrical interconnects (20), and via connections (22, 24) extending from a top surface of the substrate t o at least one of the substrate electrical interconnects (20); and a power semiconducto r module (26) including power semiconductor devices (28) each including device pads (30) on a top surface of the respective power semiconductor device and backside contacts (31) on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure (32), the membra ne structure including a membrane insulating layer (34) and membrane electrical interconnects (36) over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts (31) are coupled to selected substrate electrical interconnects or via connections.

    BUSBAR ELECTRICAL POWER CONNECTOR
    13.
    发明专利
    BUSBAR ELECTRICAL POWER CONNECTOR 未知

    公开(公告)号：CA2740681C

    公开(公告)日：2013-10-15

    申请号：CA2740681

    申请日：2011-05-19

    Applicant: GEN ELECTRIC

    Inventor： DELGADO ELADIO CLEMENTE ,  STEVANOVIC LJUBISA ,  BEAUPRE RICHARD ALFRED

    IPC: H01R24/28 ,  H01R24/20 ,  H02B1/20

    Abstract: A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end.

    BUSBAR ELECTRICAL POWER CONNECTOR
    15.
    发明专利
    BUSBAR ELECTRICAL POWER CONNECTOR 未知

    公开(公告)号：CA2740681A1

    公开(公告)日：2011-12-03

    申请号：CA2740681

    申请日：2011-05-19

    Applicant: GEN ELECTRIC

    Inventor： DELGADO ELADIO CLEMENTE ,  STEVANOVIC LJUBISA ,  BEAUPRE RICHARD ALFRED

    IPC: H01R24/28 ,  H01R24/20 ,  H02B1/20

    Abstract: A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end.

    17.
    发明专利
    未知

    公开(公告)号：BRPI0505156A

    公开(公告)日：2006-07-11

    申请号：BRPI0505156

    申请日：2005-11-23

    Applicant: GEN ELECTRIC

    Inventor： STEVANOVIC LJUBISA DRAGOLJUB ,  DELGADO ELADIO CLEMENTE ,  SCHUTTEN MICHAEL JOSEPH ,  BEAUPRE RICHARD ALFRED ,  ROOIJ MICHAEL ANDREW DE

    IPC: H01H37/00

    Abstract: A power module (10) includes a substrate (12) that includes an upper layer (16), an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern (17) and is configured for receiving power devices (14). The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect (18) that includes first and second electrically conductive layers (20, 24) and an insulating layer (22) disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections (42) connect a top side (19) of the power devices to the second electrically conductive layer of the laminar interconnect.

Patent Agency Ranking