公开(公告)号：DE69300907T2

公开(公告)日：1996-06-20

申请号：DE69300907

申请日：1993-08-24

Applicant: IBM

Inventor： KNICKERBOCKER JOHN ULRICH ,  PERRY CHARLES HAMPTON ,  WALL DONALD RENE

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: Disclosed is a multilayer ceramic substrate (30) for electronic applications including: (a) at least one internal layer (32) having vias (34) filled with a metallic material; (b) at least one sealing layer (40) having vias (42) filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer (46) located between the internal and sealing layers having vias (48) filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. Also disclosed is a method of forming the multilayer ceramic substrate.

公开(公告)号：DE69937170T2

公开(公告)日：2008-06-26

申请号：DE69937170

申请日：1999-07-01

Applicant: IBM

Inventor： BEETESON JOHN STUART ,  KNICKERBOCKER JOHN ULRICH ,  KNOX ANDREW RAMSAY ,  LOWE ANTHONY CYRIL

IPC: H01J1/46 ,  H01J29/46 ,  H01J3/02 ,  H01J29/02 ,  H01J29/68 ,  H01J31/12

Abstract: An electron source comprises a cathode means, and an extractor grid used to extract electrons from the cathode. The extractor grid is formed by etching a plurality of apertures in the material. A plurality of spacing members for spacing the extractor grid at a constant, predetermined spacing from the cathode are used. Each of the spacing members is formed by etching around a substantial portion of the periphery of the aperture and folding a remaining portion of the periphery of the aperture at substantially a right angle to the planar material.

公开(公告)号：SG55312A1

公开(公告)日：1998-12-21

申请号：SG1997001479

申请日：1997-05-10

Applicant: IBM

Inventor： REDDY SRINIVASA S N ,  KNICKERBOCKER JOHN ULRICH ,  WALL DONALD RENE

IPC: C23C16/08 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H05K3/24 ,  C23C16/06

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces (32, 34) which are capable of receiving nickel or alloys thereof, using an Iodide source (23), preferably an Iodide salt, such as, Copper Iodide.

公开(公告)号：AT374431T

公开(公告)日：2007-10-15

申请号：AT99305204

申请日：1999-07-01

Applicant: IBM

Inventor： BEETESON JOHN STUART ,  KNICKERBOCKER JOHN ULRICH ,  KNOX ANDREW RAMSAY ,  LOWE ANTHONY CYRIL

IPC: H01J1/46 ,  H01J3/02 ,  H01J29/02 ,  H01J29/46 ,  H01J29/68 ,  H01J31/12

Abstract: An electron source comprises a cathode means, and an extractor grid used to extract electrons from the cathode. The extractor grid is formed by etching a plurality of apertures in the material. A plurality of spacing members for spacing the extractor grid at a constant, predetermined spacing from the cathode are used. Each of the spacing members is formed by etching around a substantial portion of the periphery of the aperture and folding a remaining portion of the periphery of the aperture at substantially a right angle to the planar material.

公开(公告)号：ES2166506T3

公开(公告)日：2002-04-16

申请号：ES97304018

申请日：1997-06-10

Applicant: IBM

Inventor： REDDY SRINIVASA S N ,  KNICKERBOCKER JOHN ULRICH ,  WALL DONALD RENE

IPC: C23C16/08 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H05K3/24

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces (32, 34) which are capable of receiving nickel or alloys thereof, using an Iodide source (23), preferably an Iodide salt, such as, Copper Iodide.

公开(公告)号：AT209263T

公开(公告)日：2001-12-15

申请号：AT97304018

申请日：1997-06-10

Applicant: IBM

Inventor： REDDY SRINIVASA S N ,  KNICKERBOCKER JOHN ULRICH ,  WALL DONALD RENE

IPC: C23C16/08 ,  C23C16/44 ,  H01L21/28 ,  H01L21/285 ,  H05K3/24

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces (32, 34) which are capable of receiving nickel or alloys thereof, using an Iodide source (23), preferably an Iodide salt, such as, Copper Iodide.

公开(公告)号：DE69937170D1

公开(公告)日：2007-11-08

申请号：DE69937170

申请日：1999-07-01

Applicant: IBM

Inventor： BEETESON JOHN STUART ,  KNICKERBOCKER JOHN ULRICH ,  KNOX ANDREW RAMSAY ,  LOWE ANTHONY CYRIL

IPC: H01J1/46 ,  H01J29/46 ,  H01J3/02 ,  H01J29/02 ,  H01J29/68 ,  H01J31/12

Abstract: An electron source comprises a cathode means, and an extractor grid used to extract electrons from the cathode. The extractor grid is formed by etching a plurality of apertures in the material. A plurality of spacing members for spacing the extractor grid at a constant, predetermined spacing from the cathode are used. Each of the spacing members is formed by etching around a substantial portion of the periphery of the aperture and folding a remaining portion of the periphery of the aperture at substantially a right angle to the planar material.

公开(公告)号：DE69300907D1

公开(公告)日：1996-01-11

申请号：DE69300907

申请日：1993-08-24

Applicant: IBM

Inventor： KNICKERBOCKER JOHN ULRICH ,  PERRY CHARLES HAMPTON ,  WALL DONALD RENE

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: Disclosed is a multilayer ceramic substrate (30) for electronic applications including: (a) at least one internal layer (32) having vias (34) filled with a metallic material; (b) at least one sealing layer (40) having vias (42) filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer (46) located between the internal and sealing layers having vias (48) filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. Also disclosed is a method of forming the multilayer ceramic substrate.

公开(公告)号：DE3787993D1

公开(公告)日：1993-12-09

申请号：DE3787993

申请日：1987-04-22

Applicant: IBM

Inventor： FLAITZ PHILIP LEE ,  FLANAGAN ARLYNE MARIE ,  HARVILCHUCK JOSEPH MATTHEW ,  HERRON LESTER WYNN ,  KNICKERBOCKER JOHN ULRICH ,  NUFER ROBERT WOLFF ,  PERRY CHARLES HAMPTON ,  REDDY SRINIVASA N

IPC: C04B35/638 ,  C04B35/64 ,  H01L21/48

公开(公告)号：MY117336A

公开(公告)日：2004-06-30

申请号：MYPI20012928

申请日：2001-06-21

Applicant: IBM

Inventor： BERGER DANIEL GEORGE ,  FAROOQ SHAJI ,  HERRON LESTER WYNN ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN ULRICH ,  PASCO ROBERT WILLIAM ,  PERRY CHARLES H ,  SACHDEV KRISHNA G

IPC: B32B5/16 ,  B32B18/00 ,  G02B6/12 ,  G02B6/00 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46

Abstract: A COMPOSITE ELECTRONIC AND/OR OPTICAL SUBSTRATE INCLUDING POLYMERIC AND CERAMIC MATERIAL WHEREIN THE COMPOSITE SUBSTRATE HAS A DIELECTRIC CONSTANT LESS THAN 4 AND A COEFFICIENT OF THERMAL EXPANSION OF 8 TO 14 PPM/°C AT 100°C. THE COMPOSITE SUBSTRATE MAY BE EITHER CERAMIC-FILLED POLYMERIC MATERIAL OR POLYMER-FILLED CERAMIC MATERIAL. (FIGURE 1)