Chemical amplification resist suitable for electron beam lithography and chemical amplification resist system
    11.
    发明专利
    Chemical amplification resist suitable for electron beam lithography and chemical amplification resist system 有权
    化学放大电阻适用于电子束光刻和化学放大电阻系统

    公开(公告)号:JPH11282166A

    公开(公告)日:1999-10-15

    申请号:JP1270699

    申请日:1999-01-21

    Abstract: PROBLEM TO BE SOLVED: To provide a chemical amplification resist exhibiting improved preservability of a resist coating and almost or completely free from the effect of vacuum in use by incorporating an aq. base-soluble polymer or copolymer having polar functional groups, a part of which is protected with specified cycloaliphatic ketal substituents.
    SOLUTION: The chemical amplification resist contains an aq. base-soluble polymer or copolymer having polar functional groups, some of which are protected with cycloaliphatic ketal substituents represented by the formula RO-X-as acid decomposable protective groups, an acid generating agent, a solvent for the base-soluble polymer or copolymer, a base and, optionally, a surfactant. In the formula, X is an about 3-12C optionally substd. cycloaliphatic functional group and R is about 1-12C linear or branched alkyl or the like.
    COPYRIGHT: (C)1999,JPO

    Abstract translation: 要解决的问题:提供具有改进的抗蚀剂涂层保存性的化学放大抗蚀剂,几乎或完全没有真空在使用中的作用, 具有极性官能团的碱溶性聚合物或共聚物,其一部分用特定的脂环族缩酮取代基保护。 解决方案:化学增幅抗蚀剂含有水溶液。 具有极性官能团的碱溶性聚合物或共聚物,其中一些由式RO-X代表的脂环族缩酮取代基保护,作为酸可分解的保护基团,酸产生剂,用于碱溶性聚合物或共聚物的溶剂, 碱和任选的表面活性剂。 在该式中,X是约3-12C任选取代的。 脂环族官能团,R为约1-12个直链或支链烷基等。

    20.
    发明专利
    未知

    公开(公告)号:FR2299665A1

    公开(公告)日:1976-08-27

    申请号:FR7538564

    申请日:1975-12-09

    Applicant: IBM

    Abstract: 1515330 Electron sensitive polymers INTERNATIONAL BUSINESS MACHINES CORP 5 Dec 1975 [29 Jan 1975] 49960/75 Heading G2C Positive resist masks are formed by exposing a supported film of a non-crosslinked polymeric material to electron beam radiation in a predetermined pattern so as to degrade the polymeric material in the exposed areas, and removing the degraded products in the exposed areas. The polymeric material used is selected from (1) polyalkyl methacrylates and copolymers of alkyl methacrylates with halogen - or cyano - containing monomers and (2) post halogenated derivatives of the polymers in (1). The coated polymers may be baked prior to exposure and also after development.

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