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    12.
    发明专利
    未知

    公开(公告)号：DE10229542A1

    公开(公告)日：2004-01-29

    申请号：DE10229542

    申请日：2002-07-01

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WENNEMUTH INGO ,  THOMAS JOCHEN

    IPC: H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/552 ,  H05K9/00 ,  G11C5/00

    Abstract: The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.

    16.
    发明专利
    未知

    公开(公告)号：DE102004003275B4

    公开(公告)日：2007-04-19

    申请号：DE102004003275

    申请日：2004-01-21

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： LEGEN ANTON ,  THOMAS JOCHEN ,  WENNEMUTH INGO

    IPC: H01L23/50 ,  H01L21/44 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/495 ,  H01L25/065 ,  H01R12/50

    Abstract: A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.

    17.
    发明专利
    未知

    公开(公告)号：DE10259221B4

    公开(公告)日：2007-01-25

    申请号：DE10259221

    申请日：2002-12-17

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： THOMAS JOCHEN ,  HETZEL WOLFGANG ,  LEGEN ANTON

    IPC: H01L23/50 ,  H01L21/50 ,  H01L23/31 ,  H01L25/065

    Abstract: An electronic component comprises a semiconductor chip stack (3,4) on a wiring substrate (11) having external contacts (12). Between the chips is a wiring layer (7) having a through opening (8) and contact regions (9,10). Connections are made through the opening and there is a plastic housing (18,19) for the component. An Independent claim is also included for a production process for the above.

    19.
    发明专利
    未知

    公开(公告)号：DE102005010156A1

    公开(公告)日：2005-10-06

    申请号：DE102005010156

    申请日：2005-03-02

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： GRAFE JUERGEN ,  HEDLER HARRY ,  POHL JENS ,  THOMAS JOCHEN ,  WEITZ PETER

    IPC: G11C5/14 ,  H01L23/48 ,  H01L23/50 ,  H01L25/065

    Abstract: An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.

    20.
    发明专利
    未知

    公开(公告)号：DE10350239A1

    公开(公告)日：2005-06-16

    申请号：DE10350239

    申请日：2003-10-27

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： THOMAS JOCHEN ,  HETZEL WOLFGANG

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/28 ,  H01L23/50 ,  H01L23/16

    Abstract: A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arranged on a leadframe. Arranged between the leadframe and the plastic package molding compound with the semiconductor chip is an elastic adhesive layer for the mechanical decoupling of an upper region from a lower region of the semiconductor device.

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