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    INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
    12.
    发明申请
    INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20190333886A1

    公开(公告)日：2019-10-31

    申请号：US16505307

    申请日：2019-07-08

    Applicant: Intel IP Corporation

    Inventor： Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Thomas Wagner ,  Bernd Waidhas

    IPC: H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L25/11

    Abstract: A microelectronic package with two semiconductor die coupled on opposite sides of a redistribution layer 108, and at least partially overlapping with one another. At least a first of the semiconductor die includes two sets of contacts, the first group of contacts arranged at a lesser pitch relative to one another than are a second group of contacts. The first group of contacts at the larger pitch are placed to engage contacts in a redistribution layer 108. The second group of contacts at the lesser pitch are placed to engage respective contacts at the same pitch on the second semiconductor die.

    Low thermal resistance hanging die package
    13.
    发明授权
    Low thermal resistance hanging die package 有权

    公开(公告)号：US10347558B2

    公开(公告)日：2019-07-09

    申请号：US15748475

    申请日：2015-08-31

    Applicant: INTEL IP CORPORATION

    Inventor： Christian Geissler ,  Georg Seidemann ,  Sonja Koller ,  Jan Proschwitz

    IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/04 ,  H01L25/07 ,  H01L23/13 ,  H01L23/36 ,  H01L23/42 ,  H01L21/56 ,  H01L23/498

    Abstract: Embodiments herein generally relate to the field of package assembly to facilitate thermal conductivity. A package may have a hanging die, and attach to a printed circuit board (PCB). The package may have an active side plane and an inactive side plane opposite the first active side plane. The package may also have a ball grid array (BGA) matrix having a height determined by a distance of a furthest point of the BGA matrix from the active side plane of the package. The package may have a hanging die attached to the active side plane of the package, the hanging die having a z-height greater than the BGA matrix height. When package is attached to the PCB, the hanging die may fit into an area on the PCB that is recessed or has been cut away, and a thermal conductive material may connect the hanging die and the PCB.

    Thermal contacts at periphery of integrated circuit packages
    20.
    发明授权
    Thermal contacts at periphery of integrated circuit packages 有权

    公开(公告)号：US12249553B2

    公开(公告)日：2025-03-11

    申请号：US16015334

    申请日：2018-06-22

    Applicant: Intel IP Corporation

    Inventor： Sonja Koller ,  Vishnu Prasad ,  Georg Seidemann

    IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31

    Abstract: Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a periphery of the IC package. In some embodiments, thermal contacts are such that at least a portion of a heat exchanger is to be attached on the side of the IC package. In some embodiments, thermal contacts may be provided within a recessed portion at the periphery of the IC package. Providing a thermal contact at a periphery of an IC package may enable improved cooling options, especially for systems where there is no or limited space for providing conventional heat exchangers on the top of the package.

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