公开(公告)号：IL161684A

公开(公告)日：2012-07-31

申请号：IL16168404

申请日：2004-04-29

Applicant: LAM RES CORP ,  LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

Inventor： LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

公开(公告)号：DE60314508D1

公开(公告)日：2007-08-02

申请号：DE60314508

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

公开(公告)号：PL373857A1

公开(公告)日：2005-09-19

申请号：PL37385703

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： WOODE CARL ,  GARCIA JAMES P ,  DE LARIOS JOHN ,  RAVKIN MIKE ,  REDEKER FRED C ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.

公开(公告)号：AU2003277052A1

公开(公告)日：2004-04-23

申请号：AU2003277052

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  LARIOS JOHN M DE ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

公开(公告)号：AT556431T

公开(公告)日：2012-05-15

申请号：AT07007143

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/67 ,  C25D5/22 ,  C25D7/12 ,  H01L21/00

Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

公开(公告)号：PL208012B1

公开(公告)日：2011-03-31

申请号：PL37450203

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

公开(公告)号：DE60329978D1

公开(公告)日：2009-12-24

申请号：DE60329978

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： WOODS CARL ,  GARCIA JAMES P ,  DE LARIOS JOHN ,  RAVKIN MIKE ,  REDEKER FRED C ,  NICKHOU AFSHIN

IPC: H01L21/00 ,  C25D5/22 ,  C25D7/12

Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

公开(公告)号：MY137975A

公开(公告)日：2009-04-30

申请号：MYPI20051477

申请日：2005-04-01

Applicant: LAM RES CORP

Inventor： WOODS CARL ,  SMITH MICHAEL G R ,  PARKS JOHN ,  GARCIA JAMES P ,  LARIOS JOHN M DE

IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

Abstract: AN APPARATUS FOR PROCESSING A SUBSTRATE (108) IS PROVIDED WHICH INCLUDES A FIRST MANIFOLD MODULE (106) TO GENERATE A FLUID MENISCUS (140) ON A SUBSTRATE SURFACE. THE APPARATUS ALSO INCLUDES A SECOND MANIFOLD MODULE (102) TO CONNECT WITH THE FIRST MANIFOLD MODULE (106) AND ALSO TO MOVE THE FIRST MANIFOLD MODULE (106) INTO CLOSE PROXIMITY TO THE SUBSTRATE SURFACE TO GENERATE THE FLUID MENISCUS (140).

公开(公告)号：SG121162A1

公开(公告)日：2006-04-26

申请号：SG200506095

申请日：2005-09-21

Applicant: LAM RES CORP

Inventor： GARCIA JAMES P

Abstract: A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.

公开(公告)号：SG118394A1

公开(公告)日：2006-01-27

申请号：SG200503936

申请日：2005-06-20

Applicant: LAM RES CORP

Inventor： GARCIA JAMES P ,  FRITZ REDEKER

IPC: B08B3/00 ,  B08B3/04 ,  H01L21/00

Abstract: Provided is a system and method to prevent the transfer of accumulated fluid to wafers during cleaning operations. Specifically, when a wafer is secured by a plurality of self-draining edge wheels, any fluid contacting the self-draining edge wheels is channeled away from the wafer towards a bottom surface of each of the self-draining edge wheels. The channeling occurs by manufacturing the bottom portions of the self-draining edge wheels to have different configurations. The different configurations enhance fluid channeling away from the wafer. To further prevent fluid from wetting a bottom surface of the self-draining edge wheels, an edge wheel dryer can be positioned proximately adjacent to at least one self-draining edge wheel to suction fluid away from the bottom surface by using a vacuum channel of the edge wheel dryer.