公开(公告)号：DE50306197D1

公开(公告)日：2007-02-15

申请号：DE50306197

申请日：2003-06-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SORG JOERG ,  BOGNER GEORG ,  WAITL GUENTER ,  BRUNNER REINHOLD

IPC: H01L23/495 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H05K1/02 ,  H05K3/34

公开(公告)号：AT340966T

公开(公告)日：2006-10-15

申请号：AT00101386

申请日：2000-01-24

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BACHL BERNHARD ,  WAITL GUENTER

IPC: H05K7/12 ,  F21S8/10 ,  F21V5/00 ,  F21V19/00 ,  F21V29/00 ,  F21Y115/10 ,  H01L25/13 ,  H05K1/02 ,  H05K1/18 ,  F21W101/14 ,  F21Y101/02

公开(公告)号：DE10335078A1

公开(公告)日：2005-03-03

申请号：DE10335078

申请日：2003-07-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  SORG JOERG ERICH

IPC: H01L21/56 ,  H01L23/495 ,  H01L23/50

Abstract: A process for the form-shaping covering of a lead frame (1) with a housing in a tool comprises using a sealing material (6) in the region of a separation plane (13). Preferably the sealant is a ductile material. An independent claim is also included for a component comprising a lead frame as above.

公开(公告)号：DE10234978A1

公开(公告)日：2004-02-12

申请号：DE10234978

申请日：2002-07-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  BOGNER GEORG ,  SORG JOERG

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62 ,  H01L23/495 ,  H01L23/28 ,  H01L33/00 ,  H01L21/60 ,  H01G2/06

Abstract: Surface-mounted semiconductor component comprises a semiconductor chip (1), external electrical connections (3, 4) electrically connected with the electrical contacts of the chip, and a chip casing (5). The electrical connections are formed on a foil (2) having a thickness of not more than 100 mum. The chip is fixed to a first main surface (22) of the foil. The chip casing is applied to the first main surface. An Independent claim is also included for a process for simultaneously producing a number of surface-mounted semiconductor components.

公开(公告)号：DE10153259A1

公开(公告)日：2003-05-22

申请号：DE10153259

申请日：2001-10-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/00

Abstract: Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

公开(公告)号：DE19945133A1

公开(公告)日：2001-04-12

申请号：DE19945133

申请日：1999-09-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  BRUNNER HERBERT ,  WAGENSONNER HEINZ

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/102

Abstract: Surface mounting housing (20) comprises: a plastic support (22) containing a recess and having a base surface for fixing a detector component (1) and reflecting side walls (23); a light-impermeable plastic casing (24) surrounding plastic support; two metallic contacts (25) provided with contact surfaces (25A); and bonding wires (26) leading from a detector-side end of contacts to detector element. Surface mounting housing (20) comprises: a plastic support (22) containing a recess in a light inlet side opposite the mounting side and having a base surface for fixing a detector component (1) and reflecting side walls (23); a first light-impermeable plastic casing (24) which laterally surrounds the plastic support; two metallic contacts (25) running up to the mounting side and provided with contact surfaces (25A); and bonding wires (26) leading from a detector-side end of the contacts to the detector element. Preferred Features: A second plastic casing (27) is connected to the first casing and holds a filter plate (28) made of semiconductor material, especially silicon, gallium arsenide or indium phosphide.

公开(公告)号：DE19922176A1

公开(公告)日：2000-11-23

申请号：DE19922176

申请日：1999-05-12

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  WAITL GUENTER ,  BOGNER GEORG

IPC: F21V19/00 ,  F21S8/00 ,  F21S8/04 ,  F21S8/10 ,  F21V29/00 ,  F21V29/74 ,  F21V31/03 ,  F21W101/12 ,  F21W101/14 ,  F21Y115/10 ,  G09F13/22 ,  G09F21/04 ,  H01L33/64 ,  H05K3/00 ,  H01L25/13

Abstract: The invention relates to a light-emitting diode array that is surface-mounted on a board (1), such as a flexible board. The light-emitting diode array is mounted on a heat sink (3), so that the heat can be dissipated in an optimal manner. Said heat sink can take any form desired so that it is possible to design motor vehicle lamps, such as indicator lamps or similar, that can be adapted to the outer contour of the vehicle. In the case of a rotating lamp, the board (1) can be mounted around a heat sink that is configured as a cylindrical hollow body and can be operated rotationally.

公开(公告)号：DE50016032D1

公开(公告)日：2010-12-30

申请号：DE50016032

申请日：2000-07-24

Applicant: OSRAM GMBH ,  OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DEBRAY ALEXANDRA ,  WAITL GUENTER ,  ELLENS ANDRIES ,  ZWASCHKA FRANZ ,  KUMMER FRANZ

IPC: C09K11/78 ,  H05B33/14 ,  C09K11/08 ,  C09K11/62 ,  C09K11/77 ,  C09K11/80 ,  H01L33/00 ,  H01L33/50

公开(公告)号：DE10335078B4

公开(公告)日：2008-04-03

申请号：DE10335078

申请日：2003-07-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  SORG JOERG ERICH

IPC: H01L21/56 ,  H01L23/495 ,  H01L23/50

公开(公告)号：DE10303455B4

公开(公告)日：2007-11-29

申请号：DE10303455

申请日：2003-01-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  JAEGER HARALD

IPC: H01L23/495 ,  H01L33/62