公开(公告)号：WO1997040958A1

公开(公告)日：1997-11-06

申请号：PCT/US1997007229

申请日：1997-05-01

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  SMITH, John, W.

IPC: B23K31/02

CPC classification number: H01L24/10 ,  H01L21/563 ,  H01L23/055 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A microelectronic assembly including elements such as a semiconductor chip (28) and substrate (60) has electrical connections between the elements incorporating fusible conductive metal masses (42). The fusible masses are surrounded and contained by a compliant material (54) such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

Abstract translation: 包括诸如半导体芯片（28）和衬底（60）的元件的微电子组件在包含易熔导电金属块（42）的元件之间具有电连接。 易熔物质被柔性材料（54）如弹性体或凝胶包围并容纳。 在装置的操作或加工期间，易熔材料可能会熔化，以减轻电连接中的热循环应力。

公开(公告)号：WO1997033312A1

公开(公告)日：1997-09-12

申请号：PCT/US1997003273

申请日：1997-03-04

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W. ,  FJELSTAD, Joseph ,  MITCHELL, Craig, S. ,  KARAVAKIS, Konstantine

IPC: H01L21/56

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2224/86 ,  H01L2924/00

Abstract: A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly (10) having a spacer (20) layer between a top surface of a sheet-like substrate (16) and a contact bearing surface of a semiconductor chip (12), wherein the substrate (16) has conductive leads (22) thereon, the leads (22) being electrically connected to terminals (26) on a first end and bonded to respective chip contacts (24) on a second end. Typically, the spacer layer (20) is comprised of a compliant or elastomeric material (40). A protective layer (30) is attached on a bottom surface of the substrate (16) so as to cover the terminals (26) on the substrate. A flowable, curable encapsulant material (40) is deposited around a periphery of the semiconductor chip (12) after the attachment of the protective layer (30) so as to encapsulate the leads (22). The encapsulant material (40) is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

Abstract translation: 一种封装半导体器件的方法。 封装方法包括在片状基片（16）的顶表面和半导体芯片（12）的接触支承表面之间具有间隔层（20）的半导体芯片封装组件（10），其中衬底（16） ）在其上具有导电引线（22），引线（22）在第一端上电连接到端子（26）并且在第二端上结合到相应的芯片触点（24）。 通常，间隔层（20）由顺应性或弹性体材料（40）组成。 保护层（30）安装在基板（16）的底表面上，以覆盖基板上的端子（26）。 在保护层（30）的附着之后，围绕半导体芯片（12）的周边沉积可流动的可固化的密封剂材料（40）以封装引线（22）。 密封剂材料（40）然后固化。 通常，这种封装方法同时在多个芯片组件上执行。

公开(公告)号：WO1997011486A1

公开(公告)日：1997-03-27

申请号：PCT/US1996015170

申请日：1996-09-23

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  FARACI, Tony ,  DISTEFANO, Thomas, H. ,  SMITH, John, W.

IPC: H01L21/44

CPC classification number: H01L24/86 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

Abstract: A plurality of separate semiconductor chips (58), each having a contact-bearing surface (59) and contacts (64) on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet (30) with terminals (34) thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads (40) are disposed between the dielectric element and the semiconductor chips. Each lead has a first end (42) connected to a terminal on the dielectric element, and a second end (44) connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

Abstract translation: 在阵列中设置多个单独的半导体芯片（58），每个单独的半导体芯片（58）具有接触表面（59）和触点（64），使得接触表面面对并限定阵列的第一表面 。 具有端子（34）的柔性介电片（30）覆盖在半导体芯片的第一或接触支承表面上。 细长引线（40）设置在电介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端（42）和连接到阵列中的半导体芯片上的触点的第二端（44）。 所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。 介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。

公开(公告)号：WO1993013637A1

公开(公告)日：1993-07-08

申请号：PCT/US1992011395

申请日：1992-12-30

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  KHANDROS, Igor ,  GRUBE, Gary, W. ,  EHRENBERG, Scott, G.

IPC: H05K01/00

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

Abstract translation: 多层电路板组件通过层叠具有在互连位置处包含可流动导电材料（48）的插入件（12）的电路板（10）和在其它位置处的可流动电介质材料（30,38）形成。 多余的材料被捕获在电路板中的储存器（20）中。 可流动的材料和储存器允许内插器压缩并占据部件中的公差。 堆叠的板可以在其顶表面上具有通过在顶部和底部之间延伸的导体（527）和连接到每个贯通导体的底端的端子（530）之间的触点（538）。 端子和触头在每个接口处彼此非选择性地连接，使得当端子和邻近的面板彼此对准时，它们彼此连接。 这形成延伸穿过多个面板的复合垂直导体。 面板顶部和底部表面的选择性处理在垂直导体中提供选择性的中断。

公开(公告)号：WO1998028955A3

公开(公告)日：1998-07-02

申请号：PCT/US1997023949

申请日：1997-12-12

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  SMITH, John, W. ,  FJELSTAD, Joseph

IPC: H01R09/09

公开(公告)号：WO1997011588A1

公开(公告)日：1997-03-27

申请号：PCT/US1996014965

申请日：1996-09-18

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  FJELSTAD, Joseph ,  SMITH, John, W.

IPC: H05K01/02

CPC classification number: H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011

Abstract: A microelectronic connection component (62) has flexible leads (36) formed by polymeric strips (46, 50) with metallic conductors thereon. The metallic conductors (46, 50) may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip (46 or 50) may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip (62) or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.

Abstract translation: 微电子连接部件（62）具有由其上具有金属导体的聚合物条（46,50）形成的柔性引线（36）。 金属导体（46,50）可以是非常薄的，期望地小于5微米厚，并且提供良好的抗疲劳性。 每个条（46或50）可以在其上具有两个导体，一个用作主体或信号导体，用于连接到芯片（62）或其他微电子元件上的触点，另一个用作电位参考或接地导体。 引线上的电位参考导体提供增强的串扰电阻。

公开(公告)号：WO1996016532A1

公开(公告)日：1996-05-30

申请号：PCT/US1995014992

申请日：1995-11-16

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W.

IPC: H05K07/20

CPC classification number: H05K7/20445 ,  H01L23/3672 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T29/4935

Abstract: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors (94, 96). The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

Abstract translation: 用于将热量从诸如半导体芯片的微电子部件传导到散热器的热连接器。 连接器包括大量柔性热导体（94,96）。 连接器可以通过以下工艺制造，该方法包括将导体制成扁平条，将导体粘合到一对相对的平面片上，并使片彼此垂直移动，使导体垂直于其最终三维构型 。

公开(公告)号：WO1996009745A1

公开(公告)日：1996-03-28

申请号：PCT/US1995011899

申请日：1995-09-19

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  KOVAC, Zlata ,  GRANGE, John

IPC: H05K01/00

CPC classification number: H01L21/67144 ,  H01L24/86 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method of connecting a semiconductor chip assembly (12) having at least first and second contacts (18) to a connection component (20) including at least first and second connection leads (30) by means of a tool (60) consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component (20) is juxtaposed with the semiconductor chip assembly (12) so that the first and second connection leads (30) are aligned with the first and second contacts (18) in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool (60) substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space (A1) is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool (60) substantially downwardly and towards the second contact in the second direction.

Abstract translation: 一种将具有至少第一和第二触点（18）的半导体芯片组件（12）连接到包括至少第一和第二连接引线（30）的连接部件（20）的方法，所述工具（60）包括： 将引线并排连接到相应的触点的步骤。 连接部件（20）与半导体芯片组件（12）并置，使得第一和第二连接引线（30）与第一和第二触点（18）对准，使得第一连接引线偏离 第一方向上的第一接触和第二连接引线在相同的第一方向上偏离第二接触。 第一连接引线通过工具（60）基本上向下并且沿与第一方向相反的第二方向朝向第一接触件移动，使得在第一连接引线和第二连接引线之间形成开放空间（A1） 并且导致便于工具（60）沿着第二方向大致向下并朝着第二接触件移动第二连接引线。

公开(公告)号：WO1996002959A1

公开(公告)日：1996-02-01

申请号：PCT/US1995009201

申请日：1995-07-19

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W. ,  KARAVAKIS, Konstantine ,  KOVAK, Zlata ,  FJELSTAD, Joseph

IPC: H01R09/09

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

Abstract translation: 用于微电子电路板（260）之间的互连的插入器在其表面具有触点（250）。 每个触点具有垂直于表面的中心轴线，以及适于根据由接合电路板上的焊盘（262）施加的力从中心轴线径向向外扩张的外围部分。 因此，当电路板（260）用插入件压缩时，触头径向膨胀并擦拭穿过焊盘（262）。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身承载的导电接合材料（246）。

公开(公告)号：WO1995034106A1

公开(公告)日：1995-12-14

申请号：PCT/US1995007901

申请日：1995-06-07

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  FJELSTAD, Joseph ,  SMITH, John, W. ,  DISTEFANO, Thomas, H. ,  WALTON, A., Christian ,  ZACCARDI, James

IPC: H01R09/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A connector for microelectronic elements includes a sheet-like body (30) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有多个孔（36）的片状体（30），其期望地布置成规则的格子图案。 每个孔设置有弹性层状接触件（38），其具有向内延伸到主体孔上的多个突出部（42）。 具有诸如其上的焊球的凸起引线（70）的微电子元件（68）可以通过使凸块引线进入连接器的孔而与连接器接合，以使触点与触点接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。