公开(公告)号：WO2006020488A1

公开(公告)日：2006-02-23

申请号：PCT/US2005/027748

申请日：2005-08-02

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  BEROZ, Masud ,  TUCKERMAN, David B. ,  HUMPSTON, Giles ,  CRISP, Richard D.

Inventor： HABA, Belgacem ,  BEROZ, Masud ,  TUCKERMAN, David B. ,  HUMPSTON, Giles ,  CRISP, Richard D.

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate (10) is included having opposing surfaces and a plurality of holes (12A-D) extending through the surfaces. Also included is a plurality of electrically conductive posts (18A-D). Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate (20) may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts (28A-D) may be provided having tips in corresponding holes (22A-D) of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract translation: 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板（10）和延伸穿过表面的多个孔（12A-D）。 还包括多个导电柱（18A-D）。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以设置另外的基板（20），使得每个柱的基部位于其表面上。 可以在附加基板的相应孔（22A-D）中提供附加的导电柱（28A-D）。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：WO2005107342A1

公开(公告)日：2005-11-10

申请号：PCT/EP2005/050919

申请日：2005-03-02

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  BUSCH, Georg

Inventor： BUSCH, Georg

IPC: H05K1/00

CPC classification number: H05K3/4626 ,  H05K1/095 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0759 ,  H05K2203/162 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Es wird ein vereinfachtes, kostengünstiges Verfahren zur Her- stellung von Leiterplatten und/oder entsprechenden Konstruk- ten vorgeschlagen, welche Stellen aufweisen, an denen Durch- kontaktierungen realisiert sind. Ein solches Verfahren ver- zichtet auf einen sehr aufwendigen Bürstvorgang und verwendet ausschliesslich kostengünstige Lackvarianten. Trotzdem wird zusätzlich erreicht, dass weitere Leiterbahnen oder entspre- chende Schichten nicht nur bis zu den Durchkontaktierungen sondern ohne weiteres sogar direkt darüber hinweg geführt werden können.

Abstract translation: 它是一种用于制造电路板的位置和/或相应的拟议建设性个，其具有在其中可以通过被实现接触部位的简化的，廉价的方法。 这样的方法可比分配到一个非常复杂的刷牙和仅使用廉价的涂层的变体。 然而，额外地确保了其它导体或相应的层甚至可以做到不仅对通孔，但容易直接在它。

公开(公告)号：WO2005086550A1

公开(公告)日：2005-09-15

申请号：PCT/KR2004/000890

申请日：2004-04-19

Applicant: YOUNGEUN, ELECTRONICS CO., LTD ,  BAE, Young-Ha

Inventor： BAE, Young-Ha

IPC: H05K3/00

CPC classification number: H05K1/0265 ,  H05K3/0061 ,  H05K3/041 ,  H05K3/064 ,  H05K3/202 ,  H05K3/383 ,  H05K3/385 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/09881

Abstract: The present invention relates to a method for fabricating a printed circuit board which includes circuits of different thicknesses on the same surface. In the prior art, several PCBs were used for a power section and a signal section since there was no technology capable of fabricating a printed circuit board (PCB) which includes circuits of different thicknesses on the same layer. On the other hand, the present invention allows the power and signal sections to be integrally fabricated on one PCB such that electronic products can be smaller in size and lighter in weight and easily assembled. Also, according to the present invention, the power section and the signal section are integrated on one printed circuit board, such that a process is simplified and material consumption is reduced, and thus, production cost can be reduced and the time necessary for production can be shortened. Furthermore, according to the present invention, after the signal section is fabricated on the board, the power section is fabricated by a hot press forming process, so that the fabrication of the printed circuit board is achieved in a convenient and simple manner.

Abstract translation: 本发明涉及一种印刷电路板的制造方法，该方法包括在相同表面上具有不同厚度的电路。 在现有技术中，由于没有能够制造包括同一层上不同厚度的电路的印刷电路板（PCB）的技术，所以使用了多个PCB用于功率部分和信号部分。 另一方面，本发明允许电力和信号部分整体制造在一个PCB上，使得电子产品的尺寸更小，重量更轻并且容易组装。 此外，根据本发明，功率部分和信号部分集成在一个印刷电路板上，从而简化了工艺并降低了材料消耗，从而可以降低生产成本，并且生产所需的时间可以 缩短。 此外，根据本发明，在板上制造信号部分之后，通过热压成型工艺制造功率部分，从而以方便和简单的方式实现印刷电路板的制造。

公开(公告)号：WO2005069320A1

公开(公告)日：2005-07-28

申请号：PCT/JP2004/019002

申请日：2004-12-20

Applicant: 株式会社 村田製作所 ,  野村 雅信

Inventor： 野村 雅信

IPC: H01G4/33

CPC classification number: H01L27/016 ,  H01G4/33 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09881 ,  H05K2203/016 ,  H05K2203/0733

Abstract: 　本発明の薄膜キャパシタは、表面が平滑状に形成された第１の対向電極８ａと、該第１の対向電極８ａと電気的に絶縁された第１の引出電極８ｂとを備えた第１の電極層と、第１の対向電極８ａ上に形成された上面及び下面が平滑状の誘電体膜１０と、誘電体膜１０の少なくとも一部を覆うように第１の対向電極８ａと対向状に形成されると共に第１の引出電極８ｂと電気的に接続された第２の対向電極１１ａと、第２の対向電極１１ａと電気的に絶縁されると共に第１の対向電極８ａと電気的に接続された第２の引出電極１１ｂとを備えた第２の電極層とを有し、第１の電極層の下面にはレジスト膜４及び犠牲層５を介して支持基板３が離脱可能に接合されている。これにより、低コストでより小型化され、しかも品質が改善されて製品歩留まりの向上を図ることができる薄膜キャパシタを得ることができる。

Abstract translation: 薄膜电容器包括：具有形成为平滑状态的表面的第一相对电极（8a）和与第一相对电极（8a）电绝缘的第一引出电极（8b）的第一电极层; 具有平坦且光滑的上表面的电介质膜（10）和形成在第一相对电极（8a）上的下表面; 以及第二电极层，具有与第一相对电极（8a）相对形成的第二对置电极（11a），以覆盖电介质膜（10）的至少一部分并电连接到第一引出电极（ 8b）和与第二相对电极（11a）电绝缘并与第一相对电极（8a）电连接的第二引出电极（11b）。 支撑基板（3）通过抗蚀膜（4）和牺牲层（5）可拆卸地附接到第一电极的下表面。 因此，可以获得能够降低尺寸和成本以及提高质量和生产率的薄膜电容器。

公开(公告)号：WO2002091810A2

公开(公告)日：2002-11-14

申请号：PCT/EP2002/004382

申请日：2002-04-22

Applicant: THOMSON LICENSING S.A. ,  HIRT, Hermann ,  HEINI, Hubert ,  WAGNER, Paul-Heinz

Inventor： HIRT, Hermann ,  HEINI, Hubert ,  WAGNER, Paul-Heinz

IPC: H05K3/28

CPC classification number: H05K3/28 ,  H05K1/0263 ,  H05K2201/0195 ,  H05K2201/09881

Abstract: The object is to provide a printed circuit board which is also suitable for relatively high currents and is more resistant to environmental influences such as moisture and mechanical loads. The thickness of the conductor tracks (2) is made appreciably greater than 100 μm, and the intermediate spaces between the conductor tracks (2) are filled with a filling material (3) which has greatest possible adhesion to the conductor tracks (2), to the base plate (1) and to the solder resist mask (4) applied to the arrangement, being filled in such a way that the printed circuit board has a substantially planar surface without interruptions or depressions.

Abstract translation: 本发明的目的是提供一种印刷电路板，其也适用于相对高的电流，并且更耐环境影响，例如水分和机械负载。 导体轨道（2）的厚度明显大于100μm，并且导体轨道（2）之间的中间空间填充有对导体轨道（2）具有最大可能附着力的填充材料（3） 到基板（1）和施加到该装置的阻焊掩模（4），被填充成使得印刷电路板具有基本平坦的表面而没有中断或凹陷。

公开(公告)号：WO02007485A1

公开(公告)日：2002-01-24

申请号：PCT/JP2001/006197

申请日：2001-07-17

IPC: H05K7/20 ,  H01L23/12 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/04 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38 ,  H05K3/22

CPC classification number: H05K1/056 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/202 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/09881 ,  Y10S428/901 ,  Y10T428/12514 ,  Y10T428/12556 ,  Y10T428/24917 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A circuit board comprising a composite resin (1) and a metal plate (3) having a circuit pattern. A copper or copper alloy plate exhibiting excellent thermal conductivity is preferably employed as the metal plate. The composite resin is made of 70-95 parts by weight of inorganic filler and 5-30 parts by weight of resin composition containing a thermosetting resin and a setting agent. At least one side, joined with the composite resin, of the metal plate is subjected to surface roughening and adhesion enhancement. In the circuit board, the composite resin enters the gap between the circuit patterns, and the composite resin composition and the metal plate form a plane on the side of the metal plate where a component is mounted. Since the resin composition containing the inorganic filler is also present between the circuit patterns formed of the metal plate, the heat dissipation characteristic of the circuit board is enhanced significantly, and a circuit board suitable for an electronic apparatus containing a heat generating component, e.g. a power circuit, is produced.

Abstract translation: 一种电路板，包括复合树脂（1）和具有电路图案的金属板（3）。 优选使用显示优异导热性的铜或铜合金板作为金属板。 复合树脂由70-95重量份无机填料和5-30重量份含有热固性树脂和固化剂的树脂组合物制成。 与金属板的复合树脂连接的至少一面经受表面粗糙化和附着增强。 在电路板中，复合树脂进入电路图案之间的间隙，并且复合树脂组合物和金属板在安装有部件的金属板的侧面上形成一个平面。 由于包含无机填料的树脂组合物也存在于由金属板形成的电路图案之间，所以电路板的散热特性显着增强，并且适用于包含发热组件的电子设备的电路板，例如， 电源电路。

公开(公告)号：WO01006818A1

公开(公告)日：2001-01-25

申请号：PCT/GB2000/002679

申请日：2000-07-13

IPC: H01L23/12 ,  H01F17/00 ,  H01F41/04 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01F41/041 ,  H01F17/0033 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/086 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated into electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material (20). The dielectric (20) is photoimaged and etched to provide one or more recesses or openings (26) for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric (20) is described as well as the method of manufacturing the same.

Abstract translation: 使用诸如电容器，电阻器，电感器，变压器，滤波器和谐振器的无源电气部件集成到电路中，利用最大化基板的平面表面的利用率的过程，用于高密度放置诸如逻辑或存储器集成电路的有源部件。 无源部件集成到利用可光成像的介电材料（20）的常规电路板中。 电介质（20）被光刻和蚀刻以提供用于无源器件的一个或多个凹槽或开口（26），以及互连集成电路板的输入和输出的光电池。 描述了包括集成到光电介质（20）中的至少一个无源器件的电子结构及其制造方法。

公开(公告)号：WO00007417A1

公开(公告)日：2000-02-10

申请号：PCT/US1999/017300

申请日：1999-07-30

IPC: H05K3/28 ,  H01L21/48 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0353 ,  H05K2203/0585 ,  H05K2203/0759 ,  H05K2203/1476 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

Abstract: Low-impedance high-density deposited-on-laminate (DONL) structures having reduced stress features reducing metallization present on the laminate printed circuit board. In this manner, reduced is the force per unit area exerted on the dielectric material disposed adjacent to the laminate material that is typically present during thermal cycling of the structure.

Abstract translation: 具有降低的应力特征的低阻抗高密度淀积层压（DONL）结构减少层压印刷电路板上存在的金属化。 以这种方式，减小了施加在邻近层压材料设置的电介质材料上的每单位面积的力，其通常在结构的热循环过程中存在。

公开(公告)号：WO1997025839A1

公开(公告)日：1997-07-17

申请号：PCT/JP1996003718

申请日：1996-12-19

Applicant: IBIDEN CO., LTD. ,  MORI, Yoji ,  KAWAMURA, Yoichiro

Inventor： IBIDEN CO., LTD.

IPC: H05K01/02

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A printed wiring board (1) such that openings (8L) formed around a pad (12L) which is a photo-via land do not overlap a pad (12L) and the area of each of the openings (8L) around the pad (12L) is equal to that of each of the other openings (8), the amount of resin (13) with which each of the openings (8, 8L) is filled is equal to that with which each of the openings (8L) is filled over the whole wiring board (1), and the amounts of resin (13) overflowing from the openings (8, 8L) are equal to each other. The circuit pattern provided on the upper surface of an interlayer insulating layer formed on the printed wiring board can be connected to a conductor pad area without causing any defective connection, providing a highly-reliable printed wiring board.

Abstract translation: 印刷电路板（1），使得形成在作为光通过接合面的焊盘（12L）周围的开口（8L）不与焊盘（12L）重叠，并且每个开口（8L）围绕焊盘的区域 12L）与其他开口（8）中的每一个相同，每个开口（8，8L）被填充的树脂（13）的量等于每个开口（8L）的开口 填充在整个布线板（1）上，并且从开口（8,8L）溢出的树脂（13）的量彼此相等。 形成在印刷电路板上的层间绝缘层的上表面上设置的电路图形可以连接到导体焊盘区域，而不会造成任何有缺陷的连接，从而提供高度可靠的印刷电路板。

公开(公告)号：WO1997017824A1

公开(公告)日：1997-05-15

申请号：PCT/JP1996000869

申请日：1996-03-29

Applicant: IBIDEN CO., LTD. ,  YASUE, Toshihiko ,  HIRAMATSU, Yasuji ,  YANO, Hideki ,  ISHITANI, Yoshifumi ,  KAWAMURA, Yoichiro ,  MURASE, Hideki ,  SUZUKI, Ayumi ,  KAWADE, Masato

Inventor： IBIDEN CO., LTD.

IPC: H05K03/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

Abstract translation: 具有光滑表面的多层印刷布线板，即使其绝缘树脂层薄，也可以提高分辨率，层间绝缘性或耐热冲击性而不降低其剥离强度。 在上下层的导体电路通过绝缘树脂层彼此电绝缘的印刷电路板中，绝缘层由复合层构成，该复合层由耐热树脂 其难溶于酸或氧化剂，并且由耐热树脂组成的用于化学镀的粘合剂制成的上层和根据需要在下层的导体电路之间形成的凹部填充有树脂 达到对应于导体电路表面的电平。