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    Multi-layer electric circuit board and blanks therefor
    211.
    发明授权
    Multi-layer electric circuit board and blanks therefor 失效
    多层电路板及其空白

    公开(公告)号：US4524239A

    公开(公告)日：1985-06-18

    申请号：US413456

    申请日：1982-08-31

    Applicant: Francois Rouge

    Inventor： Francois Rouge

    IPC: H05K1/00 ,  H05K3/42 ,  H05K1/14

    CPC classification number: H05K1/0287 ,  H05K1/0298 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K3/429

    Abstract: A multi-layer blank for an electrical circuit board has at least one internal layer, which may constitute a common power supply or ground plane. The inner layer consists of an electrically conductive network extending throughout the area of the inner layer and formed by the repetition of an elementary predetermined pattern in two orthogonal directions. The elementary pattern has such a shape that adjacent patterns are in electrical contact so that the network is equipotential. The pattern is also of such a shape that there is formed a first regular grid of predetermined pitch p whose nodes constitute insulated sites and a second grid off-set by p/2 from the first grid in at least one of the orthogonal directions. The second grid has the same pitch p as the first one and has nodes one at least of which per elementary pattern is insulated while the other ones belong to the conducting network.

    Abstract translation: 用于电路板的多层坯体具有至少一个内部层，其可以构成公共电源或接地平面。 内层由在内层的整个区域延伸并通过沿两个正交方向重复基本预定图案形成的导电网络组成。 基本图案具有相邻图案电接触的形状，使得网络是等电位的。 该图案也具有这样一种形状，其中形成有节点构成绝缘位置的预定间距p的第一规则网格，并且在至少一个正交方向上形成由第一格栅从p / 2偏移的第二栅格。 第二格栅具有与第一栅格相同的间距p，并且具有至少每个基本图案绝缘的节点，而另一个网格属于导电网络。

    Method for mass producing printed circuit boards
    212.
    发明授权
    Method for mass producing printed circuit boards 失效
    批量生产印刷电路板的方法

    公开(公告)号：US4521262A

    公开(公告)日：1985-06-04

    申请号：US439333

    申请日：1983-01-10

    Applicant: Peter P. Pellegrino

    Inventor： Peter P. Pellegrino

    IPC: H05K1/00 ,  H05K1/11 ,  H05K3/06 ,  H05K3/42 ,  C25D7/00 ,  B05D5/00 ,  B44C1/22 ,  C23F1/02

    CPC classification number: H05K3/429 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/116 ,  H05K1/0298 ,  H05K2201/0376 ,  H05K2201/09454 ,  H05K2201/09718 ,  H05K2201/09945 ,  H05K2203/107 ,  H05K2203/175 ,  H05K3/06 ,  Y10T29/49165

    Abstract: The present invention contemplates fabrication of a printed circuit board blank having a predetermined pattern of pads and interconnecting conductive pathways, preferably (but not necessarily) flush with the face of the insulating substrate. To fabricate a finished circuit board of any desired circuit configuration, the printed circuit board blank is coated with a photoresist and exposed so that upon development of the photoresist and etching in accordance with the developed pattern, the interconnecting conductive pathways between pads will be selectively etched away so that only those interconnects for the desired circuit pattern remain. While contact printing or image exposure systems may be used to expose the photoresist, computer controlled raster scan laser printers offer the combination of speed and versatility, as the predetermined starting matrix of the invention is highly conducive to computer aided design, and the percentage of circuit board area required for exposure is very small compared to normal copper-clad board fabrication techniques. For multilayer printed circuit boards, registration apertures are provided in each board layer for alignment purposes. Interconnects between boards are made by drilling through selective pads and plating the through holes to interconnect the various board layers. Isolation of any layer of any plated through hole may be obtained by either isolation of the pad (removal of all pad interconnects) at the through hole, or alternatively by etching a larger diameter in the pad which region will be filled with laminating adhesive during the lamination process to insulate the pad from the through hole copper plating.

    Abstract translation: 本发明考虑制造具有预定图案的焊盘和互连导电路径的印刷电路板坯料，优选（但不一定）与绝缘衬底的表面齐平。 为了制造任何所需电路结构的成品电路板，印刷电路板坯体被涂覆有光致抗蚀剂并暴露，使得在显影光刻胶和根据显影图案进行蚀刻时，焊盘之间的互连导电路径将被选择性地蚀刻 使得仅保留用于所需电路图案的那些互连。 虽然接触式印刷或图像曝光系统可用于曝光光致抗蚀剂，但是由于本发明的预定起始矩阵高度有利于计算机辅助设计，所以计算机控制的光栅扫描激光打印机提供了速度和多功能性的组合，并且电路的百分比 与正常的铜包覆板制造技术相比，曝光所需的板面积非常小。 对于多层印刷电路板，在每个板层中设置配准孔用于对准目的。 板之间的互连是通过选择性焊盘钻孔和电镀通孔来互连各个板层而制成的。 任何电镀通孔的任何层的隔离可以通过在通孔处隔离焊盘（去除所有焊盘互连）来获得，或者通过蚀刻焊盘中的较大直径来获得，该区域将在层压粘合剂期间填充层压粘合剂 层压工艺使焊盘与通孔镀铜绝缘。

    Wiring board
    220.
    发明专利
    Wiring board 有权
    接线板

    公开(公告)号：JP2010283056A

    公开(公告)日：2010-12-16

    申请号：JP2009134005

    申请日：2009-06-03

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： HORIUCHI MICHIO ,  TOKUTAKE YASUE ,  MATSUDA YUICHI ,  NAKAZAWA MASAO

    IPC: H05K3/46 ,  H05K1/11

    CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/09609 ,  H05K2201/09945 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To reduce the cost by making a core substrate common and to improve flexibility of wiring design by increasing wiring density. SOLUTION: A wiring board 30 includes the core substrate 10 having a structure in which a number of linear conductors 12 are closely provided penetrating an insulating base 11 along its thickness. On both surfaces of the core substrate 10, pads P1, P2 comprising parts of a wiring layer 22 having both ends electrically connected sharing a plurality of linear conductors 12 are arranged opposite each other, and wiring connections with one surface side and the other surface side of the core substrate 10 are formed through the pads. Further, an insulating base 11 is made of an inorganic dielectric, and pads P3, P4 which include parts of wiring layers 22 each electrically connected to only one end side of linear conductors 12 for each group of a plurality of linear conductors 12 are arranged on both surfaces of the core substrate 10. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：通过使核心基板成为常见来降低成本，并通过增加布线密度来提高布线设计的灵活性。 解决方案：布线板30包括芯基板10，该芯基板10具有沿其厚度穿过绝缘基底11紧密地设置多个线状导体12的结构。 在芯基板10的两表面上，包括具有两端电连接的多个线状导体12的布线层22的部分的焊盘P1，P2彼此相对布置，并且一个表面侧和另一个表面侧的布线连接 通过焊盘形成芯基板10。 此外，绝缘基体11由无机电介质构成，并且包括仅对于多个线性导体12的每组电连接到线性导体12的一端侧的布线层22的部分的焊盘P3，P4布置在 核心基板10的两个表面。版权所有：（C）2011，JPO＆INPIT

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