公开(公告)号：WO9925165A3

公开(公告)日：1999-07-15

申请号：PCT/US9823840

申请日：1998-11-06

Applicant: LOCKHEED CORP ,  BARNETT DAVID M ,  RAWAL SURAJ P ,  MORGENTHALER DANIEL R ,  HARRIS EDWARD N

Inventor： BARNETT DAVID M ,  RAWAL SURAJ P ,  MORGENTHALER DANIEL R ,  HARRIS EDWARD N

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/373 ,  H01L25/16 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  B64G1/10 ,  B64G1/428 ,  B64G2001/1092 ,  H01L23/13 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3733 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K1/142 ,  H05K1/148 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/361 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention is directed to a multifunction structure (MFS) (20) in which electrical/electronic componentry (26), thermal control (22), (44) and structural support (22) are integrated into a monolithic structure (20) that is particularly useful in spacecraft applications. The multifunctional structure (20) is also designed to be modular so that the electrical/electronic componentry (26) can be repaired or replaced.

Abstract translation: 本发明涉及一种多功能结构（MFS）（20），其中电气/电子组件（26），热控制（22），（44）和结构支撑（22）被集成到整体结构（20）中， 在航天器应用中特别有用。 多功能结构（20）还被设计为模块化的，使得电气/电子组件（26）可以被修理或更换。

公开(公告)号：WO99025165A2

公开(公告)日：1999-05-20

申请号：PCT/US1998/023840

申请日：1998-11-06

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/373 ,  H01L25/16 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  B64G1/10 ,  B64G1/428 ,  B64G2001/1092 ,  H01L23/13 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3733 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K1/142 ,  H05K1/148 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/361 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Abstract translation: 本发明涉及一种多功能结构（MFS），其中电气/电子组件，热控制和结构支撑被集成到在宇宙飞船应用中特别有用的单片结构中。 多功能结构也被设计为模块化的，以便电气/电子组件可以被修理或更换。

公开(公告)号：WO1998020715A1

公开(公告)日：1998-05-14

申请号：PCT/US1997018992

申请日：1997-10-22

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： W.L. GORE & ASSOCIATES, INC. ,  MEOLA, Carmine, G. ,  SUILMANN, Deanna, M.

IPC: H05K03/46

CPC classification number: H05K3/323 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09609 ,  H05K2201/10378

Abstract: A printed circuit board assembly and process for assembling such a board involving interconnecting multi-layer printed circuit or printed wiring boards by simultaneously making eletrical interconnects and filling interstitial void spaces. A plurality of printed circuits boards (102, 104) to be interconnected are provided. Each board has conductive pads (106, 108) which are to be interconnected. The boards (102, 104) are aligned so that the conductive pads (106, 108) to be interconnected are opposite each other. A z-axis conductive member (110) is provided between opposing faces of the printed circuit boards (102, 104). The printed circuit boards (102, 104) are laminated with the z-axis conductive member (110), whereby the conductive pads (106, 108) are interconnected by the z-axis conductive member (110). The z-axis conductive member (110) comprises a planar, open cell, porous material having an x, y and z-axis with a series of electrically isolated, vertically defined cross section areas that extend from one side of the material to another side of the material and are covered with conductive metal, and contains a bonding adhesive in the porous material. Electronic devices may be attached to the printed circuit board assembly.

Abstract translation: 一种用于组装这种板的印刷电路板组件和工艺，其通过同时进行电气互连和填充间隙空隙来进行互连多层印刷电路或印刷线路板。 提供要互连的多个印刷电路板（102,104）。 每个板具有要互连的导电焊盘（106,108）。 板（102,104）对准，使得要互连的导电垫（106,108）彼此相对。 z轴导电构件（110）设置在印刷电路板（102,104）的相对面之间。 印刷电路板（102,104）与z轴导电构件（110）层叠，由此导电垫（106,108）通过z轴导电构件（110）互连。 z轴导电构件（110）包括具有x，y和z轴的平面开孔，多孔材料，其具有一系列电隔离的垂直限定的横截面区域，其从材料的一侧延伸到另一侧 的材料并被导电金属覆盖，并且在多孔材料中包含粘结粘合剂。 电子设备可以附接到印刷电路板组件。

公开(公告)号：WO1997012397A1

公开(公告)日：1997-04-03

申请号：PCT/US1996016023

申请日：1996-09-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： TEXAS INSTRUMENTS INCORPORATED

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  H01L23/4922 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/01 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3011 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0116 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/10378

Abstract: An assembly of two or more microelectronic parts, wherein electrical and/or thermal interconnection between the parts is achieved by means of multiple, discrete, conductive nanoscopic fibrils (15) or tubules (15) fixed within the pores of an insulating film (16). Such a film is said to have anisotropic electrical conductivity, i.e., Z-axis conductivity, with little or no conductivity in the other directions.

Abstract translation: 两个或多个微电子部件的组件，其中部件之间的电和/或热互连通过固定在绝缘膜（16）的孔内的多个离散的，导电的纳米级原纤（15）或小管（15）来实现， 。 据说这样的膜具有各向异性导电性，即Z轴导电性，在其它方向上几乎没有或没有导电性。

公开(公告)号：WO9636450A3

公开(公告)日：1997-01-16

申请号：PCT/US9606824

申请日：1996-05-13

Applicant: ALUMINUM CO OF AMERICA ,  SAWTELL RALPH R ,  PREMKUMAR M K ,  YUN DAVID I

Inventor： SAWTELL RALPH R ,  PREMKUMAR M K ,  YUN DAVID I

IPC: B22D19/00 ,  B22D17/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/88 ,  C22C1/10 ,  H01L21/48 ,  H01L23/053 ,  H01L23/06 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/44

CPC classification number: C04B41/009 ,  B22D17/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00931 ,  C22C1/1036 ,  C22C47/06 ,  C22C2001/1021 ,  C22C2204/00 ,  H01L21/4803 ,  H01L21/4821 ,  H01L21/4871 ,  H01L23/053 ,  H01L23/06 ,  H01L23/142 ,  H01L23/3733 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/101 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/128 ,  Y10T428/12486 ,  C04B41/4523 ,  C04B41/4572 ,  C04B41/4592 ,  C04B41/5053 ,  C04B41/53 ,  C04B41/5338 ,  C04B35/565 ,  C04B35/581 ,  H01L2924/00

Abstract: A method of fabricating a metal matrix composite (30) containing electrically isolated areas (34, 36, 38) and the MMC (30) formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy (46) into a stack comprising upper and lower porous preforms and an electrical insulator material (42) placed between the preforms; (c) solidiying the liquid-phase metal to form a metal matrix composite product that completely surrounds the stack; and (d) forming at least one groove in the solidified metal, the groove extending downward to the insulating substrate so as to electrically isolate at least one region on the surface of the metal matrix composite.

Abstract translation: 一种制造含有电隔离区域的金属基质复合材料的方法和由该方法形成的MMC。 该方法包括：（a）提供非增强铝合金液池; （b）将未增强的铝合金浸入包括上部和下部多孔预成型件的堆叠以及放置在预成型件之间的电绝缘材料; （c）固化液相金属以形成完全围绕堆叠的金属基质复合产品; 和（d）在固化的金属中形成至少一个槽，所述槽向下延伸到绝缘基板，以便电隔离金属基质复合材料表面上的至少一个区域。

公开(公告)号：WO1996022842A1

公开(公告)日：1996-08-01

申请号：PCT/US1995016754

申请日：1995-12-21

Applicant: CHROMALLOY GAS TURBINE CORPORATION

Inventor： CHROMALLOY GAS TURBINE CORPORATION ,  HINSON, David

IPC: B05D05/02

CPC classification number: H05K3/383 ,  C23F1/02 ,  C23F1/26 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0373 ,  H05K2203/0769

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

Abstract translation: 提供了一种使金属表面粗糙化的方法，包括将涂层涂覆到金属表面上，其中涂层是临时阻挡侵蚀金属表面的蚀刻剂，并且涂层易于蚀刻剂逐渐去除涂层，然后蚀刻涂覆的金属 具有含有蚀刻剂的水浴的表面有效地产生粗糙的金属表面。

公开(公告)号：WO1995027127A1

公开(公告)日：1995-10-12

申请号：PCT/US1995004055

申请日：1995-03-30

Applicant: GOLDEN TECHNOLOGIES COMPANY

Inventor： GOLDEN TECHNOLOGIES COMPANY ,  RITLAND, Marcus, A. ,  READEY, Dennis, W. ,  SIBOLD, Jack, D. ,  RULIS, Dean, A. ,  KLEINER, Richard, N.

IPC: F01L03/02

CPC classification number: C04B41/009 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  F01L3/02 ,  F01L3/22 ,  F01L2101/02 ,  F02B3/06 ,  F02F3/00 ,  F02F7/0087 ,  F05C2201/0415 ,  F05C2203/0895 ,  F05C2253/16 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/128 ,  C04B41/4523 ,  C04B35/10 ,  C04B35/584 ,  H01L2924/00

Abstract: Ceramic-metal composites are used in the fabrication of components for engines, particularly internal combustion engines. The components are made by infiltrating a molten metal (245) into a porous ceramic matrix (235) and cooling the metal to form a composite (255). Numerous engine components can be fabricated using this technique including valves, valve seats, exhaust port liners, pistons and rocker arms.

Abstract translation: 陶瓷 - 金属复合材料用于制造用于发动机，特别是内燃机的部件。 通过将熔融金属（245）浸入多孔陶瓷基体（235）中并冷却金属以形成复合材料（255）来制备组分。 可以使用包括阀，阀座，排气端口衬垫，活塞和摇臂的技术来制造许多发动机部件。

公开(公告)号：WO1990004321A1

公开(公告)日：1990-04-19

申请号：PCT/SE1989000441

申请日：1989-08-23

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON

Inventor： TELEFONAKTIEBOLAGET LM ERICSSON ,  OLSSON, Torbjörn, Rolf ,  KASSMAN, Björn, Ture ,  OLSSON, Karl-Gustaf ,  ERNOLF, Stig, Carl-Oskar ,  NILSSON, Per-Ove ,  KJELLSSON, Rolf, Ingvar, Birger ,  WIDOFF, Lars, Herbert

IPC: H05K07/18

CPC classification number: H05K7/1439 ,  H05K3/0064 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/044

Abstract: The present invention relates to a printed circuit board provided with electrical contact devices (7) and intended to be mounted in the back plane of a card frame (2) such as to form a magazine (1) in which printed circuit cards (6) having electrical contact devices (8) corresponding to the contact devices (7) on the board can be inserted at right angles to the back plane. The circuit board (3) forms an electrical connecting unit for the circuit cards in the back plane of the magazine. In accordance with the invention, the circuit board is configured to provide a self-supporting and stiffening structure in the form of a sandwich element (10).

公开(公告)号：WO1989007339A1

公开(公告)日：1989-08-10

申请号：PCT/GB1989000111

申请日：1989-02-03

Applicant: RAYCHEM LIMITED ,  SMITH, Nicholas, J., G. ,  LUDDEN, Michael, Joseph ,  NYHOLM, Peter ,  GIBNEY, Paul, James

Inventor： RAYCHEM LIMITED

IPC: H01L23/50

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K20/023 ,  B23K31/02 ,  B23K2101/40 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3733 ,  H01L23/4922 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/50 ,  H01L24/81 ,  H01L2224/05624 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/0017 ,  H05K3/0032 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/10378 ,  H05K2203/107 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).

Abstract translation: 聚合物片材被用于（10）（优选聚酰亚胺）设置有通孔，用于使指定的微电路，特别是跳蚤输出和物品的电连接通过激光烧蚀和金属化（20）形成 自动磁带传输（TAB）。 还描述了在金属化孔的相对端使用不同的熔点材料进行连接。 优选的聚酰亚胺是那些由4,4'-联苯二酸酐的聚合和（4,4'-二氨基联苯，或4,4'-二diaminobiphényléther，或亚苯基，优选对苯二胺）衍生的。

公开(公告)号：WO2018130550A1

公开(公告)日：2018-07-19

申请号：PCT/EP2018/050525

申请日：2018-01-10

Applicant: LISA DRÄXLMAIER GMBH

Inventor： KALLEE, Klaus ,  BUDJAREK, Leonhard

IPC: H05K3/10 ,  B22F7/00 ,  C22C1/08 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K3/101 ,  B22F3/1055 ,  B22F3/1134 ,  B22F3/20 ,  B22F7/006 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/092 ,  H05K3/107 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/09036 ,  H05K2203/128

Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen eines Fahrzeugbauteils (1) mit einer daran angeordneten elektrischen Leitstruktur (3), die sich wenigstens zwischen einer ersten elektrischen Kontaktstelle (4) zum Einspeisen und einer davon beabstandeten, zweiten elektrischen Kontaktstelle (5) zum Abgreifen eines elektrischen Stroms erstreckt. Erfindungsgemäß wird das Fahrzeugbauteil (1) bereitgestellt. Dann wird die Leitstruktur (3) durch Aufbringen eines geschäumten, elektrisch leitfähigen Metallwerkstoffs auf eine Fläche (2) des Fahrzeugbauteils (1) urgeformt. Und zwar derart, dass sich der Metallwerkstoff durchgängig zwischen den wenigstens zwei elektrischen Kontaktstellen (4, 5) erstreckt. Ferner betrifft die Erfindung auch ein Fahrzeugbauteil (1) mit einer geschäumten elektrischen Leitstruktur (3)