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    High-speed router with single backplane distributing both power and signaling
    221.
    发明申请
    High-speed router with single backplane distributing both power and signaling 有权
    具有单个背板的高速路由器分配电源和信令

    公开(公告)号：US20030179741A1

    公开(公告)日：2003-09-25

    申请号：US10068418

    申请日：2002-02-05

    Applicant: Force 10 Networks, Inc.

    Inventor： Joel R. Goergen

    IPC: G06F013/00

    CPC classification number: H05K1/0245 ,  H04Q1/03 ,  H04Q1/10 ,  H04Q1/155 ,  H04Q2201/12 ,  H05K3/4641 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09636

    Abstract: A high-speed, high-power modular router is disclosed. As opposed to conventional designs using optical backplane signaling and/or bus bars for power distribution, the disclosed embodiments combine high-power, low-noise power distribution with high-speed signal routing in a common backplane. Disclosed backplane features allow backplane signaling at 2.5 Gbps or greater on electrical differential pairs distributed on multiple high-speed signaling layers. Relatively thick power distribution layers are embedded within the backplane, shielded from the high-speed signaling layers by digital ground layers and other shielding features. A router using such a backplane provides a level of performance and economy that is believed to be unattainable by the prior art.

    Abstract translation: 公开了一种高速大功率模块化路由器。 与使用光背板信号和/或用于功率分配的汇流条的常规设计相反，所公开的实施例将大功率，低噪声功率分配与公共背板中的高速信号路由相结合。 公开的背板特征允许在分布在多个高速信令层上的电差分对上以2.5Gbps或更大的背板信号。 相对厚的配电层嵌入在背板内，通过数字接地层和其他屏蔽特性与高速信号层屏蔽。 使用这种背板的路由器提供了一种被认为是现有技术无法实现的性能和经济性。

    Method for the manufacture of porcelain coated metal boards having interconnections between the top and bottom surfaces
    223.
    发明授权
    Method for the manufacture of porcelain coated metal boards having interconnections between the top and bottom surfaces 失效
    用于制造在顶表面和底表面之间具有互连的瓷涂金属板的方法

    公开(公告)号：US4328614A

    公开(公告)日：1982-05-11

    申请号：US133255

    申请日：1980-03-24

    Applicant: Robert L. Schelhorn

    Inventor： Robert L. Schelhorn

    IPC: H05K1/05 ,  H05K3/40 ,  H05K3/44 ,  H05K3/04

    CPC classification number: H05K3/445 ,  H05K1/053 ,  H05K2201/09636 ,  H05K2201/09881 ,  H05K2201/10416 ,  H05K3/4046 ,  Y10T29/49147

    Abstract: In accordance with this invention a procelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the procelain to the surfaces of the core.

    Abstract translation: 根据本发明，提供了一种具有平坦表面并且还具有电路板的表面和反面之间的电连接的镀层金属板。 根据本发明的另一方面，本发明的板是通过一种方法获得的，其中连接销在板的金属芯中的孔中以间隔的关系密封，并在施加之前与芯绝缘 原子核到核心的表面。

    전자 장치의 노이즈 감소 장치
    224.
    发明公开
    전자 장치의 노이즈 감소 장치 审中-实审
    减少电子设备噪音的设备

    公开(公告)号：KR1020160102769A

    公开(公告)日：2016-08-31

    申请号：KR1020150025269

    申请日：2015-02-23

    Applicant: 삼성전자주식회사

    Inventor： 윤종혁 ,  조재형 ,  정명균

    IPC: H05K1/02 ,  H05K9/00

    CPC classification number: H05K1/115 ,  H05K1/0216 ,  H05K2201/09609 ,  H05K2201/09636 ,  H05K1/0215 ,  H05K1/0222 ,  H05K9/0022

    Abstract: 본발명의다양한실시예들은전자장치에서발생하는노이즈를감소할수 있는장치에관한것으로, 상기전자장치는인쇄회로기판; 상기인쇄회로기판의표면에실장되며, 적어도하나의신호를생성하는신호생성부; 상기신호생성부의전원단자와상기인쇄회로기판의내부에위치하는메인전원라인을연결하는적어도하나의전원비아; 및상기신호생성부의그라운드단자와상기인쇄회로기판의내부에위치하는메인그라운드를연결하며, 상기전원비아와평행하게위치하는적어도하나의그라운드비아를포함할수 있다.

    Abstract translation: 根据本发明的各种实施例，公开了能够减少电子设备中产生的噪声的装置。 电子设备包括：印刷电路板; 信号产生单元，安装在所述印刷电路板的表面上并被配置为产生至少一个信号; 至少一个电源通路，被配置为将所述信号发生单元的电源端子连接到位于所述印刷电路板中的主电源线; 以及至少一个接地通路，被配置为将信号发生单元的接地端子连接到位于印刷电路板中并与电源通路并联设置的主地。

    전자기파 차단 기판
    225.
    发明公开
    전자기파 차단 기판 失效
    基板屏蔽电磁波

    公开(公告)号：KR1020100137783A

    公开(公告)日：2010-12-31

    申请号：KR1020090056001

    申请日：2009-06-23

    Applicant: 삼성전기주식회사

    Inventor： 조원우 ,  양덕진 ,  김정수 ,  김형호

    IPC: H05K1/02 ,  H05K9/00

    CPC classification number: H05K1/0218 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09636 ,  H05K2201/09718

    Abstract: PURPOSE: An electromagnetic wave shielding substrate is provided to efficiently shield the emission of an electromagnetic wave by forming an electromagnetic band gap structure along the edge of a substrate. CONSTITUTION: A conductive layer(110) is comprised of a plurality of conductive plates. A metal layer(300) is arranged on the upper or lower side of the conductive layer and includes a stitching pattern(310) which electrically connects a first conductive plate(110a) and a second conductive plate(110b). The first conductive plate is electrically connected to the second conductive plate through a first via(510) and a second via(530). All conductive plates formed on the conductive layer are electrically connected to each other through the stitching pattern.

    Abstract translation: 目的：提供一种电磁波屏蔽基板，通过沿着基板的边缘形成电磁带隙结构来有效地屏蔽电磁波的发射。 构成：导电层（110）由多个导电板构成。 金属层（300）布置在导电层的上侧或下侧，并且包括电连接第一导电板（110a）和第二导电板（110b）的缝合图案（310）。 第一导电板通过第一通孔（510）和第二通孔（530）电连接到第二导电板。 形成在导电层上的所有导电板通过缝合图案彼此电连接。

    적층 커패시터들의 배선 구조
    227.
    发明公开
    적층 커패시터들의 배선 구조 有权
    层压电容器接线结构

    公开(公告)号：KR1020080089276A

    公开(公告)日：2008-10-06

    申请号：KR1020080029189

    申请日：2008-03-28

    Applicant: 인더스트리얼 테크놀로지 리서치 인스티튜트

    Inventor： 수,치엔-민 ,  우,시-시엔 ,  리,민-린 ,  라이,신-주

    IPC: H01L27/04

    CPC classification number: H05K1/162 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/112 ,  H05K3/429 ,  H05K3/4688 ,  H05K2201/0792 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09636 ,  H05K2201/10734 ,  H01L2224/0401

    Abstract: A wiring structure of laminated capacitors is provided to enhance efficiency in radio frequency applications by reducing a surface area of a capacitor and reducing parasitic capacitance. A plurality of conductive layers includes a top conductive layer and a bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. A power via(440) is extended along a thickness direction of the laminated capacitor and is arranged from the top conductive layer to the bottom conductive layer. The power via is electrically coupled to the first conductive layers. A ground via(450) is extended along the thickness direction of the laminated capacitor and is arranged from the top conductive layer to the bottom conductive layer. The ground via is electrically coupled to the second conductive layers. A supplemental via(460) is positioned between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layers.

    Abstract translation: 提供层叠电容器的布线结构，以通过减小电容器的表面积和减小寄生电容来提高射频应用的效率。 多个导电层包括顶部导电层和底部导电层。 导电层包括一组第一导电层和一组第二导电层。 电源通孔（440）沿层叠电容器的厚度方向延伸，并且从顶部导电层设置到底部导电层。 电源通孔电耦合到第一导电层。 接地通孔（450）沿层叠电容器的厚度方向延伸，并从顶部导电层设置到底部导电层。 接地通孔电耦合到第二导电层。 辅助通孔（460）位于电源通孔和接地通孔之间。 补充通孔的长度要短于电源通孔和接地通孔。 辅助通孔电耦合到第一导电层和第二导电层之一。

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