公开(公告)号：EP0209974A3

公开(公告)日：1988-08-31

申请号：EP86304130

申请日：1986-05-30

Applicant: AMP INCORPORATED (a New Jersey corporation)

Inventor： Johnescu, Douglas Michael ,  Johnson, Erlon Fitch

IPC: H01R17/12 ,  H01R09/09

CPC classification number: H01R24/50 ,  H01R2103/00 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10795 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An electrical connector 1 has a housing (2) with a base (3) for mounting on a printed circuit board (5), projecting mounting posts (6) extend from the base, a conductive outer shell (22) and a dielectric body (23) surrounded by the housing (2), a first conductive contact (25) has a first contact portion (48) projecting from the housing (2) for insertion into a corresponding aperture (55) of a printed circuit board (5), a second contact portion (33) projecting from the housing (2) for insertion into a corresponding aperture (7) of a printed circuit board (5), and each contact portion (33,48) has a taper (50) toward the free end and with an apex (51) of the taper (50) that intersects a longitudinal edge (52) of the corresponding contact portion (33,48) and is aligned with a center line (54) of a corresponding aperture (55) of a printed circuit board (5).

公开(公告)号：EP0223071A2

公开(公告)日：1987-05-27

申请号：EP86114327.9

申请日：1986-10-16

Applicant: Advanced Interconnection Technology, Inc.

Inventor： Plonski, Philip J.

IPC: H05K1/02 ,  H05K7/06

CPC classification number: H05K7/06 ,  H01R9/0515 ,  H01R12/58 ,  H05K1/0219 ,  H05K3/10 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/09809 ,  H05K2201/10356 ,  Y10T29/49162

Abstract: The invention relates to a method for making coaxial conductor interconnection boards including, on the upper side of the board, signal conductors surrounded by a dielectric and by a conductive shield. To prevent shorting of the signal conductors with the shield, the conductors are step-stripped and the unshielded conductor end with the dielectric exposed is inserted in drilled, non-metallized holes. The completely exposed signal conductor extends to the lower side of the board and is connected conductively to terminals pads, while the shields on the upper side are connected by a conductive layer which is connected to the ground plane.

Abstract translation: 本发明涉及一种用于制造同轴导体互连板，包括，在所述板的上侧的方法，信号导体由电介质和导电屏蔽包围。 为了防止与屏蔽信号导体的短路，所述导体是逐步剥离，并与露出的电介质的导体屏蔽端被插入到钻孔，非金属化的孔。 完全暴露的呼叫信号导体延伸到所述板的下侧上，并且导电地连接到终端垫，而在上侧的屏蔽件通过导电层连接的所有连接到所述接地平面。

公开(公告)号：EP0209974A2

公开(公告)日：1987-01-28

申请号：EP86304130.7

申请日：1986-05-30

Applicant: AMP INCORPORATED

Inventor： Johnescu, Douglas Michael ,  Johnson, Erlon Fitch

IPC: H01R17/12 ,  H01R9/09

CPC classification number: H01R24/50 ,  H01R2103/00 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10795 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An electrical connector 1 has a housing (2) with a base (3) for mounting on a printed circuit board (5), projecting mounting posts (6) extend from the base, a conductive outer shell (22) and a dielectric body (23) surrounded by the housing (2), a first conductive contact (25) has a first contact portion (48) projecting from the housing (2) for insertion into a corresponding aperture (55) of a printed circuit board (5), a second contact portion (33) projecting from the housing (2) for insertion into a corresponding aperture (7) of a printed circuit board (5), and each contact portion (33,48) has a taper (50) toward the free end and with an apex (51) of the taper (50) that intersects a longitudinal edge (52) of the corresponding contact portion (33,48) and is aligned with a center line (54) of a corresponding aperture (55) of a printed circuit board (5).

Abstract translation: 电连接器1具有壳体（2），其具有用于安装在印刷电路板（5）上的底座（3），突出的安装柱（6）从底座延伸，导电外壳（22）和电介质体 第一导电接触件（25）具有从壳体（2）伸出的第一接触部分（48），用于插入到印刷电路板（5）的相应的孔（55）中， 从所述壳体（2）突出以插入到印刷电路板（5）的对应的孔（7）中的第二接触部分（33），并且每个接触部分（33,48）具有朝向所述自由 并且具有与对应的接触部分（33,48）的纵向边缘（52）相交并且与对应的孔（55）的中心线（54）对准的锥体（50）的顶点（51） 印刷电路板（5）。

公开(公告)号：EP0158876A2

公开(公告)日：1985-10-23

申请号：EP85103594.9

申请日：1985-03-26

Applicant: SYSTEM KONTAKT Gesellschaft für elektronische Bauelemente mbH

Inventor： Eberbach, Rolf ,  Leitl, Franz

IPC: H05K3/46

CPC classification number: H05K1/0221 ,  H05K1/024 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/09672 ,  H05K2201/09809 ,  H05K2201/09981

Abstract: Die Erfindung betrifft eine mehrlagige Leiterplatte in Multilayer- oder Stapeltechnik mit mehreren übereinander liegenden Lagen, bei der zumindest ein Teil der Innenlagen mit als Leiterbahnen ausgebildeten und im Abstand zueinander angeordneten Signalleitungen versehen ist. Damit die Signalleitungen sowohl auf den beiden Außenlagen, als auch Innenlagen mit gleichen übertragungstechnischen Eigenschaften aufgebracht werden können, sieht die Erfindung vor, daß die den Innenlagen mit Leiterbahnen benachbarten Innenlagen im Bereich dieser Leiterbahnen so ausgespart sind, daß zumindest die zugekehrten Oberseiten dieser Leiterbahnen freiliegen.

Abstract translation: 本发明涉及一种多层印刷电路板，其以多层或多层技术制成，其中多层位于上述之上，其中至少一部分内层设置有设计为导体路径的信号线， 从彼此。 为了使信号线可以同时施加到具有相同技术传输特性的两个外层以及内层，本发明提供了与具有导体路径的内层相邻的内层凹陷在这些导体的区域中 使得至少导体路径的相对的上侧面露出。

公开(公告)号：EP0069102A3

公开(公告)日：1983-03-16

申请号：EP82850145

申请日：1982-06-24

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON

Inventor： Josefsson, Lars Gustaf ,  Svensson, Bengt Tomas ,  Moeschlin, Lars Felix

IPC: H01P05/08 ,  H01P03/08

CPC classification number: H01P3/085 ,  H01P3/088 ,  H01P5/08 ,  H05K1/0222 ,  H05K1/0251 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/0715 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: An impedance matching stripline transition for microwave signals which are conducted from a stripline circuit on one laminate (2) to another laminate (4) through a number of intermediate laminates (3). The connection between an incoming stripline circuit (21) on one laminate (2) to the outgoing stripline circuit (41) on the other laminate is performed as a short coaxial line. The outer conductor of the coaxial line is formed by a number of through-plated holes (12, 13, 23, 33, 43) in horseshoe form around a central conductor of through-plated holes (24, 34). The outer conductor is connected with the earth plane (31, 11, 45) of the laminates. They serve simultaneously as suppressor of not desired modes in the microwave signals which is supplied to the transition via the conductor (21).

公开(公告)号：EP2395598B1

公开(公告)日：2018-08-22

申请号：EP10170680.2

申请日：2004-03-04

Applicant: Nuvotronics, LLC

Inventor： Sherrer, David W. ,  Fisher, John J.

IPC: H01P3/06 ,  H01P1/08 ,  H01P5/103 ,  H01P11/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

公开(公告)号：EP2330528B1

公开(公告)日：2018-03-28

申请号：EP10172139.7

申请日：2010-08-06

Applicant: NCR Corporation

Inventor： McNicoll, Grant ,  Walker, Ian ,  Harrow, Charles

IPC: G06F21/75 ,  G06F21/86 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: G06F21/86 ,  G06F21/75 ,  G06Q20/4012 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/063

Abstract: A secure circuit board assembly (10) is provided. The secure circuit board assembly (10) comprises: a control board (12) including a cryptographic processor (30); a spacer portion (14) mounted on the control board (12); and a lid (16) mounted on the spacer portion (14). The control board (12), the spacer portion (14), and the lid (16) collectively provide a secure enclosed chamber in which the cryptographic processor (30) is mounted. The spacer portion (14) provides protection against side-on attacks against the cryptographic processor (30).

公开(公告)号：EP2451254A1

公开(公告)日：2012-05-09

申请号：EP12151874.0

申请日：2005-02-24

Applicant: BelAir Networks Inc.

Inventor： Brunette, Gilbert P. ,  Johnson, Eric ,  Rayment, Stephen G. ,  Soul, Colin

IPC: H05K1/02

CPC classification number: H05K1/0251 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2924/1903 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A multilayer printed circuit board (100) comprising a first and a second conductive layer and an interconnection structure. The conductive layers have respective conductive traces formed thereon terminating at respective via pads (120). The interconnection structure comprises a centre signal conductor via (130) and a plurality of ground vias (132, 134, 136, 138). The centre signal conductor via is connected to the conductive traces propagating electrical signals there between. The multilayer circuit board further comprises a grounded metal layer (150). The grounded metal layer has a ground pullback section (140) cut away in a region surrounding the signal conductor via. The grounded metal layer comprises first and second ground extension sections protruding into the cut away ground pullback section. The first and second ground extension sections correspond to sections (118) of the conductive traces not having the grounded metal layer underneath and above, respectively.

Abstract translation: 一种包括第一和第二导电层和互连结构的多层印刷电路板（100）。 导电层具有形成在其上的相应的导电迹线，其终止于相应的通孔焊盘（120）。 互连结构包括中心信号导体通孔（130）和多个接地通孔（132,134,136,138）。 中心信号导体通孔连接到导电迹线之间传播电信号。 多层电路板还包括接地金属层（150）。 接地的金属层具有在围绕信号导体通孔的区域中切除的接地回拉部分（140）。 接地的金属层包括突出到切除的接地回拉部分中的第一和第二接地延伸段。 第一和第二接地延伸部分分别对应于不具有下方和上方的接地金属层的导电迹线的部分（118）。

公开(公告)号：EP2161973A4

公开(公告)日：2011-08-03

申请号：EP07721251

申请日：2007-05-24

Applicant: PRINCO CORP

Inventor： YANG CHIH-KUANG

IPC: H05K3/04 ,  H05K3/24 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/048 ,  H05K1/0219 ,  H05K3/0041 ,  H05K3/107 ,  H05K3/244 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/09809 ,  H05K2203/095

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.

公开(公告)号：EP2330528A2

公开(公告)日：2011-06-08

申请号：EP10172139.7

申请日：2010-08-06

Applicant: NCR Corporation

Inventor： McNicoll, Grant ,  Walker, Ian ,  Harrow, Charles

IPC: G06F21/00

CPC classification number: G06F21/86 ,  G06F21/75 ,  G06Q20/4012 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/063

Abstract: A secure circuit board assembly (10) is provided. The secure circuit board assembly (10) comprises: a control board (12) including a cryptographic processor (30); a spacer portion (14) mounted on the control board (12); and a lid (16) mounted on the spacer portion (14). The control board (12), the spacer portion (14), and the lid (16) collectively provide a secure enclosed chamber in which the cryptographic processor (30) is mounted. The spacer portion (14) provides protection against side-on attacks against the cryptographic processor (30).

Abstract translation: 提供可靠的电路板组件（10）。 该安全电路板组件（10）包括：包括密码处理器（30）的控制板（12）; 安装在控制板（12）上的隔离部分（14）; 和安装在隔离部分（14）上的盖子（16）。 控制板（12），隔离部分（14）和盖（16）共同提供安全密封处理器（30）安装在其中的安全封闭室。 间隔部分（14）提供防止对密码处理器（30）的侧面攻击的保护。