公开(公告)号：US20020074644A1

公开(公告)日：2002-06-20

申请号：US09741206

申请日：2000-12-19

Inventor： Robert L. Sankman

IPC: H01L023/053 ,  H01L023/12

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2203/0235 ,  H01L2224/05599

Abstract: A microelectronic substrate having a plurality of alternating substantially planar layers of dielectric material and conductive material, and further having a first surface and a second surface, wherein the dielectric material and the conductive material layers extend substantially perpendicularly between the first and second surfaces.

Abstract translation: 一种微电子衬底，其具有多个交替的基本平坦的电介质材料和导电材料层，并且还具有第一表面和第二表面，其中所述电介质材料和所述导电材料层在所述第一表面和所述第二表面之间基本垂直地延伸。

公开(公告)号：US06358094B1

公开(公告)日：2002-03-19

申请号：US09538698

申请日：2000-03-30

Applicant: Yakov Belopolsky ,  Jenn Tsao

Inventor： Yakov Belopolsky ,  Jenn Tsao

IPC: H01R2400

CPC classification number: H05K1/148 ,  H01R12/7082 ,  H01R12/7088 ,  H01R13/658 ,  H05K2201/0792 ,  H05K2201/097 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2203/1572

Abstract: A low inductance power connector for reducing inductance in an electrical conductor is provided. An interface connector connects circuit boards together while reducing inductance and increasing current carrying capacity. The connector for connecting circuit boards comprises a first contact having a body, a first mating portion and a second mating portion, and a second contact having a body, a third mating portion and a fourth mating portion. The first and second mating portions are substantially parallel and disposed on opposite sides of the body of the first contact, and the third and fourth mating portions are substantially parallel and disposed on opposite sides of the body of the second contact.

Abstract translation: 提供了用于降低电导体中的电感的低电感电源连接器。 接口连接器将电路板连接在一起，同时减少电感和增加载流能力。 用于连接电路板的连接器包括具有主体，第一配合部分和第二配合部分的第一触点和具有主体，第三配合部分和第四配合部分的第二触点。 第一和第二配合部分基本上平行并且设置在第一接触件的主体的相对侧上，并且第三和第四配合部分基本上平行并且设置在第二接触件的主体的相对侧上。

公开(公告)号：US06316104B1

公开(公告)日：2001-11-13

申请号：US09446455

申请日：1999-12-29

Applicant: Masayuki Kumakura

Inventor： Masayuki Kumakura

IPC: D02G300

CPC classification number: H05K3/386 ,  C09J167/00 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0769 ,  H05K2201/1028 ,  H05K2203/122 ,  H05K2203/1545 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2958

Abstract: Adhesives and adhesive films based on polymer resins and containing a cationic scavenger are provided for circuit materials and flat cables with metallic wiring. The cationic scavenger reduces free cations in the adhesive and prevents the loss over time of insulation and adhesive strength provided to the circuit materials.

Abstract translation: 提供了基于聚合物树脂并含有阳离子清除剂的粘合剂和粘合剂膜，用于电路材料和具有金属布线的扁平电缆。 阳离子清除剂减少粘合剂中的游离阳离子，并防止绝缘时间的损失和提供给电路材料的粘合强度。

公开(公告)号：US06225573B1

公开(公告)日：2001-05-01

申请号：US09180978

申请日：1998-11-18

Applicant: Satoshi Nakamura

Inventor： Satoshi Nakamura

IPC: H01R1204

CPC classification number: H05K3/3405 ,  H01R12/52 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09909 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  H05K2203/104 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: There are provided a coating step for coating solder paste (3) onto the circuit board (1), a superimposing step for superimposing a connecting end (4a) of a terminal (4) also having a non-connecting end (4b) on the regions coated with solder paste (3), and a heating step for heating and melting the solder paste (3) in order to solder the connecting end (4a) onto the circuit board (1). A further step for coating adhesive material (6) onto the circuit board (1) is provided, and in the aforementioned superimposing step, the connecting end (4a) is brought into contact with the regions coated with the adhesive material (6). In the aforementioned heating step, the solder paste (3) is heated and caused to melt whilst the connecting end (4a) is in a bonded state with respect to the circuit board (1) by means of the adhesive material (6).

Abstract translation: 提供了一种用于将焊膏（3）涂覆到电路板（1）上的涂覆步骤，用于将也具有非连接端（4b）的端子（4）的连接端（4a）重叠在其上的叠加步骤 涂覆有焊膏（3）的区域，以及用于加热和熔化焊膏（3）的加热步骤，以将连接端（4a）焊接到电路板（1）上。 提供了将粘合剂材料（6）涂覆到电路板（1）上的另一步骤，并且在上述重叠步骤中，连接端（4a）与涂覆有粘合剂材料（6）的区域接触。 在上述加热步骤中，焊膏（3）被加热并熔化，同时连接端（4a）通过粘合材料（6）相对于电路板（1）处于接合状态。

公开(公告)号：US6062903A

公开(公告)日：2000-05-16

申请号：US92994

申请日：1998-06-08

Applicant: Kevin Joseph Hawes ,  Sean Michael Kelly ,  David Jay Vess

Inventor： Kevin Joseph Hawes ,  Sean Michael Kelly ,  David Jay Vess

IPC: H01R31/08 ,  H05K3/22

CPC classification number: H01R12/57 ,  H01R31/085 ,  H05K1/0265 ,  H05K3/222 ,  H05K2201/1028

Abstract: An improved interconnect apparatus for high power circuits that is low in cost and amenable for integration with low power circuits in a single electronic package. The interconnect apparatus includes serially connected surface mount bus bars bridging two or more metal pads or traces formed on a standard circuit board of the type used to package low power circuitry. The surface mount bus bars operate not only to conduct the higher currents, but also to draw heat out of the metal pads or intervening portions of the metal traces. This keeps the temperature within the capabilities of low power circuit board technology, and allows very narrow high power interconnects for reduced package size. Manufacturing cost advantages are achieved because the surface mount bus bars are assembled by automated pick-and-place equipment of the same type used for other surface mount components used in the package. In certain circumstances, a series of surface mount bus bars may be placed atop a continuous metal trace, or overlapped to provide a minimum resistance connection.

Abstract translation: 一种用于高功率电路的改进的互连装置，其成本低廉并且适于与单个电子封装中的低功率电路集成。 互连装置包括串联连接的表面安装汇流条，桥接形成在用于封装低功率电路的类型的标准电路板上的两个或更多个金属焊盘或迹线。 表面安装母线不仅用于传导较高的电流，而且还用于将热量从金属焊盘或金属迹线的中间部分吸出。 这将使温度保持在低功耗电路板技术的能力范围内，并允许非常窄的大功率互连以减少封装尺寸。 制造成本优势得到实现，因为表面贴装母线由用于包装中使用的其他表面贴装部件的相同类型的自动拾取和放置设备组装。 在某些情况下，一系列表面贴装母线可以放置在连续的金属迹线上，或重叠以提供最小电阻连接。

公开(公告)号：US5793611A

公开(公告)日：1998-08-11

申请号：US752009

申请日：1996-11-19

Applicant: Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

Inventor： Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H05K1/0207 ,  H05K7/20509 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2201/10416 ,  H05K2203/304

Abstract: An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.

Abstract translation: 电子设备包括具有电子部件的基板，用于电连接电子部件的导电线，安装有电子部件和导电线的前表面，反面以及与该电子部件相对的至少一个电子部件后部 电子零件; 和至少一个高导热性部件，其导热系数高于基板的导热系数，高导热性部件连接到电子部件背部，同时高导热性部件与基板中的电子部件相对 宽度方向以减小电子部件之间的温度差。

公开(公告)号：US5201974A

公开(公告)日：1993-04-13

申请号：US475578

申请日：1990-02-06

Applicant: Frederick A. West

Inventor： Frederick A. West

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4632 ,  H05K3/20 ,  H05K3/4617 ,  H05K7/06 ,  H05K1/0393 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/09809 ,  H05K2201/09881 ,  H05K2201/1028 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/1545 ,  H05K3/1275 ,  H05K3/366 ,  H05K3/4069 ,  H05K3/4614 ,  Y10S428/901 ,  Y10T156/1015 ,  Y10T29/49126

Abstract: Patterned electrically conductive structures, such as circuit elements, in single or multiple laminar form, and their manufacture. The basic laminar structure is made by sizing a removable substrate to substantially equal depth with an electrically conductive material over a given area configured as a circuit element and with an electrically non-conductive material elsewhere, bonding the respective sizing materials in place and together, and separating the substrate to leave a lamina of electrically conductive and non-conductive materials side-by-side. Face-to-face juxtaposition of such substrate-less laminae provides built-up or laminated products.

Abstract translation: 图案化的导电结构，例如单层或多层流形式的电路元件及其制造。 基本的层状结构是通过将可移除的衬底在给定的区域上形成与导电材料基本相同的深度来制造的，该给定区域被构造为电路元件，并且在其它地方使用不导电材料，将相应的施胶材料粘合在一起，并将它们结合在一起;以及 分离衬底以并排留下导电和非导电材料层。 这种无底板的面对面并置提供积层或层压产品。

公开(公告)号：US5079070A

公开(公告)日：1992-01-07

申请号：US595902

申请日：1990-10-11

Applicant: Pedro A. Chalco ,  Carlos J. Sambucetti

Inventor： Pedro A. Chalco ,  Carlos J. Sambucetti

IPC: B23K20/10 ,  B23K26/32 ,  G02F1/13 ,  H05K3/20 ,  H05K3/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/225 ,  B23K20/10 ,  G02F1/1309 ,  H05K2201/0317 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/20 ,  H05K3/244 ,  H05K3/328 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31721

Abstract: Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.

Abstract translation: 通过将所选择的导电修复线从位于开放缺陷上的支撑片扩散接合来修复衬底上的薄膜导体线中的开放缺陷。 通过施加超声能量和激光能量来进行扩散接合。

公开(公告)号：US4664309A

公开(公告)日：1987-05-12

申请号：US509684

申请日：1983-06-30

Applicant: Leslie J. Allen ,  Gabe Cherian ,  Stephen H. Diaz

Inventor： Leslie J. Allen ,  Gabe Cherian ,  Stephen H. Diaz

IPC: H01R9/16 ,  B23K3/06 ,  B23K35/02 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K13/04 ,  H01L21/58 ,  B23K1/12

CPC classification number: B23K35/0222 ,  B23K3/06 ,  H05K1/0271 ,  H05K13/0465 ,  H05K3/325 ,  H05K3/3436 ,  H01L2924/00013 ,  H05K2201/0215 ,  H05K2201/0314 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0415 ,  H05K2203/0769 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4015 ,  Y02P70/613

Abstract: A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.

Abstract translation: 在下文中也称为“互连预成型件放置装置”的芯片安装装置包括具有预定图案的孔的保持构件，其中定位有诸如焊料的接合形成材料的预成型件。 每个预成型件具有预定的构造并且具有大于横截面尺寸的高度或长度。 预成型件在互连或焊接工艺之后保持其一般构造，以形成能够承受应力，应变和疲劳的弹性接头。 形成弹性互连的方法包括将互连预制件放置装置放置在导电元件的平行图案之间，诸如电子部件和电路板上的导电焊盘，并且实现导电元件与预成型件的结合。

公开(公告)号：US4355199A

公开(公告)日：1982-10-19

申请号：US109664

申请日：1980-01-04

Applicant: Penelope J. V. Luc

Inventor： Penelope J. V. Luc

IPC: H05K3/36 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K3/4046 ,  H01L2224/18 ,  H05K2201/1028 ,  H05K2201/10946 ,  H05K3/36 ,  H05K3/403 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A conductive connection between a metallized outer surface of a film of plastics material, such as a polyimide film and a metal or metallized surface of a substrate to which the film is attached. The connection comprises a flexible conductor secured to the substrate and a second film of plastics material which is bonded to the metallized surface of the first film material and to the flexible conductor to effect a conductive connection between the metallized surface of the first film and the substrate. The second film may be so arranged that it holds the flexible conductor in close contact with the metallized layer on the first film to effect an electrical connection but is preferably metallized whereby an additional electrical connection is effected by way of its metallized surface and the flexible conductor.

Abstract translation: 塑料材料膜的金属化外表面之间的导电连接，例如聚酰亚胺膜和附着有薄膜的基底的金属或金属化表面。 连接包括固定到基板的柔性导体和粘合到第一薄膜材料的金属化表面和柔性导体上的塑料材料的第二薄膜，以实现第一薄膜的金属化表面与基底之间的导电连接 。 第二膜可以被布置成使得其保持柔性导体与第一膜上的金属化层紧密接触以实现电连接，但是优选地被金属化，由此通过其金属化表面和柔性导体来实现额外的电连接 。