公开(公告)号：WO2015045309A1

公开(公告)日：2015-04-02

申请号：PCT/JP2014/004679

申请日：2014-09-11

Applicant: 日本電気株式会社

Inventor： 柏倉　和弘

IPC: H01P3/06 ,  H01P5/02

CPC classification number: H05K1/0222 ,  H01P1/045 ,  H01P5/085 ,  H05K1/0213 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0047 ,  H05K3/40 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09809

Abstract: 　伝送特性劣化を解決するプリント基板を提供することである。　本発明のプリント基板は、基板と、前記基板上に設けられた円形の信号パッドと、前記信号パッドをドーナツ状に取り囲む前記基板を挟み、さらにその外周を取り囲むドーナツ状のグラウンドパッドと、前記信号パッドをドーナツ状に取り囲む前記基板上に、一つ以上配置された凹部と、を備える。

Abstract translation: 提供一种解决传输特性恶化问题的印刷电路板。 该印刷电路板设置有：基板; 设置在基板上的圆形信号焊盘; 环形接地垫，其以环形形状夹持围绕基板的基板，信号垫，并围绕基板的外周; 以及设置在基板中的一个或多个凹部，所述凹部围绕所述环形形状包围所述信号垫。

公开(公告)号：WO2013190437A1

公开(公告)日：2013-12-27

申请号：PCT/IB2013/054856

申请日：2013-06-13

Applicant: LEIBA, Yigal ,  DAYAN, Elad ,  SIKLU COMMUNICATION LTD.

Inventor： LEIBA, Yigal ,  DAYAN, Elad

IPC: H01P5/107 ,  H01P3/18 ,  H05K3/00

CPC classification number: H05K1/0253 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01P3/121 ,  H01P5/107 ,  H05K2201/09609 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.

Abstract translation: 包括微带，探针和RF集成电路的印刷电路板上的毫米波系统的各种实施例，以及用于制造所述系统的方法。 各种实施例具有延伸穿过PCB中的层的孔，从而改善辐射传播。 各种实施例具有通过延伸穿过PCB中的层的多个通孔产生的导电笼，从而增加辐射传播。 这种系统的制造比当前系统的制造更容易且更便宜。

公开(公告)号：WO2013103437A1

公开(公告)日：2013-07-11

申请号：PCT/US2012/063044

申请日：2012-11-01

Applicant: CRAY INC.

Inventor： KIM, Hyunjun ,  CONGER, Jeffrey Scott ,  SCOTT, Gregory Erwin

IPC: H01P1/00

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

Abstract translation: 多层印刷电路板具有多个着陆焊盘，其被配置为接合固定到其上的连接器。 在与不同信号相关联的着陆垫之间是至少一个微通孔，其电连接到多层印刷电路板的外表面上的接地平面，以及多层印刷电路的内层上的接地平面 板。

公开(公告)号：WO2010111379A2

公开(公告)日：2010-09-30

申请号：PCT/US2010/028487

申请日：2010-03-24

Applicant: Molex Incorporated ,  CASHER, Patrick R. ,  REGNIER, Kent E. ,  LANG, Harold Keith

Inventor： CASHER, Patrick R. ,  REGNIER, Kent E. ,  LANG, Harold Keith

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0222 ,  H01R13/6587 ,  H05K1/0245 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10189

Abstract: A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.

Abstract translation: 连接器和电路板组件包括连接器中的端子，其被安装到电路板中的通孔中。 信号和接地端子因此耦合到电路板中的信号迹线和接地平面。 可以在电路板中提供与接地通孔对齐的额外的钉扎通孔，以帮助改善连接器中的端子与电路板中的信号迹线之间的接口处的电性能。 信号环可以允许成对的信号迹线在重新接合之前被分开并布线在通孔的两个不同侧上，同时保持紧密的电接近性，从而在该对信号迹线中的迹线之间提供相对一致的电耦合。

公开(公告)号：WO2010099245A1

公开(公告)日：2010-09-02

申请号：PCT/US2010/025290

申请日：2010-02-24

Applicant: QUALCOMM INCORPORATED ,  BLAIR, James, L. ,  WAITE, David, W. ,  LOHIYA, Ashish ,  NARRA, Saritha ,  SMITH, Jeffrey, T. ,  SAMMULI, Arvid, G.

Inventor： BLAIR, James, L. ,  WAITE, David, W. ,  LOHIYA, Ashish ,  NARRA, Saritha ,  SMITH, Jeffrey, T. ,  SAMMULI, Arvid, G.

IPC: H05K3/36 ,  G01R1/073 ,  G01R31/28 ,  H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/112 ,  G01R1/07378 ,  G01R31/2889 ,  H05K1/0219 ,  H05K2201/0314 ,  H05K2201/09309 ,  H05K2201/09418 ,  H05K2201/09609 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2203/167

Abstract: Space transformer connectors for coupling printed circuit boards and/or other electrical connections are disclosed. A scalar design of a multilayer space transformer connector allows for a variety of pad-array field connections. A conductive elastomer interface provides for repeated and consistent coupling and decoupling of the space transformer connector.

Abstract translation: 公开了用于耦合印刷电路板和/或其它电连接的空间变压器连接器。 多层空间变压器连接器的标量设计允许各种焊盘阵列现场连接。 导电弹性体接口提供空间变压器连接器的重复和一致的耦合和去耦。

公开(公告)号：WO2009002355A1

公开(公告)日：2008-12-31

申请号：PCT/US2007/081947

申请日：2007-10-19

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  OK, Jerry ,  GREENBERG, Robert, J.

Inventor： OK, Jerry ,  GREENBERG, Robert, J.

IPC: H05K3/40

CPC classification number: H05K3/4061 ,  B32B37/14 ,  C04B35/10 ,  C04B37/00 ,  C04B2237/064 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/12 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10T156/10

Abstract: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

Abstract translation: 一种制造密封电馈通的方法。 该方法包括提供具有上表面和下表面的陶瓷片，在从所述上表面延伸到所述下表面的所述陶瓷片中形成至少一个通孔，将导电厚膜糊剂插入所述通孔中，将陶瓷片层压 在上陶瓷片和下陶瓷片之间通过孔填充糊状物以形成层压陶瓷基板，将层叠的陶瓷基板烧制至烧结层叠陶瓷基板的温度，并使填充有通孔的浆料形成金属化通孔， 层叠陶瓷基板，以形成围绕所述金属化通孔的气密密封，并从烧结的层叠陶瓷基板上除去上陶瓷片和下陶瓷片材，以露出金属化通孔的上表面和下表面。

公开(公告)号：WO2007101800A3

公开(公告)日：2007-12-06

申请号：PCT/EP2007051801

申请日：2007-02-26

Applicant: SIEMENS AG ,  SEDLMEIER PETER ,  ZETTELMEIER KARL

Inventor： SEDLMEIER PETER ,  ZETTELMEIER KARL

IPC: H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0272 ,  H05K3/42 ,  H05K9/0041 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09063 ,  H05K2201/09609

Abstract: Disclosed is an arrangement in which the inner walls of the holes of a printed circuit board are incorporated into the electromagnetic shield in order to allow heat exchanging media to penetrate therethrough.

Abstract translation: 在这种布置中，一个印刷电路板的热交换的流动的开口的内壁包括在电磁屏蔽装置。

公开(公告)号：WO2007073572A3

公开(公告)日：2007-08-16

申请号：PCT/ZA2006000148

申请日：2006-12-19

Applicant: VAN HEERDEN LEON NAUDE

Inventor： VAN HEERDEN LEON NAUDE

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/116 ,  H05K1/0287 ,  H05K3/3447 ,  H05K2201/09609 ,  H05K2201/09718

Abstract: The invention provides a circuit board for prototyping having a grid of pads, each pad including a non- conductive substrate defining an aperture or through-hole for receiving a wire or a lead of a component, and a conductive area that encloses the aperture, and a trace that electrically connects the pad to an adjacent pad, with the conductive area that encloses the aperture being spaced away from the aperture so as to define a surrounding, intermediate non-conductive zone between the aperture and the conductive area . The invention also provides a method of manufacturing said circuit board.

Abstract translation: 本发明提供了一种用于具有栅格网格的原型设计的电路板，每个焊盘包括限定用于接纳部件的导线或引线的孔或不透气的基板，以及封闭所述孔的导电区域，以及 将焊盘电连接到相邻焊盘的​​迹线，其中包围孔径的导电区域与孔径间隔开，以便在孔和导电区域之间限定环绕的中间非导电区域。 本发明还提供一种制造所述电路板的方法。

公开(公告)号：WO2007073572A2

公开(公告)日：2007-06-28

申请号：PCT/ZA2006/000148

申请日：2006-12-19

Applicant: VAN HEERDEN, Leon, Naudé

Inventor： VAN HEERDEN, Leon, Naudé

CPC classification number: H05K1/116 ,  H05K1/0287 ,  H05K3/3447 ,  H05K2201/09609 ,  H05K2201/09718

Abstract: The invention provides a circuit board having a plurality of pads, each pad including a non-conductive substrate defining an aperture for receiving a wire or a lead of a component, and a conductive area that encloses the aperture, and a trace that electrically connects the pad to an adjacent pad, with the conductive area that encloses the aperture being spaced away from the aperture so as to define a surrounding, intermediate non-conductive zone between the aperture and the conductive area. The invention also provides a method of manufacturing said circuit board.

Abstract translation: 本发明提供了一种具有多个焊盘的电路板，每个焊盘包括限定用于接收元件的导线或引线的孔的非导电衬底，以及封闭孔的导电区域，以及电连接 衬垫到相邻的衬垫，其中包围孔的导电区域与孔隔开，以便在孔和导电区域之间限定环绕的中间非导电区域。 本发明还提供一种制造所述电路板的方法。

公开(公告)号：WO2007047891A2

公开(公告)日：2007-04-26

申请号：PCT/US2006/040977

申请日：2006-10-20

Applicant: MCKINZIE, William, E., III

Inventor： MCKINZIE, William, E., III

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

Abstract translation: 用于宽带抑制印刷电路板上的噪声的混合电磁带隙（EBG）结构包括通过串联电感互连到电网中的共面贴片阵列，以及将共面贴片连接到第二导电平面的相应阵列的分流LC网络。 串联电感和并联谐振通孔的组合降低了基波阻带的截止频率。 串联电感和分流电容可以使用表面贴装元件技术或印刷迹线实现。 补片也可以通过共面耦合传输线相互连接。 可以通过在与传输线相对布置的第二导电平面中形成槽，降低截止频率并增加基带阻带的带宽来增加耦合线的偶模和奇模阻抗。 共面EBG结构可以集成到用于宽带抑制电磁噪声的印刷线路板的配电网络中。