公开(公告)号：EP1204696A1

公开(公告)日：2002-05-15

申请号：EP00950780.7

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供至少部分涂覆的纤维束，其包含多个玻璃纤维，所述玻璃纤维在至少一个所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供了树脂相容涂料组合物的用途，该组合物包含：（a）由选自非热膨胀性有机材料，无机聚合材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒， 平均粒度足以使纤维束湿润的颗粒; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 该树脂相容性涂料组合物还可以包含：（a）多个中空的非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：EP1204613A1

公开(公告)日：2002-05-15

申请号：EP00948977.4

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

公开(公告)号：EP1066224A1

公开(公告)日：2001-01-10

申请号：EP99909593.8

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  ROBERTSON, Walter, J. ,  VELPARI, Vedagiri

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/47 ,  C08J5/08 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands coated and impregnated with greater than 20 weight percent of inorganic particle fillers which are useful for reinforcing composites.

Abstract translation: 本发明提供涂覆并浸渍有大于20重量％的无机颗粒填料的玻璃纤维股，所述无机颗粒填料可用于增强复合材料。

公开(公告)号：EP1060145A1

公开(公告)日：2000-12-20

申请号：EP99908458.5

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  ROBERTSON, Walter, J. ,  VELPARI, Vedagiri ,  WU, Xiang

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: C03C25/32 ,  C03C25/28 ,  C03C25/42 ,  H05K1/0366 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands coated with non-hydratable, inorganic solid lubricant particles useful for reinforcing composites such as laminated electronic supports.

公开(公告)号：EP1060143A1

公开(公告)日：2000-12-20

申请号：EP99908440.3

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  ROBERTSON, Walter, J. ,  WU, Xiang

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/47 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2203/127

Abstract: The present invention provides methods for inhibiting abrasive wear of glass fiber strands by providing a layer of inorganic solid lubricant particles to surfaces of the glass fibers in sliding contact with hard surface asperities of solid objects, such as portions of winding, twisting, weaving and knitting devices.

公开(公告)号：EP1030543A1

公开(公告)日：2000-08-23

申请号：EP00103237.4

申请日：2000-02-17

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Echigo, Fumio ,  Kawakita, Yoshihiro

IPC: H05K1/03

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: The present invention provides a nonwoven fabric material prepared from short fibers (1) including thermal-resistant synthetic fibers bound with an inorganic binder (2), a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder (2) is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.

Abstract translation: 本发明提供一种由短纤维（1）制成的非织造织物材料，其包括与无机粘合剂（2）结合的耐热合成纤维，预浸料和使用其的电路板。 电路板即使在高温下也具有优异的尺寸稳定性，并且防止电路板翘曲或被吸湿等损坏。 无机粘合剂（2）是由低熔点玻璃溶液或分散在其中的至少包含纤维或低熔点玻璃颗粒的水分散性胶体溶液形成的残渣。 当使用粘合剂时，形成通过硅氧烷键合的化学共价键合。

公开(公告)号：EP0836229A3

公开(公告)日：1999-06-02

申请号：EP97305828.2

申请日：1997-08-01

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Saia, Richard Joseph ,  Durocher, Kevin Matthew ,  Cole, Herbert Stanley

IPC: H01L23/538 ,  H01L25/16

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/19 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/162 ,  H05K1/167 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/0315 ,  H05K2203/0361 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method for fabricating a flexible interconnect film includes applying a resistor layer (16,18) over one or both surfaces of a dielectric film (10); applying a metallization layer (22) over the resistor layer with the resistor layer including a material facilitating adhesion of the dielectric film and the metallization layer; applying a capacitor dielectric layer (24a) over the metallization layer; and applying a capacitor electrode layer (26a) over the capacitor dielectric layer. The capacitor electrode layer is patterned to form a first capacitor electrode; the capacitor dielectric layer is patterned; the metallization layer is patterned to form a resistor (28); and the metallization layer and the resistor layer are patterned to form an inductor (33) and a second capacitor electrode. In one embodiment, the dielectric film includes a polyimide, the resistor layer includes tantalum nitride, and the capacitor dielectric layer includes amorphous hydrogenated carbon or tantalum oxide. If the resistor and metallization layers are applied over both surfaces of the dielectric film, passive components can be fabricated on both surfaces of the dielectric film. The dielectric film can have vias therein with the resistor and metallization layers extending through the vias. A circuit chip can be attached and coupled to the passive components by metallization patterned through vias in an additional dielectric layer.

公开(公告)号：EP0907199A2

公开(公告)日：1999-04-07

申请号：EP98118551.5

申请日：1998-10-01

Applicant: HITACHI, LTD.

Inventor： Nishiki, Masashi ,  Satoh, Ryohei ,  Taniguchi, Yuzo ,  Suzuki, Shigeaki ,  Kawai, Michifumi ,  Ijuin, Masahito ,  Yabushita, Akira ,  Fukushima, Makoto ,  Murase, Tomohiko

IPC: H01J9/02 ,  H01J17/49

CPC classification number: H05K3/062 ,  H01J9/02 ,  H01J11/12 ,  H01J11/22 ,  H01J11/24 ,  H01J2211/225 ,  H05K3/04 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2203/025 ,  H05K2203/107

Abstract: A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.

公开(公告)号：EP0451500B1

公开(公告)日：1997-11-19

申请号：EP91103285.2

申请日：1991-03-05

Applicant: International Business Machines Corporation

Inventor： Lauffer, John Matthew ,  Schumacher, Richard Anthony

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10S257/916 ,  Y10T29/435

公开(公告)号：EP0409668A3

公开(公告)日：1991-11-21

申请号：EP90308039.8

申请日：1990-07-23

Applicant: OMRON CORPORATION

Inventor： Kawai, Wakahiro ,  Kita, Motohiro ,  Matsuda, Katsumi

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K1/162 ,  H05K1/167 ,  H05K3/06 ,  H05K3/20 ,  H05K3/429 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/09763 ,  H05K2203/0152 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/072

Abstract: The invention provides a mixed circuit board comprising a heat-resistant insulating substrate (16) and at least one laminated sheet (10,20) bonded integrally to at least one side of the substrate (16), the laminated sheet (10,20) comprising a metal oxide dielectric film (13), a metal resistor film (12) formed on the dielectric film (13) and a pair of metal conductor layers (11,15) between which the dielectric film (13) and resistor (12) film are sandwiched. A method for fabricating the mixed circuit board is also described.