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    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
    243.
    发明公开
    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME 审中-公开

    公开(公告)号：US20240138077A1

    公开(公告)日：2024-04-25

    申请号：US18271544

    申请日：2021-04-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

    CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

    Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

    Catalyzed metal foil and uses thereof
    244.
    发明授权
    Catalyzed metal foil and uses thereof 有权

    公开(公告)号：US11877404B2

    公开(公告)日：2024-01-16

    申请号：US17208890

    申请日：2021-03-22

    Applicant: AVERATEK CORPORATION

    Inventor： Shinichi Iketani

    IPC: H05K3/46 ,  H05K3/06 ,  H05K3/00 ,  H05K3/18

    CPC classification number: H05K3/4652 ,  H05K3/0041 ,  H05K3/062 ,  H05K3/185 ,  H05K2201/0358 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/0582 ,  H05K2203/06

    Abstract: Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

    Method of fabricating a circuit board structure having an embedded electronic element
    249.
    发明授权
    Method of fabricating a circuit board structure having an embedded electronic element 有权
    制造具有嵌入式电子元件的电路板结构的方法

    公开(公告)号：US09433108B2

    公开(公告)日：2016-08-30

    申请号：US14097597

    申请日：2013-12-05

    Applicant: Unimicron Technology Corporation

    Inventor： Yung-Ching Lin ,  Chih-Kuie Yang ,  Ta-Han Lin

    IPC: H05K3/46 ,  H05K1/18

    CPC classification number: H05K3/4647 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2203/1189 ,  Y10T29/49155

    Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.

    Abstract translation: 公开了一种用于制造具有至少嵌入式电子元件的电路板结构的方法，其包括以下步骤：提供基板并且将基板中的至少一个电子元件嵌入到所述基板中，所述基板具有活性表面和所述电子元件的多个电极焊盘 元件从所述基板的表面露出; 在所述电子元件的电极焊盘上形成多个导电凸块; 并且用电介质层和层叠在电介质层上的金属层覆盖基板的表面和电子元件的有源面，其中，导体凸块穿透电介质层以与金属层接触，从而简化 制造工艺，降低制造成本，节省制造时间。

    Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby
    250.
    发明授权
    Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby 有权
    低介电树脂组合物，树脂膜，预浸料，由此制成的印刷电路板

    公开(公告)号：US09403981B2

    公开(公告)日：2016-08-02

    申请号：US14732121

    申请日：2015-06-05

    Applicant: ELITE MATERIAL CO., LTD.

    Inventor： Chen Yu Hsieh

    IPC: C08L7/02 ,  C08L77/06 ,  H05K1/03 ,  C08G73/10 ,  C08L79/08

    CPC classification number: C08L77/06 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1082 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5399 ,  C08L23/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

    Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

    Abstract translation: 一种树脂组合物，其包含（A）聚酰亚胺树脂; （B）预聚合的马来酰亚胺树脂; （C）热固性树脂; 和（D）阻燃剂。 用于合成聚酰亚胺树脂的反应物包括酸酐和二胺，二胺包括4,4'-二氨基二苯基甲烷及其类似化合物和聚醚二胺。 树脂组合物具有以下优点：由树脂组合物制成的树脂膜或预浸料包含由特定结构的二胺和预聚合的马来酰亚胺树脂合成的聚酰亚胺树脂，以获得令人满意的电路层压材料的特性， 例如低介电常数，低损耗因数，高耐热性和高粘合性，以用于制造金属包覆层压板和印刷电路板。

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