公开(公告)号：US20160120017A1

公开(公告)日：2016-04-28

申请号：US14919357

申请日：2015-10-21

Applicant: JX NIPPON MINING & METALS CORPORATION

Inventor： HAJIME MOMOI ,  SATORU MORIOKA ,  TOSHIYUKI ONO ,  HIDETA ARAI ,  RYO FUKUCHI ,  ATSUSHI MIKI

IPC: H05K1/02 ,  H05K7/20 ,  H01R13/03 ,  B32B38/10 ,  B32B15/01 ,  B32B15/04 ,  B32B15/20 ,  H01L23/373 ,  B32B3/26

CPC classification number: B32B15/20 ,  B32B3/263 ,  B32B7/12 ,  B32B15/01 ,  B32B15/043 ,  B32B15/08 ,  B32B15/18 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B37/02 ,  B32B38/10 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/538 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/20 ,  B32B2457/202 ,  C22C9/06 ,  C25D3/12 ,  C25D3/38 ,  C25D7/06 ,  C25D7/0614 ,  C25D9/08 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H01M4/662 ,  H01R13/03 ,  H05K1/0204 ,  H05K1/09 ,  H05K3/025 ,  H05K3/108 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/0358 ,  H01L2924/00

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.

Abstract translation: 提供具有令人满意的散热性能的铜散热材料。 铜散热材料在一个或两个表面上具有包含选自Cu，Co，Ni，W，P，Zn，Cr，Fe，Sn和Mo中的至少一种金属的合金层，其中，一个或两个表面的表面粗糙度Sz 通过激光显微镜使用波长为405nm的激光测量的两个表面为5μm以上。

公开(公告)号：US09144157B2

公开(公告)日：2015-09-22

申请号：US13813678

申请日：2011-07-28

Applicant: Hiroto Iida

Inventor： Hiroto Iida

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42 ,  H05K3/38

CPC classification number: H05K3/06 ,  H05K1/0298 ,  H05K3/386 ,  H05K3/421 ,  H05K3/425 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09563

Abstract: Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method. To achieve the object, a method for forming the wiring pattern adopted includes steps; for forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 μm or less and thickness of 5 μm or less is laminated to a conductive layer via an insulating layer; for providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; for filling-up the blind-hole by a electro-plated copper in the time for depositing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 15 μm or less, for providing of an etching resist layer having thickness of 15 μm or less and for etching of the copper layer.

Abstract translation: 本发明的目的在于提供一种制造印刷电路板的方法，该印刷电路板能够以低成本和高产率进行精细的布线形成而不引入任何专用设备，以及通过该方法制造的印刷线路板。 为了实现该目的，用于形成布线图案的方法包括步骤： 为了形成具有这样的结构的层压体，其中使用铜箔形成的铜箔层，在不具有表面粗糙度（Rzjis）的2μm以下且厚度为5μm以下的表面粗糙度（Rzjis）的情况下，通过经由 绝缘层; 用于提供由穿孔铜箔层和绝缘层的孔构成的盲孔; 以及由层叠体中的导电层构成的底部; 在电镀铜层的表面上沉积电镀铜层的时间，通过电镀铜填充盲孔，使得设置在绝缘层15上的铜层的总厚度 μm以下，用于提供厚度为15μm以下的蚀刻抗蚀剂层和蚀刻铜层。

公开(公告)号：US20150079343A1

公开(公告)日：2015-03-19

申请号：US14387272

申请日：2013-03-25

Applicant: Sumitomo Electric Fine Polymer, Inc.

Inventor： Makoto Nakabayashi ,  Kazuaki Ikeda

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/092 ,  Y10T428/24355 ,  Y10T428/249974

Abstract: The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).

Abstract translation: 本发明提供一种氟树脂基材，其具有主要由氟树脂组成的介电层，并形成在金属导体上，充分抑制了回流时的翘曲发生，并且能够表现出足够突出的高频特性 介电层包括中空玻璃珠; 具有2.0μm以下的表面粗糙度Rz的金属导体的氟树脂基板; 以0.01〜500kGy的曝光剂量照射电离辐射的氟树脂的氟树脂基材; 以及具有氟树脂为聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种或两种以上的氟树脂基材。

公开(公告)号：US20150064493A1

公开(公告)日：2015-03-05

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: H05K1/03 ,  B32B15/20 ,  B32B7/02 ,  H05K1/05 ,  H05K1/09

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，满足等式1：（f3×t3）/（f2×t2）=> 1其中t2（mm）是铜箔的厚度，f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，等式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）是铜箔和树脂层之间的180°剥离强度，F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度，其中以5〜100μg/ dm 2的涂布量形成Cr氧化物层。 形成在不层叠树脂层的铜箔的表面上。

公开(公告)号：US20140218909A1

公开(公告)日：2014-08-07

申请号：US14133822

申请日：2013-12-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ariyoshi TETSUO ,  Cheon Ho PARK ,  Jong Pil WON ,  Ji Hoon YUN ,  Jun Ho JUNG

IPC: F21K99/00 ,  H01L33/58 ,  H01L27/15

CPC classification number: F21K9/64 ,  F21K9/27 ,  F21K9/65 ,  F21K9/69 ,  F21V5/02 ,  F21V5/043 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/38 ,  H01L33/44 ,  H01L2224/13 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/0256 ,  H05K1/189 ,  H05K3/107 ,  H05K3/305 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0358 ,  H05K2201/0376 ,  H05K2201/09154 ,  H05K2201/098 ,  H05K2201/10106 ,  H05K2203/0139 ,  H05K2203/025 ,  H01L2924/00014

Abstract: A light source module including a substrate, a plurality of light emitting devices installed on the substrate, and a plurality of lenses installed on the substrate to cover the plurality of light emitting devices, respectively, and each of the plurality of lenses having a pair of open end portions facing one another, the plurality of lenses arranged such that an open end portion of one lens faces an opened end portion of an adjacent lens is provided.

Abstract translation: 一种光源模块，包括基板，安装在基板上的多个发光装置，以及分别安装在基板上以覆盖多个发光装置的多个透镜，并且多个透镜中的每一个具有一对 所述多个透镜被设置为使得一个透镜的开口端部面向相邻透镜的开口端部。

公开(公告)号：US08642181B2

公开(公告)日：2014-02-04

申请号：US11574165

申请日：2005-08-19

Applicant: Jitsuo Oishi ,  Shuta Kihara ,  Ko Kedo ,  Takakiyo Mine

Inventor： Jitsuo Oishi ,  Shuta Kihara ,  Ko Kedo ,  Takakiyo Mine

IPC: B32B15/08 ,  B32B9/00

CPC classification number: H05K3/386 ,  B32B7/12 ,  C09J179/08 ,  H05K1/0274 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/2054 ,  Y10T428/12569 ,  Y10T428/2949 ,  Y10T428/2962 ,  Y10T428/31681

Abstract: The present invention provides a metal-clad white laminate including: a white resin layer which is composed of a resin composition obtained by mixing a polyimide having a repeating unit as represented by a particular chemical structural formula with a white pigment; and at least one metal layer, the white resin layer being an adhesive layer for the metal layer. The metal-clad white laminate of the present invention uses a white resin composition which has high reflectance and whiteness and excellent light resistance, and is easy to be reduced in thickness and weight.

Abstract translation: 本发明提供一种金属包覆白色层压体，其包括：白色树脂层，其由通过将具有由特定化学结构式表示的重复单元的聚酰亚胺与白色颜料混合而获得的树脂组合物组成; 和至少一个金属层，所述白色树脂层是用于所述金属层的粘合剂层。 本发明的金属包覆白色层叠体使用白色树脂组合物，其具有高反射率和白度以及优异的耐光性，并且易于降低厚度和重量。

公开(公告)号：US08614155B2

公开(公告)日：2013-12-24

申请号：US12860117

申请日：2010-08-20

Applicant: Dylan Joseph Boday ,  Joseph Kuczynski

Inventor： Dylan Joseph Boday ,  Joseph Kuczynski

IPC: B32B17/02 ,  B32B15/04 ,  C08F290/14 ,  C08F283/00 ,  C08G61/02 ,  C08G65/48 ,  C08G14/04 ,  C08G63/18 ,  C08G65/38

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract translation: 用于印刷电路板（PCB）层压板的增强型预浸料包括基材和施加到基材上的树脂。 该树脂包括可固化聚合物和具有主链的聚合引发剂聚合物，所述主链具有自由基引发剂形成段，其经受热而分裂以产生多种不挥发性起始物质。 在制备PCB层压板的所有加工步骤期间，该树脂组合物消除了自由基引发剂可能的挥发性损失。 树脂可另外包括交联剂，阻燃剂和粘度调节剂。 在一个实施方案中，用树脂浸渍玻璃纤维片，随后干燥或固化。 玻璃布基材可以包括将树脂偶联到基材上的硅烷偶联剂。 在另一个实施方案中，通过将树脂施加到铜上并随后固化树脂来制备树脂涂覆的铜（RCC）。

公开(公告)号：US20130192655A1

公开(公告)日：2013-08-01

申请号：US13798805

申请日：2013-03-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Henry L. Edwards ,  Kenneth J. Maggio ,  Steven Kummerl ,  Sreenivasan K. Koduri

IPC: H01L35/28 ,  H01L29/02

CPC classification number: H01L35/28 ,  H01L21/568 ,  H01L23/38 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L29/02 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/12042 ,  H05K1/0203 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2201/10219 ,  H01L2924/00

Abstract: A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds.

Abstract translation: 具有硬热键的嵌入式热电元件的电路板。 一种在电路板中嵌入热电装置并形成硬热键的方法。

公开(公告)号：US08357859B2

公开(公告)日：2013-01-22

申请号：US12523127

申请日：2008-01-16

Applicant: Hiroaki Wakabayashi ,  Noriyuki Ohigashi

Inventor： Hiroaki Wakabayashi ,  Noriyuki Ohigashi

IPC: H05K1/00

CPC classification number: H05K3/4655 ,  C08F220/18 ,  C08L33/064 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/12 ,  Y10T428/264 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31786 ,  Y10T428/31935

Abstract: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

Abstract translation: 公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层 金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。 本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂 。

公开(公告)号：US08188375B2

公开(公告)日：2012-05-29

申请号：US11603884

申请日：2006-11-22

Applicant: Kenichi Kawabata ,  Takaaki Morita

Inventor： Kenichi Kawabata ,  Takaaki Morita

IPC: H05K1/16

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。