公开(公告)号：WO2008051853A3

公开(公告)日：2009-05-07

申请号：PCT/US2007081964

申请日：2007-10-19

Applicant: STAKTEK GROUP LP ,  PARTRIDGE JULIAN ,  SZEWERENKO LELAND ,  WEHRLY JAMES DOUGLAS JR

Inventor： PARTRIDGE JULIAN ,  SZEWERENKO LELAND ,  WEHRLY JAMES DOUGLAS JR

IPC: H01L41/083

CPC classification number: H01L25/0657 ,  H01L23/5387 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/90 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00

Abstract: A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die (8) to a substrate (4) opposite a first die (6) bonded to the substrate (4). The second die (8) is bonded using heat conducted through the first die (6) to the substrate (4), and optionally through an underfill material. The first (6) and second (8) die are connected such that bumps (10) are connected to common bonding pads (12) on the substrate (4). Bumps (10) on one of the die extend through openings in the substrate (4) to connect to the common bonding pads (12). The bonding pads (12) are within the perimeter of the first die (6).

Abstract translation: 一种用于使用热压粘合或热超声键合来组装双模集成电路封装的系统和方法，用于将第二裸片（8）与与衬底（4）相对的第一裸片（6）相对的衬底（4）结合。 第二模具（8）使用通过第一模具（6）传导的热量与基板（4）结合，并且任选地通过底部填充材料粘结。 第一（6）和第二（8）管芯被连接成使得凸块（10）连接到衬底（4）上的公共接合焊盘（12）。 其中一个模具上的凸起（10）延伸穿过基板（4）中的开口，以连接到公共接合焊盘（12）。 接合焊盘（12）在第一管芯（6）的周边内。

公开(公告)号：WO2007136917A2

公开(公告)日：2007-11-29

申请号：PCT/US2007064407

申请日：2007-03-20

Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  SZEWERENKO LELAND ,  ROPER DAVID L

Inventor： WEHRLY JAMES DOUGLAS JR ,  SZEWERENKO LELAND ,  ROPER DAVID L

IPC: G06F17/50 ,  H01L23/12 ,  H01L23/495 ,  H01L25/00 ,  H03K19/00 ,  H03K19/177 ,  H04N3/14

CPC classification number: H05K1/181 ,  H01L23/4985 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10545 ,  H05K2201/10689 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A system and method for combining a leaded package IC (12) and a semiconductor die (14) using a flex circuitry (20). The leaded packaged IC (12) is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC (12) contacts the surface of the flex circuitry (20). The semiconductor die (14) is disposed beneath the leaded package IC (12) and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry (20) and is attached to a conductive layer of the flex circuitry (20). In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers (20M1, 20M2).

Abstract translation: 一种用于使用柔性电路（20）组合引线封装IC（12）和半导体管芯（14）的系统和方法。 引线封装IC（12）沿柔性电路的正面设置。 在优选实施例中，引线封装IC（12）的主体的下表面接触柔性电路（20）的表面。 半导体管芯（14）设置在引线封装IC（12）的下方，并且在优选实施例中，设置在通过柔性电路（20）的至少一部分的窗口中，并连接到柔性导体的导电层 电路（20）。 在其他实施例中，半导体管芯附接到引线封装IC的主体。 柔性电路优选地采用至少两个导电层（20M1,20M2）。

公开(公告)号：WO2007001505A2

公开(公告)日：2007-01-04

申请号：PCT/US2006006935

申请日：2006-02-27

Applicant: STAKTEK GROUP LP ,  CADY JAMES W ,  GOODWIN PAUL

Inventor： CADY JAMES W ,  GOODWIN PAUL

IPC: H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：GB2453064A

公开(公告)日：2009-03-25

申请号：GB0822086

申请日：2005-08-12

Applicant: STAKTEK GROUP LP

Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11

Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

公开(公告)号：GB0822086D0

公开(公告)日：2009-01-07

申请号：GB0822086

申请日：2005-08-12

Applicant: STAKTEK GROUP LP

IPC: G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

公开(公告)号：FR2878118A1

公开(公告)日：2006-05-19

申请号：FR0508522

申请日：2005-08-11

Applicant: STAKTEK GROUP LP

Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

IPC: H05K1/18 ,  G11C5/00 ,  G11C5/04 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K7/20

Abstract: Selon l'invention, un module de circuit comprend :(a) un substrat rigide ayant deux faces latérales opposées et un bord ;(b) un circuit souple enveloppé autour du bord du substrat rigide, le circuit souple ayant un premier côté et un second côté, une portion du circuit souple étant attachée à l'une au moins des faces latérales opposées du substrat rigide, le circuit souple ayant une pluralité de contacts adaptés en vue d'une connexion à une prise d'une carte à circuits, la pluralité de contacts étant disposés à proximité du bord du substrat rigide sur le côté extérieur du circuit souple ; et(c) une pluralité de boîtiers-puces de mémoires montés sur l'un au moins des premier et second côtés du circuit souple.

公开(公告)号：CA2515714A1

公开(公告)日：2006-03-03

申请号：CA2515714

申请日：2005-08-11

Applicant: STAKTEK GROUP LP

Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

IPC: H05K1/00 ,  G11C5/00 ,  H01L23/36 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

Abstract: Flexible circuitry is populated with integrated circuits (ICs) disposed alo ng one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is dispose d about an edge of a rigid, thermally-conductive substrate thus placing the integrat ed circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermall y conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

公开(公告)号：HK1121287A1

公开(公告)日：2009-04-17

申请号：HK09100449

申请日：2009-01-16

Applicant: STAKTEK GROUP LP

Inventor： RAPPORT RUSSELL ,  GOODWIN PAUL ,  CADY JAMES W

IPC: H01L20100101

Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

公开(公告)号：GB2452880A

公开(公告)日：2009-03-18

申请号：GB0822085

申请日：2005-08-12

Applicant: STAKTEK GROUP LP

Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRELY JAMES DOUGLAS JR

IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A circuit module comprises a rigid thermally conductive substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The substrate 14 has a thermal extension 16T, preferably at the edge opposite the contacts, to assist in the dissipation of heat from the CSPs. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer.

公开(公告)号：DE102005038254A1

公开(公告)日：2006-03-23

申请号：DE102005038254

申请日：2005-08-12

Applicant: STAKTEK GROUP LP

Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JUN JAMES DOUGLAS

IPC: G11C5/02 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.