公开(公告)号：KR1020010062439A

公开(公告)日：2001-07-07

申请号：KR1020000076708

申请日：2000-12-14

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 키타노타카히로 ,  모리카와마사테루 ,  에사키유키히코 ,  이시자카노부카즈 ,  코가노리히사 ,  타케시타카즈히로 ,  오오쿠마히로후미 ,  아키모토마사미

IPC: H01L21/027

CPC classification number: H01L21/6715 ,  B05B12/20 ,  B05B13/041 ,  B05C5/0212 ,  B05C5/0216 ,  B05C5/0291 ,  B05C11/1039

Abstract: PURPOSE: A device for forming a coating film is provided to facilitate the washing of mask members, which are installed in a device forming a coating film of an uniform film thickness onto a substrate and cover the surface of the substrate other than an area on which the coating film is formed, and to suppress the enlargement of the device. CONSTITUTION: The device for forming a coating film on a substrate includes a substrate holding portion for holding the substrate; a coating solution nozzle(3), provided to face the substrate held by the substrate holding portion, for discharging a coating solution to the substrate; a drive mechanism for moving the coating solution nozzle(3) along a surface of the substrate relatively with respect to the substrate while the coating solution is being discharged to the surface of the substrate from the coating solution nozzle; a mask unit(4) covering a portion other than a coating film formation area of the substrate(W) and including a mask member(41) for catching the coating solution from the coating solution nozzle(3), and a cleaning mechanism, provided in the mask unit(4), for cleaning a coating film adhering to the mask member(41).

Abstract translation: 目的：提供一种用于形成涂膜的装置，以便于将安装在形成均匀膜厚的涂膜的装置中的掩模构件的清洗放在基板上并覆盖基板的除了 形成涂膜，并且抑制装置的放大。 构成：在基板上形成涂膜的装置包括：用于保持基板的基板保持部; 涂布溶液喷嘴（3），设置成面对由所述基板保持部保持的所述基板，用于将涂布溶液排出到所述基板; 驱动机构，用于当所述涂布溶液从所述涂布溶液喷嘴排出到所述基材的表面时，使所述涂布溶液喷嘴（3）沿着所述基板的表面相对于所述基板移动; 覆盖基板（W）的涂膜形成区域以外的部分的掩模单元（4），并且包括用于从涂布溶液喷嘴（3）捕获涂布溶液的掩模构件（41），以及清洁机构 在掩模单元（4）中，用于清洁附着在掩模构件（41）上的涂膜。

公开(公告)号：KR1020010051688A

公开(公告)日：2001-06-25

申请号：KR1020000067623

申请日：2000-11-15

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 기타노다카히로 ,  고바야시신지 ,  에사키유키히코 ,  모리카와마사테루

IPC: H01L21/027

CPC classification number: H01L21/6715

Abstract: PURPOSE: A device and a method for treating substrate are provided to remove the swelling of a coating liquid due to the surface tension formed on the outer peripheral part of a substrate in a coating. CONSTITUTION: A projected parts(72a) corresponding to the outer peripheral part of the wafer(W) and projected to the under side compared to the other part are provided on the back surface of a straightening plate(72) provided in a drying device(33). The velocity of air flow generated in a treating chamber(S) when evacuating is increased in the peripheral part of the wafer(W) because the gap between the wafer(W) and the projected parts(72a) is made narrower. As a result, the swelling of the coating liquid on the peripheral part of the wafer(W) which is generated in the coating, is swept away and removed by the air flow.

Abstract translation: 目的：提供一种用于处理基板的装置和方法，以消除由于在涂层中在基板的外周部分上形成的表面张力引起的涂布液的溶胀。 构成：设置在干燥装置（20）的矫正板（72）的背面，设有与其他部分相比较的与晶片（W）的外周部相对应且投影到下侧的突出部（72a） 33）。 由于晶片（W）和突出部（72a）之间的间隙较窄，所以在排出的处理室（S）中产生的空气流的速度在晶片（W）的周边部分增加。 结果，在涂层中产生的晶片（W）的周边部分上的涂布液的膨胀被空气流扫除并除去。

公开(公告)号：KR1020000006275A

公开(公告)日：2000-01-25

申请号：KR1019990022851

申请日：1999-06-18

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 기타노타카히로 ,  모리카와마사테루 ,  아키모토마사미 ,  타케시타가즈히로

IPC: H01L21/027

CPC classification number: H01L21/6715 ,  B05C5/0216 ,  B05C11/08 ,  G03F7/162

Abstract: PURPOSE: A film forming apparatus and a film fabrication method are provided to prevent a stream of a resist solution. CONSTITUTION: The film forming apparatus comprises: a substrate maintaining part for maintaining a substrate(1) to be processed; a nozzle unit(2) disposed so as to oppose the substrate maintaining part, wherein the nozzle unit(2) has a discharge opening for successively applying a solution(3) onto the substrate maintained by the substrate maintaining part in a thin stream shape; and a deposition drive equipment for relatively driving the substrate maintaining part and the nozzle unit and for performing a film formation while discharging the solution with the thin stream shape and depositing on a non-process substrate.

Abstract translation: 目的：提供一种成膜装置和膜制造方法，以防止抗蚀剂溶液流。 构成：成膜装置包括：用于保持待处理的基板（1）的基板保持部; 喷嘴单元（2），其设置成与所述基板保持部相对，其中，所述喷嘴单元（2）具有排出口，用于将由所述基板保持部保持的所述基板上的溶液（3）依次施加到薄流的形状; 以及用于相对驱动基板保持部分和喷嘴单元并用于在以薄流形状排出溶液的同时进行成膜并沉积在非处理基板上的沉积驱动设备。