公开(公告)号：KR1020110077042A

公开(公告)日：2011-07-07

申请号：KR1020090133496

申请日：2009-12-30

Applicant: 삼성전자주식회사

Inventor： 박민영 ,  문영준 ,  한현주 ,  허균 ,  장경운 ,  홍상일 ,  백동석

IPC: H05K3/14 ,  H05K3/30

CPC classification number: H05K3/321 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/09436 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49165 ,  H05K3/14 ,  H05K3/30

Abstract: PURPOSE: A method of making printed circuit board assembly is provided to attach a component to the printed circuit board without using solder, thereby saving expenses by simplifying a process. CONSTITUTION: A conductive layer is formed by applying a first ink(30) including an electric conductor. The component is settled in order to touch the conductive layer with an electrode(50) of a component(60) on a base board which is formed the conductive layer. The component is bonded on the base board which is formed the conductive layer by solidifying the conductive layer. The conductive layer is formed by applying the first ink on the base board in an ink-jet printer method. Solidifying the conductive layer is performed by adding high temperature heat to the conductive layer.

Abstract translation: 目的：提供一种制造印刷电路板组件的方法，以将组件附接到印刷电路板而不使用焊料，从而通过简化工艺节省费用。 构成：通过施加包括电导体的第一墨（30）形成导电层。 为了在形成导电层的基板上的部件（60）的电极（50）与导电层接触来构成部件。 该部件通过使导电层固化而结合在形成导电层的基板上。 导电层通过在喷墨打印机方法中在基板上施加第一墨水而形成。 通过向导电层添加高温热来进行导电层的固化。

公开(公告)号：KR1020110052931A

公开(公告)日：2011-05-19

申请号：KR1020090109682

申请日：2009-11-13

Applicant: 삼성전자주식회사

Inventor： 김광수 ,  홍순민 ,  허균

IPC: G02B7/04 ,  H04N5/232

CPC classification number: H01H19/585 ,  G03B3/10 ,  G03B5/00 ,  G03B2217/002 ,  H03K17/965 ,  H03K2217/94063 ,  H03K2217/94068 ,  G02B7/04 ,  H04N5/232

Abstract: PURPOSE: A zoom switch assembly, image photographing apparatus with the same, and zoom lens control method are provided to detect the location of a rotation member or a knob by a conduction method. CONSTITUTION: A zoom switch assembly(1) for an image photographing apparatus comprises a fixing member(2), a rotation member(3), a conduction unit(41), and a location detection pattern. The fixing member comprises a flat unit(11). The rotation member can rotate on the fixing member. The conduction unit is installed in the rotation member. The conduction unit rotates if the rotation member rotates. The location detection pattern is selectively conductive according to the rotation angle of the conduction unit.

Abstract translation: 目的：提供一种变焦开关组件，具有相机的摄像装置和变焦镜头控制方法，以通过传导方法检测旋转部件或旋钮的位置。 构成：用于图像拍摄装置的变焦开关组件（1）包括固定构件（2），旋转构件（3），导电单元（41）和位置检测图案。 固定构件包括平坦单元（11）。 旋转构件可以在固定构件上旋转。 导通单元安装在旋转构件中。 如果旋转构件旋转，则传导单元旋转。 位置检测图案根据导电单元的旋转角度选择性地导电。

公开(公告)号：KR1020090024946A

公开(公告)日：2009-03-10

申请号：KR1020070089940

申请日：2007-09-05

Applicant: 삼성전자주식회사

Inventor： 최익성 ,  정현중 ,  김영기 ,  강신철 ,  홍순민 ,  장세영 ,  진재철 ,  허균

IPC: H05K5/00 ,  H05K7/14

CPC classification number: H05K1/0284 ,  H04M1/0249 ,  H05K3/185 ,  H05K2201/0999 ,  H05K2203/107

Abstract: A method for setting up the part within the appearance case of the electronic device is provided to minimize the size of the electronic product. The electronic device(10) using the LDS is comprised of the upper appearance case(11) and the lower appearance case(12). The resin(30) for LDS is attached within the lower appearance case by the double injection and insert injection. The parts of the electronic device are successively mounted in the resin for LDS. The antenna(90), the earphone jack(50), the RXD, the other hardware component etc are equipped In the lower appearance case. The miniaturized printed circuit board(60) is mounted and connected to upper and lower appearance case.

Abstract translation: 提供了一种用于在电子设备的外观情况下设置部件的方法，以最小化电子产品的尺寸。 使用LDS的电子设备（10）由上部外壳（11）和下部外壳（12）组成。 用于LDS的树脂（30）通过双重注射和插入注入附接在较低外观的情况下。 电子设备的部件依次安装在用于LDS的树脂中。 天线（90），耳机插孔（50），RXD，其他硬件组件等都配备在外观较差的情况下。 小型化印刷电路板（60）安装并连接到上下外壳。

公开(公告)号：KR1020210068356A

公开(公告)日：2021-06-09

申请号：KR1020210071117

申请日：2021-06-01

Applicant: 삼성전자주식회사

Inventor： 홍순민 ,  김규화 ,  윤정근 ,  이택모 ,  허균 ,  문영준 ,  장경운

IPC: H01L27/12 ,  H01L27/15 ,  H01L29/786 ,  H01L21/768

公开(公告)号：KR102151099B1

公开(公告)日：2020-09-02

申请号：KR1020190075904

申请日：2019-06-25

Applicant: 삼성전자주식회사

Inventor： 장경운 ,  박원순 ,  손동명 ,  신상민 ,  이창준 ,  정영기 ,  조성필 ,  허균 ,  홍순민

IPC: H01L25/075 ,  H01L27/12 ,  H01L23/538

公开(公告)号：KR101417783B1

公开(公告)日：2014-07-11

申请号：KR1020070094519

申请日：2007-09-18

Applicant: 삼성전자주식회사

Inventor： 허균 ,  문영준 ,  홍순민 ,  장세영 ,  최익성

IPC: H05K5/00

Abstract: 본 발명에 따른 전자기기용 케이스는 도체로 이루어진 판상의 회로선과, 회로선에 고정되는 전자부품을 포함하며, 전자부품이 고정된 상기 회로선이 케이스의 내면에 직접 고정 설치되어 패턴을 형성하게 되므로, 대규모의 설비 없이도 내면에 패턴을 형성할 수 있어 제조원가를 절감할 수 있게 되는 효과가 있다.

公开(公告)号：KR1020100008717A

公开(公告)日：2010-01-26

申请号：KR1020080069320

申请日：2008-07-16

Applicant: 삼성전자주식회사

Inventor： 김정웅 ,  허균 ,  장세영

IPC: H05K3/46 ,  H05K3/18

CPC classification number: H05K3/321 ,  H05K3/429 ,  H05K3/4644

Abstract: PURPOSE: A printed circuit board assembly and a manufacturing method thereof are provided to minimize contaminant by attaching an electronic component to a substrate or film with adhesive. CONSTITUTION: A first substrate assembly(101) includes a plurality of devices(113a-113c). A plurality of devices are attached to a film(111). A via hole is formed on the film. A plating layer is formed on the via hole. A solder bump is formed on the plating layer. A second substrate assembly includes at least one film layer and a circuit pattern layer. The circuit pattern layer is formed on one side or both sides of the film layer. A plurality of devices are connected to the circuit pattern layer through the plating layer. The plating layer is connected to the circuit pattern layer by the solder bump.

Abstract translation: 目的：提供一种印刷电路板组件及其制造方法，以通过用粘合剂将电子部件附接到基板或膜来最小化污染物。 构成：第一基板组件（101）包括多个装置（113a-113c）。 多个装置附接到薄膜（111）。 在膜上形成通孔。 在通孔上形成镀层。 在镀层上形成焊料凸块。 第二基板组件包括至少一个膜层和电路图案层。 电路图案层形成在膜层的一侧或两侧。 多个器件通过镀层连接到电路图案层。 镀层通过焊料凸块连接到电路图案层。