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公开(公告)号：US20180337313A1
公开(公告)日：2018-11-22
申请号：US16047734
申请日：2018-07-27
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Chun-Hua SHIH , Yih-Hua RENN
CPC classification number: H01L33/508 , H01L33/483 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2933/0041
Abstract: A light-emitting device includes a light-emitting element, a wavelength conversion layer, a light pervious element and a light-reflecting enclosure. The light-emitting element includes a top surface, a bottom surface, and a side surface between the top surface and the bottom surface. The wavelength conversion layer covers the top surface of the light-emitting element, and includes a plurality of wavelength conversion particles having an equivalent particle diameter D50. The light pervious element includes a recess structure and an outer wall. The light-reflecting enclosure surrounds the outer wall. The D50 of the wavelength conversion particles is not great than 10 μm. The recess structure is laterally overlapped with the side surface of the light-emitting element and the wavelength conversion layer.
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公开(公告)号：US20180151783A1
公开(公告)日：2018-05-31
申请号：US15864485
申请日：2018-01-08
Applicant: EPISTAR CORPORATION
Inventor： Ching-Tai CHENG , Yih-Hua RENN , Chun-Hua SHIH
CPC classification number: H01L33/52 , H01L33/44 , H01L33/50 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0091
Abstract: A light-emitting device includes a light-emitting element, a cover layer, and an anti-adhesion layer. The light-emitting element has a top surface, a bottom surface and a side surface. The cover layer covers the light-emitting element and includes a first transparent binder. The anti-adhesion layer includes a flouro-resin or a fluoride compound and disposed on the cover layer and the top surface as an outermost layer of the light-emitting device. The anti-adhesion layer has a hardness greater than a hardness of the cover layer.
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公开(公告)号：US20240421277A1
公开(公告)日：2024-12-19
申请号：US18741956
申请日：2024-06-13
Applicant: EPISTAR CORPORATION
Inventor： Min-Hsun HSIEH , Ying-Yang SU , Chien-Chih CHEN , Wei-Shan HU , Ching-Tai CHENG , Chung-Che TENG , Tai-Ni CHU , Hsin-Mao LIU
IPC: H01L33/62 , H01L25/075
Abstract: A pixel structure includes a first light-emitting diode for emitting a first light, wherein the first light-emitting diode has a first semiconductor layer, a first light-emitting surface, and a first electrode under the first semiconductor layer away from the first light-emitting surface; a second light-emitting diode for emitting a second light, wherein the second light-emitting diode has a second semiconductor layer, a second light-emitting surface, and a second electrode under the second semiconductor layer away from the second light-emitting surface; a dielectric layer surrounding and contacting the first semiconductor layer and the second light-emitting diode and exposing the first light-emitting surface, the first electrode, the second light-emitting surface and the second electrode; a common conductive structure having a semiconductor layer and a metal layer; and a light-transmitting conductive layer covering and electrical connecting the first light-emitting diode, the second light-emitting diode and the common conductive structure.
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公开(公告)号：US20240420988A1
公开(公告)日：2024-12-19
申请号：US18740907
申请日：2024-06-12
Applicant: EPISTAR CORPORATION
Inventor： Chien-Chih CHEN , Wei-Shan HU , Ching-Tai CHENG
Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a carrier, a first semiconductor device, a second semiconductor device, a first adhesive portion, and a second adhesive portion. The first semiconductor device and the second semiconductor device are separately arranged on the carrier. The first adhesive portion and the second adhesive portion are separately arranged on the carrier, the first adhesive portion is located between the first semiconductor device and the carrier, and the second adhesive portion is located between the second semiconductor device and the carrier. In the cross-sectional view, the first adhesive portion includes an inclined sidewall, and the inclined sidewall is adjacent to the carrier and forms an interior angle greater than 90 degrees to the carrier.
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Patent Agency Ranking
公开(公告)号：US20230207540A1
公开(公告)日：2023-06-29
申请号：US18082199
申请日：2022-12-15
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor： Min-Hsun HSIEH , Hsin-Mao LIU , Tzu-Hsiang WANG , Ya-Wen LIN , Chi-Chih PU , Hsiao-Pei CHIU , Ching-Tai CHENG , Chong-Yu WANG
IPC: H01L25/13 , H01L25/075 , H01L33/54 , H01L33/58 , H01L33/62
CPC classification number: H01L25/13 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/62
Abstract: A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.
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公开(公告)号：US20220328734A1
公开(公告)日：2022-10-13
申请号：US17850549
申请日：2022-06-27
Applicant: Epistar Corporation
Inventor： Tsung-Hong LU , Ching-Tai CHENG
Abstract: A light-emitting device comprises a light-emitting element, a covering structure, a quantum dot material block, and an adhesive structure is disclosed. The covering structure has a depressed part. The quantum dot material block is filled into the depressed part and enclosed by the light-emitting element and the covering structure. The light-emitting element, the covering structure, and the quantum dot material block are bonded together through the adhesive structure. Since the quantum dot material block is enclosed by the covering structure and the light-emitting element, the outer moisture and oxygen are blocked by the covering structure and the light-emitting element from the quantum dot material block, the decreasing emitting efficiency of the quantum dot material is further alleviated.
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公开(公告)号：US20210050478A1
公开(公告)日：2021-02-18
申请号：US16539539
申请日：2019-08-13
Applicant: EPISTAR CORPORATION
Inventor： Ying-Yong SU , Hsin-Mao LIU , Wei-Shan HU , Ching-Tai CHENG
Abstract: The light-emitting diode package includes a plurality of bumps being a couple corresponding to each other. Each of the bumps has a first part and a second part placed under the first part, and a gap is formed between the bumps in a period-repeating wriggle shape or an irregular wriggle shape. Accordingly, the distance between the bumps of the light-emitting diode package is small, which results in a less stress being concentrated at the space between the bumps, as a result, a crack is difficultly caused by the stress to the light-emitting diode package. In other words, the structural strength between the bumps and the covering part is enhanced. Still, while being manufactured, the yield rate of the light-emitting diode package is also improved since there is almost no crack to reduce the yield rate.
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公开(公告)号：US20180159004A1
公开(公告)日：2018-06-07
申请号：US15827549
申请日：2017-11-30
Applicant: EPISTAR CORPORATION
Inventor： Lung-Kuan LAI , Ching-Tai CHENG , Yih-Hua RENN , Min-Hsun HSIEH , Chun-Hung LIU , Shih-An LIAO , Ming-Chi HSU , Yu Chen LIAO
CPC classification number: H01L33/60 , G02B6/0051 , G02B6/0073 , H01L25/0753 , H01L33/385 , H01L33/46 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/18 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.
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公开(公告)号：US20170077364A1
公开(公告)日：2017-03-16
申请号：US15260469
申请日：2016-09-09
Applicant: EPISTAR CORPORATION
Inventor： Yih-Hua RENN , Ching-Tai CHENG , Chun-Hua SHIH
CPC classification number: H01L33/508 , H01L33/502 , H01L33/62 , H01L2933/0041 , H01L2933/0066
Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting element has a top surface, a bottom surface, a side surface, and a first electrical contact formed on the bottom surface. The distance between the top surface and the bottom surface has a first height (h1). The wavelength conversion layer has a first area (A1) located on the top surface of the light-emitting element and a second area (A2) located on the side surfaces and surrounding the first area. The first area has a second height (h2). The second area has a third height (h3) and a second width (w2). The second height (h2) is greater than the second width (w2). The difference of the third height and the sum of the first height and the second height is less than 15 μm.
Abstract translation: 发光装置包括发光元件和波长转换层。 发光元件具有顶表面，底表面，侧表面和形成在底表面上的第一电触点。 顶表面和底表面之间的距离具有第一高度（h1）。 波长转换层具有位于发光元件顶表面上的第一区域（A1）和位于侧表面上且围绕第一区域的第二区域（A2）。 第一个区域有第二个高度（h2）。 第二区域具有第三高度（h3）和第二宽度（w2）。 第二高度（h2）大于第二宽度（w2）。 第一高度和第二高度的第三高度和总和的差小于15μm。
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