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    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
    22.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF 审中-公开

    公开(公告)号：US20190109111A1

    公开(公告)日：2019-04-11

    申请号：US16196315

    申请日：2018-11-20

    Applicant: EPISTAR CORPORATION

    Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

    IPC: H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

    Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

    LIGHT EMITTING BULB
    25.
    发明申请
    LIGHT EMITTING BULB 有权

    公开(公告)号：US20220252228A1

    公开(公告)日：2022-08-11

    申请号：US17724021

    申请日：2022-04-19

    Applicant: EPISTAR CORPORATION

    Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

    IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
    27.
    发明申请
    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM 审中-公开

    公开(公告)号：US20200243737A1

    公开(公告)日：2020-07-30

    申请号：US16748860

    申请日：2020-01-22

    Applicant: EPISTAR CORPORATION

    Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

    IPC: H01L33/62 ,  H01L33/60 ,  H01L25/075

    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
    28.
    发明申请
    METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM 审中-公开

    公开(公告)号：US20200243478A1

    公开(公告)日：2020-07-30

    申请号：US16551764

    申请日：2019-08-27

    Applicant: EPISTAR CORPORATION

    Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

    IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

    LIGHT EMITTING BULB
    29.
    发明申请
    LIGHT EMITTING BULB 审中-公开

    公开(公告)号：US20190154209A1

    公开(公告)日：2019-05-23

    申请号：US16258281

    申请日：2019-01-25

    Applicant: EPISTAR CORPORATION

    Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

    IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

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