公开(公告)号：SG47174A1

公开(公告)日：1998-03-20

申请号：SG1996010551

申请日：1996-08-26

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY D ,  KOSBAR LAURA L

IPC: B32B27/16 ,  B32B27/00 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：DE69220163T2

公开(公告)日：1997-12-18

申请号：DE69220163

申请日：1992-09-04

Applicant: IBM

Inventor： BABICH EDWARD D ,  GALLIGAN EILEEN A ,  GELORME JEFFREY D ,  MCGOUEY RICHARD P ,  NUNES SHARON L ,  PARASZCZAK JURIJ R ,  SERINO RUSSELL J ,  WITMAN DAVID F

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/038 ,  G03F7/075 ,  H01L21/027 ,  H01L21/30

公开(公告)号：DE68927735D1

公开(公告)日：1997-03-13

申请号：DE68927735

申请日：1989-11-21

Applicant: IBM

Inventor： BROWN LAWRENCE M ,  GELORME JEFFREY D ,  KUCZYNSKI JOSEPH P ,  LAWRENCE WILLIAM H

IPC: C08F2/50 ,  C08G59/00 ,  C08G59/18 ,  G03F7/038 ,  G03F7/20 ,  H05K3/00 ,  H05K3/28

Abstract: Cationic curable photoresists are patterned by exposing such to a laser beam in a pattern, followed by developing.

公开(公告)号：BR9612770A

公开(公告)日：1999-12-07

申请号：BR9612770

申请日：1996-09-12

Applicant: IBM

Inventor： AFZALI-ARDANKI ALI ,  GELORME JEFFREY D ,  KOSBAR LAURA L

IPC: B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03 ,  C08H5/02

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：DE69402232D1

公开(公告)日：1997-04-30

申请号：DE69402232

申请日：1994-01-14

Applicant: IBM

Inventor： BUNSVOLD WILLIAM R ,  CONLEY WILLARD E ,  GELORME JEFFREY D ,  WOOD ROBERT L ,  LINEHAN LEO L ,  SOORIYAKUMARAN RATNAM ,  TAI TSONG-LIN

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/30 ,  G03F7/38 ,  H01L21/027

Abstract: Improved chemically amplified negative tone microlithographic resist compositions and methods for the use thereof are disclosed. The compositions comprise, in admixture, a crosslinking agent, a polymeric binder, and a compound that generates acid upon exposure of the resist composition to imaging radiation. The invention is particularly related to compositions having a crosslinking agent which does not plasticize the polymeric binder or alternatively does not reduce the glass transition temperature thereof. This minimizes the diffusion of the acid component from exposed regions of the resist to unexposed regions, and helps maintain relief image dimensional control.

公开(公告)号：CA2184761A1

公开(公告)日：1997-03-19

申请号：CA2184761

申请日：1996-09-04

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY D ,  KOSBAR LAURA L

IPC: B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03 ,  C08L1/00 ,  C08K5/07 ,  H01B1/20

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：DE68907559T2

公开(公告)日：1994-02-17

申请号：DE68907559

申请日：1989-10-21

Applicant: IBM

Inventor： ANGELO RAYMOND W ,  GELORME JEFFREY D ,  KUCZYNSKI JOSEPH P ,  LAWRENCE WILLIAM H ,  PAPPAS SOCRATES P ,  SIMPSON LOGAN L

IPC: C07C381/12 ,  C08G59/00 ,  C08G59/18 ,  C08G59/68 ,  G03F7/029

Abstract: Sulfonium salts of the formula: wherein Ar is a fused aromatic radical; R1 is a divalent organic bridge; each R2 and R3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided that not more than one of R2 and R3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

公开(公告)号：DE68907559D1

公开(公告)日：1993-08-19

申请号：DE68907559

申请日：1989-10-21

Applicant: IBM

Inventor： ANGELO RAYMOND W ,  GELORME JEFFREY D ,  KUCZYNSKI JOSEPH P ,  LAWRENCE WILLIAM H ,  PAPPAS SOCRATES P ,  SIMPSON LOGAN L

IPC: C07C381/12 ,  C08G59/00 ,  C08G59/18 ,  C08G59/68 ,  G03F7/029

Abstract: Sulfonium salts of the formula: wherein Ar is a fused aromatic radical; R1 is a divalent organic bridge; each R2 and R3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided that not more than one of R2 and R3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

公开(公告)号：CA1301698C

公开(公告)日：1992-05-26

申请号：CA496012

申请日：1985-11-22

Applicant: IBM

Inventor： GELORME JEFFREY D ,  LAWRENCE WILLIAM H ,  SLOTA PETER JR

IPC: C08J7/00 ,  C08J7/12 ,  C23C18/22 ,  H05K3/18 ,  H05K3/38 ,  H05K3/10

Abstract: ROUGHENING SURFACE OF A SUBSTRATE The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface. The resinouse material can be thermoplastic or thermosetting, particularly those useful in preparing dielectric substrates employed in the preparation of integrated circuit modules. Inorganic particulate materials such as SiO2, CaCO3, Al2 O3, CaO2, SiC and CaF2, can be used, the preferred material being silica (SiO2). The preferred etching processes are the so-called "dry etching processes" such as plasma etching, sputter etching and reactive ion etching; which eliminate the need for wet chemical processing and all the attendant problems thereof. This roughening process results in greatly enhanced adhesion of the photosensitive materials to dielectric substrates.

公开(公告)号：CA1289803C

公开(公告)日：1991-10-01

申请号：CA517037

申请日：1986-08-28

Applicant: IBM

Inventor： GELORME JEFFREY D ,  COX ROBERT J ,  GUTIERREZ SERGIO A R

IPC: G03F7/004 ,  C08G59/00 ,  C08G59/68 ,  G03F7/027 ,  G03F7/038 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28 ,  G03C1/72

Abstract: PHOTORESIST COMPOSITION AND PRINTED CIRCUIT BOARDS AND PACKAGES MADE THEREWITH A photocurable composition which is useful as a permanent resist in the manufacture of printed circuit boards and packages of such boards comprises a multifunctional epoxidized resin, a reactive diluent, a cationic photoinitiator and, optionally, an exposure indicator, a coating aid and a photosensitizer. EN985050