公开(公告)号：DE69806542T2

公开(公告)日：2003-03-20

申请号：DE69806542

申请日：1998-04-27

Applicant: IBM

Inventor： KNICKERBOCKER JOHN ULRICH ,  KNOX ANDREW RAMSAY ,  ROSENBERG ROBERT ,  HUMENIK JAMES N

IPC: H01F7/02 ,  H01F41/16 ,  H01J29/68 ,  H01F41/02

公开(公告)号：CA1308817C

公开(公告)日：1992-10-13

申请号：CA593138

申请日：1989-03-08

Applicant: IBM

Inventor： BAISE ARNOLD I ,  CASEY JON A ,  CLARKE DAVID R ,  DIVAKARUNI RENUKA S ,  DUNKEL WERNER E ,  HUMENIK JAMES N ,  KANDETZKE STEVEN M ,  KIRBY DANIEL P ,  KNICKERBOCKER JOHN U ,  MATTS AMY T ,  TAKACS MARK A ,  WIGGINS LOVELL B

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  H01L23/14

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength. FI9-86-046

公开(公告)号：CA1182583A

公开(公告)日：1985-02-12

申请号：CA404031

申请日：1982-05-28

Applicant: IBM

Inventor： DOUGHERTY WILLIAM E ,  FEINBERG IRVING ,  HUMENIK JAMES N ,  PLATT ALAN

IPC: H01L27/04 ,  H01G2/06 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/10 ,  H01L27/108 ,  H01G1/035 ,  H01G1/14

Abstract: THIN FILM DISCRETE DECOUPLING CAPACITOR A decoupling capacitor for mounting on an integrated circuit multi-layer ceramic. A bottom layer electrode, is evaporated or sputtered onto a carrier. A high dielectric layer is deposited followed by the upper metallurgy and a top isolating layer. Via holes are etched to respective electrode layers, ball limiting metalization deposited thereon followed by solder balls. The electrode is mounted onto the substrate, solder balls face down in contact with a compatible footprint.