公开(公告)号：DE102006023123A1

公开(公告)日：2007-01-11

申请号：DE102006023123

申请日：2006-05-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SIMBUERGER WERNER ,  KIENMAYER CHRISTOPH ,  PRESSEL KLAUS

IPC: H01L25/04 ,  G01S7/03 ,  H01L23/36 ,  H01L23/498 ,  H01L23/66 ,  H01L49/02 ,  H01P3/08 ,  H01P11/00 ,  H01Q1/38

Abstract: A semiconductor module with components (6) for high-frequency operation in a plastic housing comprises a main surface (8) on top of a housing mass (10) and at least one active side (11) of a semiconductor chip with a multilayer connection rail structure (13) on the main surface comprising alternating insulation (16,17) and structured metal (14,15) layers. At least one of the insulation and/or housing mass comprises a highest frequency isolation region. Independent claims are also included for the following: (A) A module as above having a cooling body; (B) Production processes for the modules as above; (C) Distance-determining radar for a motor vehicle; (D) Satellite navigation apparatus; (E) A transponder;and (F) A motor vehicle comprising the above.

公开(公告)号：DE50303585D1

公开(公告)日：2006-07-06

申请号：DE50303585

申请日：2003-04-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LANGENBERG JOERG ,  LIEBERMANN THOMAS ,  SIMBUERGER WERNER ,  TIEBOUT MARC ,  WOHLMUTH HANS-DIETER

IPC: H03D7/14

公开(公告)号：DE10259338A8

公开(公告)日：2004-11-04

申请号：DE10259338

申请日：2002-12-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAKALSKI WINFRIED ,  SIMBUERGER WERNER ,  KNAPP HERBERT ,  WOHLMUTH HANS-DIETER

IPC: H03F3/195 ,  H03F3/26 ,  H04B1/04 ,  H04B1/02 ,  H04Q7/32

公开(公告)号：DE10127351A1

公开(公告)日：2002-12-19

申请号：DE10127351

申请日：2001-06-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KREUPL FRANZ ,  SIMBUERGER WERNER ,  HOENLEIN WOLFGANG ,  KLOSE HELMUT

IPC: H01L25/18 ,  H01L21/60 ,  H01L23/485 ,  H01L25/065 ,  H01L25/07 ,  H01L23/50 ,  B82B1/00

Abstract: Electronic chip (101) comprises several external contacts (103) of which at least two are provided with a number of nano-tubes for purposes of contacting an external contact (106) of another electronic chip (102) with several external contacts. Also claimed is an arrangement (100) of two electronic chips (101, 102) of which one (101) is provided with nano-tubes.