公开(公告)号：SG186360A1

公开(公告)日：2013-01-30

申请号：SG2012092243

申请日：2011-06-30

Applicant: LAM RES CORP

Inventor： KOLICS ARTUR ,  LEE WILLLIAM T ,  REDEKER FRITZ

Abstract: A method of making an electronic device which in one embodiment comprises providing a substrate, electrolessly depositing a barrier metal at least on portions of the substrate, and using wet chemistry such as electroless deposition to deposit a substantially gold-free wetting layer having solder wettability onto the barrier metal. An electronic device which in one embodiment comprises a metallization stack. The metallization stack comprises a barrier metal deposited electrolessly and a substantially gold-free wetting layer deposited on the barrier metal, and the wetting layer is wettable by solder.

公开(公告)号：SG177912A1

公开(公告)日：2012-02-28

申请号：SG2011094984

申请日：2007-12-12

Applicant: LAM RES CORP

Inventor： BRIGHT NICOLAS ,  HEMKER DAVID ,  REDEKER FRITZ ,  DORDI YEZDI

Abstract: PROCESS INTEGRATION SCHEME TO LOWER OVERALL DIELECTRIC CONSTANT IN BEOL INTERCONNECT STRUCTURESAbstractBack-End of Line (BEoL) interconnect structures, and methods for their manufacture, are provided. The structures are characterized by narrower conductive lines and reduced overall dielectric constant values. Conformal diffusion barrier layers, and selectively formed capping layers, are used to isolate the conductive lines and vias from surrounding dielectric layers in the interconnect structures. The methods of the invention employ techniques to narrow the openings in photoresist masks in order to define narrower vias. More narrow vias increase the amount of misalignment that can be tolerated between the vias and the conductive linesFigure: 9B

公开(公告)号：IL161550A

公开(公告)日：2010-12-30

申请号：IL16155004

申请日：2004-04-21

Applicant: LAM RES CORP ,  LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

Inventor： LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: C25D5/22 ,  C25D7/12 ,  H01L21/00

Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

公开(公告)号：PL374502A1

公开(公告)日：2005-10-31

申请号：PL37450203

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.