公开(公告)号：DE102005012398A1

公开(公告)日：2006-06-01

申请号：DE102005012398

申请日：2005-03-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： JAEGER HARALD ,  WINTER MATTHIAS

IPC: G02B5/08 ,  F21V7/22 ,  H01L33/58 ,  H01L33/60

Abstract: An optical reflector (1) contains a moulded ceramic material, which is UV stable. The material is a duroplast ceramic material, and contains aluminium oxide or zirconium dioxide.

公开(公告)号：DE102004014207A1

公开(公告)日：2005-10-13

申请号：DE102004014207

申请日：2004-03-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ZEILER MARKUS ,  BRUNNER HERBERT ,  HOEFER THOMAS ,  BOGNER GEORG ,  WINTER MATTHIAS

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01S5/022 ,  H01L33/00

Abstract: An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

公开(公告)号：DE10350707A1

公开(公告)日：2004-11-11

申请号：DE10350707

申请日：2003-10-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： STEIN WILHELM ,  FEHRER MICHAEL ,  BAUR JOHANNES ,  WINTER MATTHIAS ,  PLOESL ANDREAS ,  KAISER STEPHAN ,  HAHN BERTHOLD ,  EBERHARD FRANZ

IPC: H01L31/0224 ,  H01L33/32 ,  H01L33/40 ,  H01S5/02 ,  H01S5/323 ,  H01L33/00

Abstract: The electrical contact of optoelectronic semiconductor chip (1) has a mirror layer (2), a protective layer (3), a barrier layer (4), an adhesion medium layer (5) and a solder layer (8). The mirror layer contains metal or metal alloy. The protective layer reduces corrosion of mirror layer. The mirror layer contains silver, aluminum or platinum. The protective layer contains titanium or platinum. The barrier layer contains titanium-tungsten nitride (TiW (N)). The adhesion medium layer contains titanium. An independent claim is included for manufacture electrical contact.