公开(公告)号：US20060118511A1

公开(公告)日：2006-06-08

申请号：US11003067

申请日：2004-12-02

Applicant: Timothy Beerling ,  Marco Aimi

Inventor： Timothy Beerling ,  Marco Aimi

IPC: G01D15/00

CPC classification number: B01L3/0262 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2400/0487 ,  B81B1/004 ,  B81B2201/057 ,  B81B2201/058 ,  B81B2203/0353 ,  H01H11/02 ,  H01H2029/008 ,  Y10T428/24273 ,  Y10T428/2902

Abstract: A micro-machined nozzle includes a substrate having a hole formed on a first side that extends partially through a thickness dimension of the substrate and a nozzle orifice formed on a second opposite side that communicates with the hole. The nozzle orifice has at least a portion of its interior wall serrated. A method of fabricating a micro-machined nozzle includes the steps of etching a first side of a silicon substrate to form a hole that extends partially through a thickness dimension of the substrate and etching a second opposite side of the silicon substrate to form a serrated nozzle orifice that communicates with the hole.

Abstract translation: 微加工喷嘴包括：基板，其具有形成在第一侧上的部分地延伸穿过基板的厚度尺寸的孔;以及形成在与孔连通的第二相对侧上的喷嘴孔。 喷嘴孔具有其内壁的至少一部分锯齿状。 一种制造微加工喷嘴的方法包括以下步骤：蚀刻硅衬底的第一面以形成部分延伸穿过衬底的厚度尺寸并蚀刻硅衬底的第二相对侧以形成锯齿状喷嘴的孔 孔与孔连通。

公开(公告)号：US11957059B2

公开(公告)日：2024-04-09

申请号：US17294152

申请日：2019-11-15

Applicant: Xaar Technology Limited

Inventor： Andrew Vella ,  Peter Mardilovich

IPC: H01L41/053 ,  B41J2/14 ,  B41J2/16 ,  B81B3/00 ,  H10N30/00 ,  H10N30/20 ,  H10N30/853 ,  H10N30/87 ,  H10N30/88

CPC classification number: H10N30/883 ,  B41J2/14201 ,  B41J2/1623 ,  B41J2/1628 ,  B81B3/0021 ,  H10N30/10516 ,  H10N30/2047 ,  H10N30/8554 ,  H10N30/8561 ,  H10N30/871 ,  B81B2201/057 ,  B81B2203/04

Abstract: The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an insulated electrical component for a microelectromechanical systems device comprising: i) a substrate layer comprising first and second sides spaced apart in a thickness direction; ii) one or more electrical elements arranged over the first side of the substrate layer, wherein each of the one or more electrical elements comprises: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a continuous insulating layer, or laminate of insulating layers, arranged to overlie each of the one or more electrical elements arranged on the first side of the substrate layer; and iv) a passivation layer, or laminate of multiple passivation layers, disposed adjacent to, and at least partially overlying, each of the one or more electrical elements so as to provide electrical passivation between the first and second electrodes of each of the one or more electrical elements; wherein: a) the passivation layer, or at least an innermost layer of the laminate of multiple passivation layers which is disposed adjacent each of the one or more underlying electrical elements, is discontinuous; and/or b) the laminate of multiple passivation layers is recessed at a side which faces away from each of the underlying electrical elements, wherein a recess is provided in a region overlying each of the one or more electrical elements, such that the laminate of passivation layers is thinner in a thickness direction across the recess compared to other non-recessed regions of the laminate of passivation layers.

公开(公告)号：US11707738B2

公开(公告)日：2023-07-25

申请号：US16954140

申请日：2018-12-14

Applicant: Indian Institute of Science

Inventor： Jatin Panwar ,  Rahul Roy ,  Usama Ahmed Abbasi ,  Prakhar Jain ,  Viswanathan Kumaran

IPC: B01L3/00 ,  B81B1/00 ,  B81C1/00 ,  G01N15/10

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L3/502761 ,  B81B1/006 ,  B81C1/00119 ,  G01N15/1031 ,  G01N15/1056 ,  B01L2200/0647 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0887 ,  B81B2201/057 ,  B81B2203/0338 ,  B81B2203/04

Abstract: The present disclosure provides a microfluidic device comprising a set of micro-structured electrodes. The electrodes are made of a fusible alloy such as Field's Metal and are patterned on a layer of PDMS. The molten fusible alloy is poured over the patterned PDMA layer and a suction force is applied to ensure uniformity of flow of the molten metal. A second layer comprising a flow channel orthogonal to the direction of the micro-structured electrodes is disposed under the first layer to form the microfluidic device. The device shows enhanced sensitivity to RBC detection at high frequencies that are also bio-compatible (above 2 MHz). Multiple layers of the micro-structures electrodes can be sandwiched between layers of flow channels to provide a 3D microfluidic device.

公开(公告)号：US20230142172A1

公开(公告)日：2023-05-11

申请号：US17911096

申请日：2021-03-12

Applicant: Japan Science and Technology Agency

Inventor： Takasi NISISAKO

IPC: B01F33/3012 ,  B01F33/30 ,  B01F33/3011 ,  B01F35/00 ,  B01F25/314 ,  B01F23/41 ,  B01F23/232 ,  B81B1/00

CPC classification number: B01F33/3012 ,  B01F33/30351 ,  B01F33/3011 ,  B01F35/561 ,  B01F25/31432 ,  B01F23/4143 ,  B01F23/2323 ,  B81B1/006 ,  B01F2215/0431 ,  B81B2201/057 ,  B81B2203/0338

Abstract: A microdroplet/bubble-generating device comprising a slit and a row of a plurality of microflow paths is constructed, in such a manner that either a continuous phase or dispersion phase is supplied to the slit, and so that the end of the slit, the other supply port for the continuous phase or dispersion phase and the liquid recovery port are connected. The plurality of microflow paths each have a narrow part where the cross-sectional area of the flow channel is locally narrowed adjacent to or near the connection point between the slit and the microflow path. The continuous phase and dispersion phase that have met at the connection points flow into the narrow parts, and the dispersion phase is sheared at the narrow parts with the continuous phase flow as the driving force, forming droplets or gas bubbles of the dispersion phase. The product is recovered from the liquid recovery port.

公开(公告)号：US20170246611A1

公开(公告)日：2017-08-31

申请号：US15444010

申请日：2017-02-27

Applicant: SMARTTIP BV

Inventor： Edin Sarajlic

IPC: B01J19/08 ,  C01B21/068 ,  B81C1/00

CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling.For batch-wise production, the method comprises after a step of providing the layer of first material and before the step of ion beam milling, providing a second layer of a second material on the layer of first material, providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of pits in the first layer, and subjecting the second layer of the second material to said step of ion beam milling at an angle using said second layer of the second material as a shadow mask.

公开(公告)号：US20050079711A1

公开(公告)日：2005-04-14

申请号：US10683247

申请日：2003-10-10

Applicant: Heinz Busta

Inventor： Heinz Busta

IPC: B01L3/02 ,  B41J2/14 ,  B41J2/16 ,  B81B1/00 ,  B81B3/00 ,  H01L21/302 ,  H01L21/461

CPC classification number: B01L3/0255 ,  B01L2200/12 ,  B01L2300/0809 ,  B01L2400/0487 ,  B41J2/14 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B81B1/008 ,  B81B2201/057 ,  B81B2201/058 ,  B81C1/00111

Abstract: This invention provides tip assemblies and arrays of tip assemblies useful for nanoscale fluid delivery. The invention also provides methods of fabricating tip assemblies.

Abstract translation: 本发明提供了用于纳米流体输送的尖端组件和尖端组件阵列。 本发明还提供了制造尖端组件的方法。

公开(公告)号：US11958049B2

公开(公告)日：2024-04-16

申请号：US17276167

申请日：2019-09-20

Applicant: ASTREGO DIAGNOSTICS AB

Inventor： Johan Öhman ,  Martin Lovmar ,  Lovisa Söderberg ,  Mikael Olsson

IPC: B01L3/00 ,  B81B1/00 ,  G01N35/10

CPC classification number: B01L3/502746 ,  B01L3/50273 ,  B81B1/006 ,  G01N35/1011 ,  B01L2200/0621 ,  B01L2300/02 ,  B01L2300/0645 ,  B01L2300/0848 ,  B01L2300/087 ,  B01L2400/0487 ,  B81B2201/057 ,  B81B2203/0338

Abstract: A sample loading cartridge (1) for a microfluidic device comprises a cartridge body (10) with a sample reservoir (20) configured to house a volume of a liquid sample (3) and a sample port (30) in connection with the sample reservoir (20). The cartridge (1) also comprises an output channel (40) extending from the sample reservoir (20) and a feedback channel (50) connected to the sample reservoir (20) and to the sample port (30). The cartridge body (10) comprises a detection portion (60) aligned with the feedback channel (50) to enable detection of any sample (3) in the feedback channel (50). The flow resistance of the feedback channel (50) is lower than the flow resistance of the output channel (40) to cause liquid sample (3) received in the sample port (30) to enter the feedback channel (50) with substantially no liquid sample (3) entering the output channel (40).

公开(公告)号：US20230191406A1

公开(公告)日：2023-06-22

申请号：US18074142

申请日：2022-12-02

Applicant: CYTESI, INC.

Inventor： Tung-Yu WU ,  Tang-Hung PO ,  CHUNG-YI WANG

IPC: B01L3/00 ,  B81B7/00 ,  B01L7/00

CPC classification number: B01L3/50273 ,  B01L7/54 ,  B81B7/0096 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2400/0427 ,  B81B2201/057

Abstract: There is provided a heating device to independently and/or effectively heat the micro objects manipulated by a micro apparatus/system, for example the droplets of fluids in an electrowetting on dielectric EWOD device of a microfluidic apparatus. The heating device may include a plurality of micro heaters arranged in an array of rows and columns, and the micro heaters of the heating device may be disposed in relative to the electrode elements of the EWOD device, respectively. Therefore, the micro heaters of the heating device may heat one of the electrode elements of the EWOD device, thereby preventing thermal effect of the micro object on the other electrode elements.

公开(公告)号：US20170247243A1

公开(公告)日：2017-08-31

申请号：US15443898

申请日：2017-02-27

Applicant: UNIVERSITEIT TWENTE

Inventor： Johan Willem Berenschot ,  Niels Roelof Tas

IPC: B81B1/00 ,  B81C1/00

CPC classification number: B81B1/004 ,  B81B2201/057 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/0361 ,  B81B2203/0369 ,  B81C1/00087 ,  B81C1/00111 ,  B81C2201/0132

Abstract: A method of manufacturing a plurality of through-holes (132) in a layer of material by subjecting the layer to directional dry etching to provide through-holes (132) in the layer of material; For batch-wise production, the method comprises after a step of providing a layer of first material (220) on base material and before the step of directional dry etching, providing a plurality of holes at the central locations of pits (210), etching base material at the central locations of the pits (210) so as to form a cavity (280) with an aperture (281), depositing a second layer of material (240) on the base material in the cavity (280), and subjecting the second layer of material (240) in the cavity (280) to said step of directional dry etching using the aperture (281) as the opening (141) of a shadow mask.

公开(公告)号：US20170144438A1

公开(公告)日：2017-05-25

申请号：US15354864

申请日：2016-11-17

Applicant: SEIKO EPSON CORPORATION

Inventor： Masumi HAYAKAWA ,  Takashi KATO

IPC: B41J2/14 ,  B81C3/00 ,  B81B7/00

CPC classification number: B41J2/1433 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2002/14241 ,  B41J2002/14362 ,  B41J2002/14491 ,  B81B7/0006 ,  B81B2201/052 ,  B81B2201/057 ,  B81B2203/0315 ,  B81B2207/056 ,  B81B2207/07 ,  B81C3/001 ,  B81C2203/037

Abstract: A wiring structure includes a connecting terminal array formed on a first substrate and a connected terminal array formed on a second substrate, which are electrically connected, wherein a dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, and an anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal.