公开(公告)号：US20080291602A1

公开(公告)日：2008-11-27

申请号：US11753090

申请日：2007-05-24

Applicant: Daniel Devoe

Inventor： Daniel Devoe

IPC: H01G4/232 ,  B23P19/00

CPC classification number: H01G4/232 ,  H01G4/38 ,  H01G13/006 ,  H05K1/0203 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10469 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10659 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/53174

Abstract: A capacitor device, which is mountable on a substrate, has an electrically conductive bottom lead frame with a bottom plate mountable substantially parallel to, and in contact with, the substrate and an electrically conductive top lead frame having a top plate spaced apart from the bottom plate and a first transition portion having a first end connected to the top plate and a second end, opposite the first end, electrically connectable to the substrate. Multilayer capacitors are mounted between the top plate and the bottom plate. The capacitors have opposed end terminations electrically connected to the top and bottom plates, such that internal electrode plates are substantially nonparallel to the substrate.

Abstract translation: 可安装在基板上的电容器装置具有导电底部引线框架，其具有可安装为基本上平行于基板并与其接触的底板，以及导电顶部引线框架，其具有与底部间隔开的顶板 板和第一过渡部分，其具有连接到顶板的第一端和与第一端相对的第二端，其可电连接到基板。 多层电容器安装在顶板和底板之间。 电容器具有电连接到顶板和底板的相对端端，使得内部电极板基本上不平行于衬底。

公开(公告)号：US5305179A

公开(公告)日：1994-04-19

申请号：US899270

申请日：1992-06-16

Applicant: Michio Sono ,  Junichi Kasai ,  Kouji Saito ,  Kazuhiko Mitobe ,  Masanori Yoshimoto

Inventor： Michio Sono ,  Junichi Kasai ,  Kouji Saito ,  Kazuhiko Mitobe ,  Masanori Yoshimoto

IPC: H01L23/36 ,  H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49582 ,  H05K1/181 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10469 ,  H05K2201/1053 ,  H05K2201/10659 ,  Y02P70/611

Abstract: A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction. The heat sink part has a lower edge that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on a substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.

Abstract translation: 半导体器件包括安装在树脂封装主体中的半导体芯片。 多个互连引线沿其下边缘设置在树脂封装主体上并且从下边缘向外突出。 散热引线连接到树脂封装体，用于散发由半导体芯片产生的热量。 散热引线包括具有台部和散热部的导热材料板，其中台部保持在树脂封装主体的内部并且在其上支撑半导体芯片。 散热部从树脂封装主体向外突出并包括向下延伸的部分。 散热部分具有下边缘，该下边缘形成在与互连引线的外部引线部分基本齐平的水平面处，使得半导体器件通过互连引线的外部引线部分放置在基板上时被保持为直立，并且 通过散热片的下缘部分散热引线。

公开(公告)号：US5143277A

公开(公告)日：1992-09-01

申请号：US825068

申请日：1992-01-24

Applicant: Pascal Roche ,  Claude Courtin

Inventor： Pascal Roche ,  Claude Courtin

IPC: H01L23/50 ,  B23K20/02 ,  H01L21/603 ,  H05K1/00 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L24/80 ,  B23K20/023 ,  H05K13/0465 ,  H05K3/3421 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0393 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49135

Abstract: Disclosed is a method for the mounting, on an flexible substrate, of miniature electronic components of the beam lead type. Said method consists, after a first connection lead of a component has been soldered to the substrate, in arching each of the other connection leads of the component considered during their soldering by pressing the connection lead considered on a metallized zone of the substrate by means of a tip of a soldering tool while, at the same time, making a approaching movement towards the body of the component considered with this tip before carrying out the soldering operation itself. Through this mounting method, the beam lead electronic components are no longer placed flat against the substrate with their connection leads in an extended position but are arched on these leads. This gives them a freedom of play that enables them to absorb mechanical stresses by adopting positions of greater flatness or lesser flatness on the substrate.

Abstract translation: 公开了一种用于在柔性基板上安装光束引线型微型电子部件的方法。 所述方法包括：在将部件的第一连接引线焊接到基板之后，在焊接期间考虑的部件的其它连接引线中的每个连接引线，通过在基板的金属化区域上压制连接引线，借助于 同时在进行焊接操作本身之前同时朝向与该尖端相关的部件的主体接近移动。 通过这种安装方法，光束引线电子部件不再放置在基板的平面上，其连接引线处于延伸位置，而是在这些引线上拱起。 这使它们具有游戏自由度，使得它们能够通过采用更大的平坦度或更小平坦度的位置来吸收机械应力。

公开(公告)号：US4696105A

公开(公告)日：1987-09-29

申请号：US925849

申请日：1986-10-30

Applicant: Edward F. Breya

Inventor： Edward F. Breya

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/10469 ,  H05K2201/10492 ,  H05K2201/10651 ,  Y10T29/49144

Abstract: A method for mounting electrical components or wires having connections both on and off circuit boards is provided in which the component is machine inserted and flow soldered along with other parts. Leads to be connected off the board are inserted into dummy holes, i.e., holes having no metallic pads or plating, so that these leads are not bonded to the board during the flow solder process. In the final assembly stage, the unbonded leads are raised from the board and electrically and mechanically connected to a terminal of an off-board component.

Abstract translation: 提供了一种用于安装具有接通和断开电路板连接的电气部件或电线的方法，其中所述部件被机器插入并与其他部件一起流动焊接。 导线从板上连接插入虚拟孔，即没有金属焊盘或电镀的孔，使得这些引线在流焊过程中不粘合到板上。 在最终组装阶段，未连接的引线从板上升起并且电气和机械地连接到板外部件的端子。

公开(公告)号：JP4675379B2

公开(公告)日：2011-04-20

申请号：JP2007514192

申请日：2006-12-18

Applicant: 三菱電機株式会社

Inventor： 和憲 坂廼邊 ,  倫雄 山田 ,  仁 川口 ,  洋介 篠本

IPC: H02M7/48 ,  F24F1/06 ,  H02K5/22

CPC classification number: F24F1/12 ,  F24F1/22 ,  F24F1/24 ,  F24F1/46 ,  F24F2013/207 ,  H05K1/141 ,  H05K1/145 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10469 ,  H05K2201/2036

公开(公告)号：US09508639B2

公开(公告)日：2016-11-29

申请号：US14819755

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Hirotoshi Usui

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/36 ,  H05K1/18 ,  H01L23/00 ,  H01L23/467

CPC classification number: H01L23/49861 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/467 ,  H01L23/49555 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10469 ,  H05K2201/10757 ,  H05K2201/10795 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract translation: 封装在衬底中的衬底包括具有能够接触外部的表面的裸露焊盘; 布置在与所述裸露焊盘的表面相对的表面上的半导体芯片; 用于模制半导体芯片的模塑树脂; 以及从模制树脂的侧表面延伸并具有加工形状的前端部的引线框架。 引线框架的前端部被切割成具有相对于封装的顶表面由引线框架的延伸的直线形成的锐角的切割角。

公开(公告)号：US20100230152A1

公开(公告)日：2010-09-16

申请号：US12715586

申请日：2010-03-02

Applicant: Takahiro KITAGAWA

Inventor： Takahiro KITAGAWA

IPC: H05K1/16 ,  B23K31/02 ,  B23K1/20

CPC classification number: H05K3/341 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10969 ,  H05K2203/0415 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.

Abstract translation: 焊接电子部件的方法包括： 在印刷电路板的印刷电路板电极上提供焊料; 将电子部件放置在印刷电路板上，电子部件具有要安装在印刷电路板电极上的部件电极，其中部件支撑部件以热量熔融在其间; 并加热焊料和部件支撑部件。 电子部件通过部件支撑部件支撑在其一侧上，并且在其相对侧由印刷电路板支撑。

公开(公告)号：US07696001B2

公开(公告)日：2010-04-13

申请号：US11376446

申请日：2006-03-14

Applicant: Wolfgang Nuechter ,  Thomas Ruzicka ,  Manfred Spraul

Inventor： Wolfgang Nuechter ,  Thomas Ruzicka ,  Manfred Spraul

IPC: H01L21/00

CPC classification number: H05K3/3436 ,  B81C3/001 ,  B81C2203/035 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1181 ,  H01L2224/1182 ,  H01L2224/1403 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/09709 ,  H05K2201/10469 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for mounting semiconductor chips on a substrate using flip-chip technology and a corresponding assembly are provided, which method includes the steps of: a) providing a semiconductor chip having a component region including components and an edge region, a mounting region containing a plurality of bonding pads being situated in the edge region; b) providing a substrate having a surface including a plurality of lands; c) applying soldering material to the bonding pads and/or to the lands; d) positioning the semiconductor chip on the substrate; and e) melting the soldering material by a soldering process in such a way that the mounting region of the semiconductor chip is moved towards the substrate due to the surface tension of the melting soldering material, and the component region is lifted away from the substrate by the resulting rotation around an axis of rotation or a pivot between the two regions.

Abstract translation: 提供了一种使用倒装芯片技术和相应的组件将半导体芯片安装在基板上的方法，该方法包括以下步骤：a）提供具有包括部件和边缘区域的部件区域的半导体芯片， 多个接合焊盘位于边缘区域中; b）提供具有包括多个焊盘的表面的衬底; c）将焊接材料施加到焊盘和/或焊盘上; d）将半导体芯片定位在基板上; 以及e）通过焊接工艺熔化焊接材料，使得半导体芯片的安装区域由于熔融焊接材料的表面张力而向基板移动，并且通过以下方式将部件区域从基板提升离开基板： 围绕旋转轴线或两个区域之间的枢轴产生的旋转。

公开(公告)号：US07365957B2

公开(公告)日：2008-04-29

申请号：US11703171

申请日：2007-02-07

Applicant: Masaaki Togashi ,  Kentaro Ushioda

Inventor： Masaaki Togashi ,  Kentaro Ushioda

IPC: H01G4/228 ,  H01G2/20

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

Abstract translation: 陶瓷电容器包括陶瓷烧结体和形成在陶瓷烧结体的外表面上的第一和第二端电极。 第一端子电极通过第一金属端子电连接到形成在基板上的焊盘。 第一金属端子具有机械地连接到第一端子电极的第一电容器连接部分，机械地连接到焊盘的第一端子部分和将第一电容器连接部分和第一端子部分彼此电连接的第一中间部分。 第一金属端子的第一电容器连接部分平行于基板。

公开(公告)号：US07355504B2

公开(公告)日：2008-04-08

申请号：US10721478

申请日：2003-11-25

Applicant: Gregory A. Graves ,  Michael Zhang ,  Daniel Chandler ,  Chi-Ming Chan ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

Inventor： Gregory A. Graves ,  Michael Zhang ,  Daniel Chandler ,  Chi-Ming Chan ,  Shou-Mean Fang ,  Dennis Siden ,  Mark Thompson

IPC: H01C7/10

CPC classification number: H05K1/184 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49085 ,  Y10T29/49101 ,  Y10T29/49103

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. The cross-conductor permits connection to both electrodes from the same side of the device, and also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，所述装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可弹性变形的端子。 优选地，优选的装置包含两个层状电极，其间具有PTC元件，并且穿过该器件的厚度并且仅与两个电极中的一个接触的交叉导体。 交叉导体允许从设备的同一侧连接到两个电极，并且还使得可以在对应于多个单独设备的组件上执行用于准备这样的设备的步骤，将组件划分为 最后一步。