公开(公告)号：WO99060637A1

公开(公告)日：1999-11-25

申请号：PCT/JP1999/002537

申请日：1999-05-17

IPC: H01C1/14 ,  H01M2/34 ,  H01M6/50 ,  H01M10/42 ,  H01M10/48 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01M2/348 ,  H01C1/1406 ,  H01M10/4257 ,  H01M10/48 ,  H01M2200/10 ,  H01M2200/106 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A secondary cell protection circuit device comprising a PCB board, a PTC element integrally formed on the PCB board and a circuit provided on the board and adapted to control the voltage and current of a secondary cell; and a secondary cell assembly provided with the device. A PCB board (1) provided thereon with an electronic part (2) and a PTC element (3), wherein the PTC element (3) comprises a PTC material (6) sandwiched between upper and lower nickel foils (71, 72), an output electrode (4) disposed on the foil (71) and an output electrode (5) disposed under the foil and soldered to the PCB board (1).

Abstract translation: 一种二次电池保护电路装置，包括PCB板，一体地形成在PCB板上的PTC元件和设置在板上的适于控制二次电池的电压和电流的电路; 以及设置有该装置的二次电池组件。 其上设置有电子部件（2）和PTC元件（3）的PCB板（1），其中PTC元件（3）包括夹在上镍箔和下镍箔（71,72）之间的PTC材料（6） 布置在所述箔（71）上的输出电极（4）和布置在所述箔下方并焊接到所述PCB板（1）的输出电极（5）。

公开(公告)号：JP5122783B2

公开(公告)日：2013-01-16

申请号：JP2006265041

申请日：2006-09-28

Applicant: 三洋電機株式会社 ,  Fdk鳥取株式会社

Inventor： 知行 庄瀬 ,  勝之 喜田 ,  正雄 近藤 ,  泰夫 赤井

IPC: H01M2/02 ,  H01M2/10 ,  H01M2/30

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

公开(公告)号：JP4913277B2

公开(公告)日：2012-04-11

申请号：JP2000550157

申请日：1999-05-17

Applicant: タイコエレクトロニクスジャパン合同会社

Inventor： 隆 佐藤 ,  直文 宮坂 ,  貴司 蓮沼

IPC: H01M2/34 ,  H01C1/14 ,  H01C7/02 ,  H01M6/50 ,  H01M10/42 ,  H01M10/48 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01M2/348 ,  H01C1/1406 ,  H01M10/4257 ,  H01M10/48 ,  H01M2200/10 ,  H01M2200/106 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10643 ,  Y02P70/613

公开(公告)号：EP1620863B1

公开(公告)日：2012-03-07

申请号：EP04750897.3

申请日：2004-04-30

Applicant: TYCO Electronics Corporation

Inventor： BECKER, Paul, N. ,  MANIRAJ, Sirikhit ,  PINEDA, Martin, ,  VRANICAR, Anthony ,  YANKELLO, Francis, M. ,  WASILEWSKI, Frank

IPC: H05K3/34 ,  H01C1/144 ,  H01C1/14 ,  H01C1/016

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

公开(公告)号：EP1347470A1

公开(公告)日：2003-09-24

申请号：EP03076248.8

申请日：1993-07-08

Applicant: Tyco Electronics Corporation

Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming, Dept. Chem. Eng. ,  Fang, Shou-Mean

IPC: H01C1/14

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

(a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and
(b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element.
Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可以弹性变形的端子。

公开(公告)号：EP0649562B1

公开(公告)日：1998-03-04

申请号：EP93917069.2

申请日：1993-07-08

Applicant: RAYCHEM CORPORATION

Inventor： GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming Dep.of Chemical Engineering ,  FANG, Shou-Mean

IPC: H01C1/14 ,  H01C1/01 ,  H01C17/00 ,  H05K1/18

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

公开(公告)号：EP0303272A3

公开(公告)日：1990-05-09

申请号：EP88113075.1

申请日：1988-08-11

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Wehnelt, Ulrich, Dipl.-Phys.

IPC: H01L33/00 ,  H05K3/34 ,  H01L25/04

CPC classification number: H05K3/3442 ,  H01L23/4985 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/183 ,  H05K1/184 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2203/1105 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/00

Abstract: Es soll eine einfache automatisierbare und wärmestabile Halb­leiterkontaktierung für lineare und flächige SMD-Bauteile, ins­besondere LED-Anordnungen verwirklicht werden. Hierzu werden auf eine mit Leiterbahnen beschichtete Trägerfolie SMD-Bauteile auf­gesetzt, wobei die Leiterbahnen zur einfacheren Kontaktierung durch Aufschmelzen entweder ganz oder teilweise aus lötbarem Material bestehen.

公开(公告)号：EP0005265B1

公开(公告)日：1982-07-14

申请号：EP79101335.2

申请日：1979-05-02

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Schade, Reinhart

IPC: H05K3/00 ,  H05K3/30 ,  H01L41/04

CPC classification number: H01L24/33 ,  H01L24/83 ,  H01L41/29 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/202 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0382 ,  H05K2201/10287 ,  H05K2201/10643 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T156/1039 ,  H01L2924/3512 ,  H01L2924/00

公开(公告)号：EP2312917A1

公开(公告)日：2011-04-20

申请号：EP10182559.4

申请日：2010-09-29

Applicant: Wintec Industries, Inc.

Inventor： Chen, Kong-Chen

IPC: H05K1/02

CPC classification number: H05K1/111 ,  H01L23/64 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/181 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/086 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract translation: 公开了用于构造垂直配置的无源电子部件的制造技术。 电动无源部件构造成基本上垂直于包括第一平面的靶平台的结构，以提供更大的电极接触面积和更小的物理尺寸。 被构造为基本上垂直于与目标平台相关联的平面的被动部件可以直接连接到集成电路或基板的焊盘触点，或者可以嵌入封装中以减少被动部件的面积开销，同时提高 被动元件在其应用中。

公开(公告)号：EP0811993B1

公开(公告)日：2003-09-17

申请号：EP97202527.4

申请日：1993-07-08

Applicant: Tyco Electronics Corporation

Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming ,  Fang, Shou-Mean

IPC: H01C1/14 ,  H05K1/18

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613