公开(公告)号：US09706646B2

公开(公告)日：2017-07-11

申请号：US14761209

申请日：2014-01-15

Applicant: Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

Inventor： Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/42 ,  H01M6/40 ,  H01M6/42 ,  H01G11/78

CPC classification number: H05K1/028 ,  H01G11/78 ,  H01M2/204 ,  H01M6/40 ,  H01M6/42 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/425 ,  H05K1/0272 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2203/085 ,  H05K2203/087 ,  H05K2203/09 ,  H05K2203/1184 ,  H05K2203/302

Abstract: An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems having an adjustable size and/or shape. An operational device can be coupled to a planar substrate shaped and sized to correspond to a desired origami shape of an origami pattern. A plurality of planar substrates can be coupled together by a plurality of connection members that corresponds to one or more crease of the origami pattern. An array of planar substrates can be formed that convert into a three dimensional structure with origami shape. The resulting three-dimensional structure provides smaller projection area, higher portability and deformability.

公开(公告)号：US20170181277A1

公开(公告)日：2017-06-22

申请号：US15363579

申请日：2016-11-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOSHIHIRO TOMITA ,  KOICHI HIRANO ,  SUSUMU SAWADA ,  KOJI KAWAKITA ,  TAKASHI ICHIRYU ,  MASANORI NOMURA

IPC: H05K1/03 ,  H05K1/18

CPC classification number: H05K1/038 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/18 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2201/029 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

公开(公告)号：US20170165474A1

公开(公告)日：2017-06-15

申请号：US15357500

申请日：2016-11-21

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： Maurice S. Karpman ,  Andrew Meuller

IPC: A61N1/05 ,  H05K1/09 ,  A61N1/36 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/02

CPC classification number: A61N1/0502 ,  A61B5/04001 ,  A61B5/685 ,  A61B2562/043 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/36139 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/107

Abstract: The present disclosure describes a closely spaced array of penetrating electrodes. In some implementations, the electrodes of the array are spaced less than 50 μm apart. The present disclosure also describes methods for manufacturing the closely spaced array of penetrating electrodes. In some implementations, each row of electrode of the array is manufactured in-plane and then coupled to other rows of electrodes to form an array.

公开(公告)号：US09643002B2

公开(公告)日：2017-05-09

申请号：US13167074

申请日：2011-06-23

Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

IPC: A61N1/05 ,  A61N1/36 ,  H05K1/11 ,  H05K3/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.

公开(公告)号：US20170094774A1

公开(公告)日：2017-03-30

申请号：US14866614

申请日：2015-09-25

Applicant: Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

Inventor： Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K1/181 ,  H05K3/22 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/057 ,  H05K2201/09263 ,  H05K2201/095 ,  H05K2203/1316

Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.

公开(公告)号：US20160372244A1

公开(公告)日：2016-12-22

申请号：US15184626

申请日：2016-06-16

Applicant: Sensata Technologies, Inc.

Inventor： Janselme M. Eral ,  Richard R. Guerrero

IPC: H01F7/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01F7/0205 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09063 ,  Y02P70/611

Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.

Abstract translation: 柔性印刷电路可以包括柔性主体部分和柔性头端部分，其中导体和/或细长切口可以以图案形成。 柔性体可以包括近端和远端，其中近端构造成连接到静止物体，并且远端构造成连接到相对于静止物体移动的移动物体。 柔性印刷电路的头端可以位于柔性体的远端。 头端可以包括多个细长的切口，和/或多个电连接垫，通过多个细长的切口从柔性主体悬挂。

公开(公告)号：US09521748B1

公开(公告)日：2016-12-13

申请号：US14565267

申请日：2014-12-09

Applicant: Multek Technologies Ltd.

Inventor： Mark Bergman ,  Joan K. Vrtis

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/22

CPC classification number: H05K1/0271 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/144 ,  H05K1/148 ,  H05K3/22 ,  H05K3/4691 ,  H05K2201/0137 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09945 ,  H05K2201/0999 ,  H05K2201/2009

Abstract: Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of deposition in order to modify the stress concentration and profile of the circuit board and increase its overall strength. The material layer may be configured to modify the stress concentrations during bending away from the weak points in the assembly or to spread the stress during bending by increasing the radius of the bend curvature and therefore decreasing the chance of mechanical failure.

Abstract translation: 机械措施通过操纵应力集中的位置和/或强度或限制弯曲，扭转和拉伸来加强柔性电路板或可变形电子。 将材料层图案化到具有特定图案和沉积位置的柔性电路板上，以便改变电路板的应力集中和轮廓并增加其整体强度。 材料层可以被配置为在远离组件中的弱点的过程中修改弯曲期间的应力集中，或者通过增加弯曲曲率半径来扩展弯曲过程中的应力，从而降低机械故障的机会。

公开(公告)号：US20160351216A1

公开(公告)日：2016-12-01

申请号：US15234670

申请日：2016-08-11

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime ARAI

IPC: G11B5/48 ,  G11B5/127 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/18

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities, and further including a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Abstract translation: 包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬挂的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线， 并且还包括堆叠交错部分，其包括电连接到写入布线的各个线的部分，所述片段通过电绝缘层堆叠在并面对电线，使得所述相对的线和片段具有相反的极性。

公开(公告)号：US20160330843A1

公开(公告)日：2016-11-10

申请号：US15214611

申请日：2016-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Masaki KAWATA ,  Yuki ITO

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/32 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0285 ,  Y02P70/611

Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

Abstract translation: 模块部件包括：液晶聚合物树脂片的基板和通过超声波接合安装在基板上的电子部件，其中，所述电子部件包括多个第一基板连接电极，所述第一基板连接电极包括分别设置在基板安装面上的各平面导体 彼此连接并且以相同的电位或大致相同的电位连接，并且基板包括第一部件连接电极，其包括设置在部件加载表面上的平面导体，并且接合到多个第一基板连接电极。

公开(公告)号：US09426890B2

公开(公告)日：2016-08-23

申请号：US14474643

申请日：2014-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo Jae Jang ,  Chan Hong Park ,  Jeong Ho Bang ,  Jong Myung Lee ,  Sun Weon Jeong ,  Hyeong Sik Choi

IPC: G02F1/1345 ,  H05K1/14 ,  G06F1/16 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  G06F1/16 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10128

Abstract: Disclosed herein is a display apparatus that reduces a magnitude of a tension applied to a flexible PCB when a display panel is provided with a curved surface, and prevents damage of a driving chip. The display apparatus in accordance with exemplary embodiments includes a display panel configured to display an image, a source printed circuit board configured to control the display panel, and a flexible PCB that connects the display panel and the source printed circuit board. A length of at least one side edge of the flexible PCB is formed longer than a minimum length from the display panel to the source printed circuit board.

Abstract translation: 这里公开了一种显示装置，当显示面板设置有弯曲表面时，减小施加到柔性PCB的张力的大小，并且防止驱动芯片的损坏。 根据示例性实施例的显示装置包括被配置为显示图像的显示面板，被配置为控制显示面板的源印刷电路板以及连接显示面板和源印刷电路板的柔性PCB。 柔性PCB的至少一个侧边缘的长度形成为比从显示面板到源印刷电路板的最小长度更长。