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    Circuit module system and method
    31.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：AU2005203591A1

    公开(公告)日：2006-03-23

    申请号：AU2005203591

    申请日：2005-08-11

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    IPC: H05K1/02 ,  G11C5/00 ,  H01L23/538 ,  H01L25/10 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
    32.
    发明专利
    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD 未知

    公开(公告)号：AU2003304192A1

    公开(公告)日：2005-01-04

    申请号：AU2003304192

    申请日：2003-09-15

    Applicant: STAKTEK GROUP LP

    Inventor： WEHRLY JAMES DOUGLAS JR ,  BUCHLE JEFF ,  RAPPORT RUSSELL ,  CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L

    IPC: H01L21/44 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

    Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

    STACKED INTEGRATED CIRCUIT CASCADE SIGNALING SYSTEM AND METHOD
    33.
    发明申请
    STACKED INTEGRATED CIRCUIT CASCADE SIGNALING SYSTEM AND METHOD 审中-公开
    堆叠集成电路CASCADE信号系统和方法

    公开(公告)号：WO2006028693A3

    公开(公告)日：2009-09-03

    申请号：PCT/US2005029867

    申请日：2005-08-23

    Applicant: STAKTEK GROUP LP ,  CADY JAMES ,  RAPPORT RUSSELL ,  WILDER JAMES

    Inventor： CADY JAMES ,  RAPPORT RUSSELL ,  WILDER JAMES

    IPC: H01L23/02 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC classification number: H01L25/105 ,  H01L23/4985 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: Integrated circuits (ICs) are stacked into modules that conserve PCB or other board surface area. The modules provide for lower capacitance memory signaling systems and methods for connecting stacked CSPs in a serial cascade arrangement. In one preferred embodiment, on-die terminations are used selectively to terminate a cascaded series of conductive paths. In another preferred embodiment, a form standard provides a physical form that allows many of the varying package sizes found in a broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

    Abstract translation: 集成电路（IC）堆叠成可以节省PCB或其他板表面积的模块。 这些模块提供了较低电容存储器信号系统和用于以串联级联布置连接堆叠CSP的方法。 在一个优选实施例中，选择性地使用管芯端子来终止级联的导电路径。 在另一个优选实施例中，形式标准提供了一种物理形式，其允许在采用标准连接柔性电路设计的同时，在宽范围的CSP封装系列中发现许多变化的封装尺寸。

    CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS
    35.
    发明申请
    CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS 审中-公开
    具有热壳系统和方法的电路模块

    公开(公告)号：WO2006121487A3

    公开(公告)日：2007-11-22

    申请号：PCT/US2006007004

    申请日：2006-02-28

    Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  WOLFE MARK ,  GOODWIN PAUL

    Inventor： WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  WOLFE MARK ,  GOODWIN PAUL

    IPC: H01L23/34

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。 触点沿柔性电路分布，以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

    HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
    36.
    发明申请
    HIGH CAPACITY THIN MODULE SYSTEM AND METHOD 审中-公开
    高容量薄模块系统和方法

    公开(公告)号：WO2006121486A3

    公开(公告)日：2007-07-26

    申请号：PCT/US2006006921

    申请日：2006-02-28

    Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

    Inventor： WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

    IPC: H05K1/14

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路装有集成电路，沿其主要一侧或两侧布置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域 底物。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    CIRCUIT MODULE SYSTEM AND METHOD
    38.
    发明申请
    CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
    电路模块系统和方法

    公开(公告)号：WO2006028643A3

    公开(公告)日：2006-11-30

    申请号：PCT/US2005028547

    申请日：2005-08-10

    Applicant: STAKTEK GROUP LP ,  GOODWIN PAUL ,  CADY JAMES ,  WEHRLY JAMES DOUGLAS JR

    Inventor： GOODWIN PAUL ,  CADY JAMES ,  WEHRLY JAMES DOUGLAS JR

    IPC: H05K7/20 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: Flexible circuitry (12) is populated with integrated circuits (18), (ICs) disposed along one or both of its major sides. Contacts (20) distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate (14) thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

    Abstract translation: 柔性电路（12）中装有集成电路（18），（IC），沿其主要侧面或其两侧设置。 沿柔性电路分布的触点（20）提供与IC的连接。 优选地，柔性电路围绕刚性的导热基板（14）的边缘设置，从而将集成电路放置在基板的一侧或两侧上，在该基板的一侧或两侧上具有一层或两层集成电路 。 在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。 在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。 优选的衬底由导热材料构成。 预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

    SYSTEM COMPONENT INTERPOSER
    40.
    发明申请
    SYSTEM COMPONENT INTERPOSER 审中-公开
    系统组件插件

    公开(公告)号：WO2006121478A2

    公开(公告)日：2006-11-16

    申请号：PCT/US2006004676

    申请日：2006-02-09

    Applicant: STAKTEK GROUP LP ,  GOODWIN PAUL

    Inventor： GOODWIN PAUL

    IPC: H05K7/02

    CPC classification number: H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1572 ,  H05K2203/302 ,  H01L2224/0401

    Abstract: In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are mounted to the flexible circuit. Electrical connections between the main integrated circuit and the one or more integrated circuits are made on the flexible circuit. In other embodiments, a main integrated circuit such as, for example, a network processor, is mounted to a flexible circuit. Supporting integrated circuits, such as, for example, memory devices used by the network processor, are mounted on side portions of the flexible circuit. The side portions are folded to place the supporting integrated circuits higher than the main integrated circuit. Such placement may direct cooling airflow over the main integrated circuit's heat sink.

    Abstract translation: 在一些实施例中，提供了具有支撑柔性电路的支撑框架的高密度电路模块。 主要集成电路和一个或多个支持集成电路安装到柔性电路。 主集成电路和一个或多个集成电路之间的电连接在柔性电路上制成。 在其他实施例中，诸如网络处理器的主要集成电路安装到柔性电路。 支持集成电路，例如网络处理器使用的存储器件，安装在柔性电路的侧部上。 侧面部分被折叠以使支撑集成电路比主集成电路高。 这种放置可以引导主集成电路的散热器上的冷却气流。

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