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公开(公告)号：KR101022912B1
公开(公告)日：2011-03-17
申请号：KR1020080119895
申请日：2008-11-28
Applicant: 삼성전기주식회사
IPC: H05K3/40
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2203/0323 , H05K2203/0376 , Y02P70/611 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
Abstract: 본 발명은 금속범프를 갖는 인쇄회로기판 및 그 제조방법에 관한 것으로서, 보다 상세하게는 일정한 높이를 갖으며, 별도의 범프패드 없이 회로패턴에 직접 접속하기 때문에 미세한 피치로 형성될 수 있는 금속범프를 갖는 인쇄회로기판 및 그 제조방법에 관한 것이다.
금속범프, 캐리어 홈부, 범프-
公开(公告)号：KR1020100052216A
公开(公告)日：2010-05-19
申请号：KR1020080111140
申请日：2008-11-10
Applicant: 삼성전기주식회사
CPC classification number: H05K3/429 , H05K1/116 , H05K2201/09545
Abstract: PURPOSE: A landless printed circuit board and a manufacturing method thereof are provided to remove a pad for forming an additional solder bump by connecting the solder bump to a filled via connected to a buried pattern. CONSTITUTION: A first wire(104) is formed on a first insulation layer(102). A second insulation layer(106) is formed on the first insulation layer. A second wire(108) is buried in the second insulation layer. A filled via(118) connects the first wire with the second wire. One end of the filled via is connected to the upper side of the first wire. The other side of the filled via is connected to the second wire. The filled via has the same height as the surface of the second insulation layer.
Abstract translation: 目的：提供一种无地印刷电路板及其制造方法，通过将焊料凸块连接到与埋入图案相连的填充通孔中，去除用于形成附加焊料凸块的焊盘。 构成：第一导线（104）形成在第一绝缘层（102）上。 在第一绝缘层上形成第二绝缘层（106）。 第二导线（108）被埋在第二绝缘层中。 填充通孔（118）将第一导线与第二导线连接。 填充通孔的一端连接到第一线的上侧。 填充通孔的另一侧连接到第二线。 填充的通孔具有与第二绝缘层的表面相同的高度。
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公开(公告)号：KR100782403B1
公开(公告)日：2007-12-07
申请号：KR1020060104204
申请日：2006-10-25
Applicant: 삼성전기주식회사
IPC: H05K3/20
CPC classification number: H05K3/207 , H05K3/1258
Abstract: A method for manufacturing a circuit board is provided to improve flatness and easily emit heat by forming a circuit inside a substrate, to reduce the warpage of the substrate, and to improve the reliability of ion-migration between the adjacent circuits. A method for manufacturing a circuit board includes the steps of: forming a circuit pattern and a conductive embossed pattern corresponding to a cavity part on a transfer carrier(S100); transferring the conductive embossed pattern on an insulation substrate by compressing one side of the transfer carrier and one side of the insulation substrate to face each other(S200); removing the conductive embossed pattern transferred on the insulation substrate(S300); and planarizing the insulation substrate.
Abstract translation: 提供一种制造电路板的方法以通过在衬底内部形成电路来改善平坦度并容易地发热，以减少衬底的翘曲，并提高相邻电路之间的离子迁移的可靠性。 一种制造电路板的方法包括以下步骤：在转印载体上形成对应于空腔部分的电路图案和导电压纹图案（S100）; 通过将所述转印载体的一侧和所述绝缘基板的一侧相对地彼此面对，来将所述导电压纹图案转印到绝缘基板上（S200）。 去除在绝缘基板上转印的导电压纹图案（S300）; 并平坦化绝缘基板。
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公开(公告)号：KR100779061B1
公开(公告)日：2007-11-27
申请号：KR1020060103446
申请日：2006-10-24
Applicant: 삼성전기주식회사
IPC: H05K3/18
Abstract: A printed circuit board and a method for manufacturing the same are provided to prevent a peel-off phenomenon and to minimize a generation of a gap between a circuit pattern and an insulation substrate by an etching deviation in an etching process after removing a carrier plate. A method for manufacturing a printed circuit board includes the steps of: forming protrusively a circuit pattern on a surface plane of a carrier plate(S10); forming a seed layer by plating a surface of the carrier plate(S11); stacking a plating resist on the carrier plate(S12); forming an opening unit to expose a part of the carrier plate by removing selectively the plating resist corresponding to the circuit pattern(S14); forming the circuit pattern by growing a plating layer to cover a part of the plating resist and be charged in the opening unit(S16); removing the plating resist(S18); burying the circuit pattern on an insulation substrate by compressing the carrier plate on the insulation substrate(S20), wherein the circuit pattern has a cross section of an arrow head shape which is formed to be extended along a length direction.
Abstract translation: 提供印刷电路板及其制造方法，以防止剥离现象，并且在去除载体板之后通过蚀刻工艺中的蚀刻偏差最小化电路图案和绝缘基板之间的间隙的产生。 一种制造印刷电路板的方法包括以下步骤：在载板的表面平面上形成电路图案（S10）; 通过镀覆载体板的表面形成种子层（S11）; 在载板上层叠电镀抗蚀剂（S12）; 通过选择性地移除与电路图案相对应的电镀抗蚀剂，形成开口单元以暴露载体板的一部分（S14）; 通过生长电镀层以覆盖电镀抗蚀剂的一部分并在开口单元中充电来形成电路图案（S16）; 除去电镀抗蚀剂（S18）; 通过压缩绝缘基板上的承载板将电路图案埋入绝缘基板上（S20），其中电路图形具有形成为沿着长度方向延伸的箭头形状的横截面。
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公开(公告)号：KR100631846B1
公开(公告)日：2006-10-09
申请号：KR1020040079028
申请日：2004-10-05
Applicant: 삼성전기주식회사
Abstract: 본 발명은 BaTiO
3 분말의 표면에 나노 사이즈의 수산화칼슘염을 석출하고 이를 열처리하여 BaCaTiO
3 분말로 합성하는 티탄산바륨칼슘(BaCaTiO
3 ) 분말의 제조방법에 관한 것이다. 본 발명의 티탄산바륨칼슘 분말의 제조방법은, BaTiO
3 분말과 Ca염의 혼합수용액을 마련하는 단계,
상기 혼합수용액에서 BaTiO
3 분말의 표면에 수산화칼슘염을 석출하는 단계,
상기 혼합수용액으로부터 건조하여 얻은 분말을 하소하여 BaCaTiO
3 분말로 합성한 후 분쇄하는 단계를 포함하여 이루어진다. 본 발명에서는 또한, 티탄산바륨칼슘분말과 이 분말을 이용하는 적층세라믹커패시터 역시 제공된다.
티탄산바륨칼슘분말, 석출, 수산화칼슘, 적층세라믹커패시터, 우레아Abstract translation: 本发明涉及BaTiO
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Patent Agency Ranking
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37.发明公开박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 审中-实审薄膜电感线圈单元，薄膜电感线圈单元的制造方法，薄膜电感器及薄膜电感器的制造方法
公开(公告)号：KR1020160035819A
公开(公告)日：2016-04-01
申请号：KR1020140127618
申请日：2014-09-24
Applicant: 삼성전기주식회사
CPC classification number: H01F27/2804 , H01F41/042 , H01F2027/2809
Abstract: 본발명은박막인덕터용코일유닛, 박막인덕터용코일유닛의제조방법, 박막인덕터및 박막인덕터의제조방법에관한것이다. 본발명에따른박막인덕터용코일유닛은, 제1 및제2 절연층의이중의절연층을갖는절연재; 및상기절연재에내장형성되는복수의코일패턴;을포함하되, 상기코일패턴은, 적어도하나의코일패턴이나머지다른코일패턴과상이한두께를가진다.
Abstract translation: 本发明涉及一种用于考虑薄膜电感器的线圈单元，薄膜电感器的线圈单元的制造方法，薄膜电感器以及薄膜电感器的制造方法。 根据本发明，用于薄膜电感器的线圈单元包括：具有包括第一和第二绝缘层的双重绝缘层的绝缘材料; 以及形成在绝缘材料内的多个线圈图案。 与其他线圈图案相比，线圈图案中的至少一个具有不同的厚度。
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38.发明公开박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 审中-实审薄膜电感线圈单元，薄膜电感线圈单元的制造方法，薄膜电感器及薄膜电感器的制造方法
公开(公告)号：KR1020160004090A
公开(公告)日：2016-01-12
申请号：KR1020140082511
申请日：2014-07-02
Applicant: 삼성전기주식회사
CPC classification number: C25D7/00 , C25D5/022 , C25D5/10 , C25D5/12 , H01F17/0013 , H01F41/042
Abstract: 본발명은박막인덕터용코일유닛, 박막인덕터용코일유닛의제조방법, 박막인덕터및 박막인덕터의제조방법에관한것이다. 본발명에따른박막인덕터용코일유닛은, 절연재와코일패턴을포함하고, 상기코일패턴은, 상기절연재에내장형성되는내부도금층; 및상기절연재의상하면상에형성되되, 상기내부도금층상에형성되는성장도체층; 및상기절연재의상하면상에형성되되, 상기성장도체층을토대로도금성장시켜형성되는외부도금층;을포함한다.
Abstract translation: 本发明涉及一种用于薄膜电感器的线圈单元，一种制造用于薄膜电感器的线圈单元的方法，一种薄膜电感器以及该薄膜电感器的制造方法。 根据本发明，用于薄膜电感器的线圈单元包括绝缘材料和线圈图案。 线圈图案包括：嵌入绝缘材料中的内镀层; 生长导电层，形成在绝缘材料的顶表面和底表面上并形成在内镀层上; 以及通过基于生长导电层的电镀和生长形成在绝缘材料的顶表面和底表面上的外镀层。
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公开(公告)号：KR1020140067339A
公开(公告)日：2014-06-05
申请号：KR1020120134456
申请日：2012-11-26
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0298 , H05K1/113 , H05K3/0061 , H05K2201/0989
Abstract: The present invention relates to a printed circuit board and a manufacturing method for the same. The printed circuit board in accordance with the present invention includes a base board which performs a role of a base by being located in the center; a circuit individually formed on both sides of the base board in a predetermined pattern; a first insulation matter inserted into an open part between the circuits of the predetermined pattern at a fixed amount; and a second insulation matter which contains a carbon black composite and coats the upper surface of the circuit. The present invention forms a kind of a radiation black body as an insulation matter containing the carbon black composite between copper patterns formed on a PCB so that the present invention can improve radiation efficiency of the surface of the PCB.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 根据本发明的印刷电路板包括通过位于中心来执行基座的作用的基板; 以预定图案分别形成在基板的两侧上的电路; 以固定量插入到预定图案的电路之间的开放部分中的第一绝缘材料; 以及包含炭黑复合材料并涂覆电路的上表面的第二绝缘材料。 本发明形成一种作为绝缘物质的辐射黑体，其包含在PCB上形成的铜图案之间的炭黑复合物，从而本发明可以提高PCB表面的辐射效率。
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公开(公告)号：KR1020130045609A
公开(公告)日：2013-05-06
申请号：KR1020110109918
申请日：2011-10-26
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat dissipation efficiency. CONSTITUTION: A printed circuit board includes a base substrate(110) and a solder resist(121). The base substrate forms a via which connects a wiring pattern by penetrating insulation material after burying a wiring pattern and forms a connection pad in the wiring pattern. The solder resist exposes the wiring pattern and the connection pad. The solder resist covers the exposed parts of the via and insulation material. The surface of the wiring pattern is formed to be lower than the surface of the insulation material.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以提高散热效率。 构成：印刷电路板包括基底（110）和阻焊剂（121）。 基底基板形成通孔，该通孔在掩埋布线图案之后穿透绝缘材料并连接布线图案，并在布线图案中形成连接垫。 阻焊剂暴露了布线图案和连接垫。 阻焊剂覆盖通孔和绝缘材料的暴露部分。 布线图案的表面形成为低于绝缘材料的表面。
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